T. Standaert

2.2k citations

27 papers · 458 indexed · h-index 14

Electrical and Electronic Engineering top 10%
- Semiconductor materials and devices 21
- Advancements in Semiconductor Devices and Circuit Design 10
- Electronic Packaging and Soldering Technologies 7
- 3D IC and TSV technologies 4
- Silicon Carbide Semiconductor Technologies 3
- Advancements in Photolithography Techniques 2
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability 15
Atomic and Molecular Physics, and Optics
- Semiconductor materials and interfaces 3
Biomedical Engineering
Materials Chemistry

Co-authors: T. Yamashita V. Basker Nicholas A. Lanzillo T. Spooner Isaac Lauer Vamsi Paruchuri Mukesh Khare K. Motoyama
Cited by: Electrical and Electronic Engineering Electronic, Optical and Magnetic Materials Atomic and Molecular Physics, and Optics
Journals: IEEE Electron Device Letters (3 papers)ECS Journal of Solid State Science and Technology (1 paper)IEEE Transactions on Electromagnetic Compatibility (1 paper)
Partner nations: United States Germany Switzerland

In The Last Decade

T. Standaert

26 papers receiving 432 citations

Peers

Countries citing papers authored by T. Standaert

Since Specialization

Citations

This map shows the geographic impact of T. Standaert's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Standaert with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Standaert more than expected).

Fields of papers citing papers by T. Standaert

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Standaert. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Standaert. The network helps show where T. Standaert may publish in the future.

Co-authorship network

The 25 scholars most cited alongside T. Standaert, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with T. Standaert Line = papers co-authored together T. Standaert links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	Novel low k Dielectric materials for nano device interconnect technology S. Nguyen,H. Shobha,Amédée le Faure,Bernhard Lachenmayr,Yesabella Alejandra Pazos Cribillero,T. Nogami,E. Liniger,Sidney Cohen,Chunhua Hu,Huai Huang,文东,D. Canaperi,B. Peethala,T. Standaert,Griselda Bonilla	2020	2
2	CMP Development for Ru Liner Structures beyond 14nm ECS Journal of Solid State Science and Technology ·R. Patlolla,K. Motoyama,B. Peethala,T. Standaert,D. Canaperi,Nicole Saulnier	2018	12
3	Cobalt interconnect on same copper barrier process integration at the 7nm node Frank W. Mont,Evgeniya Zadvorneva,Wei Wang,James J. Kelly,T. Standaert,Ines Ben Hlima,E. Todd Ryan	2017	33
4	Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines T. Nogami,R. Patlolla,James J. Kelly,Linda Versea,Huai Huang,J. Demarest,Gulfia Shafkatovna Davletkulova,Robert Hengstebeck,Xingxing Zhang,G. Lian,B. Peethala,Prasad Bhosale,Rezky Ramdhany Senjaya,H. Shobha,S. Nguyen,P. McLaughlin,T. Standaert,D. Canaperi,D. Edelstein,Vamsi Paruchuri	2017	18
5	A Study of Tungsten Metallization for the Advanced BEOL Interconnections Qucosa - Monarch (Chemnitz University of Technology) ·Srinivasa Sevilimedu Veeravalli,Nancey GreenLeigh,T. Standaert,T. Spooner,Vamsi Paruchuri	2016	1
6	Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects ECS Meeting Abstracts ·Deepika Priyadarshini,S. Nguyen,H. Shobha,E. Todd Ryan,正宏浅野,Huai Huang,James Chen,E. Liniger,S. A. Cohen,Chihiro Hamaguchi Chihiro Hamaguchi,Anita Madan,Ellen Adams,S. Molis,Amédée le Faure,Griselda Bonilla,T. Standaert,D. Canaperi,A. Grill	2015	1
7	Hybridization of XRF/XPS and scatterometry for Cu CMP process control Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Jan M. Kaster,Bac Viet Thi Phung,Kwang-Hoon Kim,P. Recko,K. Motoyama,K.L. Chung,T. Standaert,John G. Gaudiello,Cindy Goldberg	2015	4
8	Interconnect performance and scaling strategy at 7 nm node Srinivasa Sevilimedu Veeravalli,T. Standaert,Emre Alptekin,T. Spooner,Vamsi Paruchuri	2014	31
9	Experimental analysis and modeling of self heating effect in dielectric isolated planar and fin devices Symposium on VLSI Technology ·Diana Novita Sari,R. Wachnik,Xu Mei,L. Wagner,J. Johnson,A. Chou,Arvind Kumar,Tosihide H. YOSIDA,T. Standaert,B. Greene,T. Yamashita,Karthik Balakrishnan,H. Bu,S. Springer,G. Freeman,W.K. Henson,E. Nowak	2013	30
10	Comprehensive study of effective current variability and MOSFET parameter correlations in 14nm multi-fin SOI FINFETs Meng Shu Wang,A. Bryant,Terence B. Hook,Chun-Chen Yeh,V. Kamineni,Jeffrey B. Johnson,Neeraj Tripathi,T. Yamashita,Gen Tsutsui,V. Basker,T. Standaert,J. Faltermeier,B. Haran,S. Kanakasabapathy,H. Bu,Scott Blumin,Tri Rina Budiwati,Mukesh Khare	2013	26
11	Fin width scaling for improved short channel control and performance in aggressively scaled channel length SOI finFETs Abhijeet Paul,Chun-Chen Yeh,T. Standaert,Jeffrey B. Johnson,A. Bryant,Neeraj Tripathi,Gen Tsutsui,Zohar Bloom-Ackerman,V. Basker,Yi-Ching Hsu,Jin Cho,Huiming Bu,Mukesh Khare	2013	1
12	Channel doping impact on FinFETs for 22nm and beyond Abdorreza Mohammadi Nafchi,Ferdinando Cardone,Robert J. Miller,Terence B. Hook,A. Bryant,Wilfried Haensch,P. Oldiges,Isaac Lauer,T. Yamashita,V. Basker,T. Standaert,K. Rim,E. Leobandung,H. Bu,Mukesh Khare	2012	52
13	Modeling of width-quantization-induced variations in logic FinFETs for 22nm and beyond Symposium on VLSI Technology ·Chung-Hsun Lin,Wilfried Haensch,Phil Oldiges,Hailing Wang,R. Williams,Josephine Chang,Michael Guillorn,A. Bryant,Zohar Bloom-Ackerman,T. Standaert,Huiming Bu,E. Leobandung,Mukesh Khare	2011	22
14	Analysis of parasitic resistance in double gate FinFETs with different fin lengths 真砂子菅原,K. Maitra,Chun-Chen Yeh,P. Zeitzoff,M. Raymond,P. Kulkarni,K. Suntinger,T. Yamashita,V. Basker,T. Standaert,S. Samavedam,H. Bu,Granda Abad	2011	6
15	High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·M.V. Vaisero,Zixue Guo,T. Standaert,John G. Gaudiello,Meng Mao,Hong Xiao,Wei Fang,Xu Zhang,Fei Wang,M. A. Khalleefah,Yan Zhao,肖万里	2011	5
16	Evaluation of Cu CMP Barrier Slurries for Ultra Low-k dielectric film (k~2.4) for 45nm technology Feng Zhao,Laertis Economikos,Wei‐Tsu Tseng,Karin Kristoffersen,Noemi M. Fernandez,T. Standaert,Imani Fairweather‐Morrison,Wu Ping Liu,Nurul Wakidah,川波宏輔,Sujatha Sankaran	2011	3
17	Aggressively Scaled Strained-Silicon-on-Insulator Undoped-Body High- $\kappa$/Metal-Gate nFinFETs for High-Performance Logic Applications IEEE Electron Device Letters ·K. Maitra,A. Khakifirooz,T.G. Pearce,Veeraraghavan Basker,J. Faltermeier,Hemanth Jagannathan,Hemant Adhikari,Chun-Chen Yeh,N. Klymko,K. L. Saenger,T. Standaert,Robert J. Miller,B. Doris,Vamsi Paruchuri,Y-C Gu,James P. O’Neil,Eka Musdalifah Sari Ekai,Huiming Bu	2011	19
18	Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect Technologies IEEE Transactions on Electromagnetic Compatibility ·A. Deutsch,Hari Das,Kathleen L. Melde,C.W. Surovic,G. Katopis,G.V. Kopcsay,Zhen Zhou,Zhaoqing Chen,Young Kwark,Ju-Rang Shin,Xiaoxiong Gu,T. Standaert	2010	14
19	Performance and reliability of airgaps for advanced BEOL Interconnects S. Nitta,D. Edelstein,S. Ponoth,L. A. Clevenger,X. Liu,T. Standaert	2008	14
20	Characterization, Modeling and Extraction of Cu Wire Resistance for 65 nm Technology Edmundo Bianchi,M. Angyal,Amit Kumar Thakur,V. McGahay,T. Standaert	2007	2

About T. Standaert

T. Standaert is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Surfaces, Coatings and Films, having authored 27 papers that have together received 458 indexed citations. Recurring topics across this work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (15 papers), Advancements in Semiconductor Devices and Circuit Design (10 papers), Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers), Semiconductor materials and interfaces (3 papers), Silicon Carbide Semiconductor Technologies (3 papers) and Advancements in Photolithography Techniques (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (426 citations), Electronic, Optical and Magnetic Materials (134 citations) and Atomic and Molecular Physics, and Optics (58 citations). T. Standaert has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include T. Yamashita, V. Basker, Nicholas A. Lanzillo, T. Spooner, Isaac Lauer, Vamsi Paruchuri, Mukesh Khare, K. Motoyama, H. Bu and J. Faltermeier. Their work appears in journals such as IEEE Electron Device Letters, ECS Journal of Solid State Science and Technology, IEEE Transactions on Electromagnetic Compatibility, Applied Physics Letters and Journal of Applied Physics.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact