D. Canaperi

1.2k total citations
45 papers, 677 citations indexed

About

D. Canaperi is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, D. Canaperi has authored 45 papers receiving a total of 677 indexed citations (citations by other indexed papers that have themselves been cited), including 45 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 9 papers in Biomedical Engineering. Recurrent topics in D. Canaperi's work include Semiconductor materials and devices (31 papers), Copper Interconnects and Reliability (23 papers) and Integrated Circuits and Semiconductor Failure Analysis (13 papers). D. Canaperi is often cited by papers focused on Semiconductor materials and devices (31 papers), Copper Interconnects and Reliability (23 papers) and Integrated Circuits and Semiconductor Failure Analysis (13 papers). D. Canaperi collaborates with scholars based in United States, Switzerland and Germany. D. Canaperi's co-authors include Steven J. Koester, J. O. Chu, H.‐S. Philip Wong, C. D’Emic, Ron Anderson, R. Patlolla, E. Liniger, Lida Huang, Soon‐Cheon Seo and Sharon L. Smith and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

D. Canaperi

43 papers receiving 628 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
D. Canaperi United States	13	599	235	151	116	85	45	677
M. Fayolle France	13	356 0.6×	165 0.7×	130 0.9×	68 0.6×	214 2.5×	41	505
Y. Morand France	16	690 1.2×	95 0.4×	191 1.3×	106 0.9×	102 1.2×	72	741
T. Spooner United States	13	412 0.7×	312 1.3×	64 0.4×	109 0.9×	83 1.0×	49	472
M. Hoshino Japan	13	672 1.1×	109 0.5×	122 0.8×	236 2.0×	131 1.5×	36	762
W. Cote United States	8	334 0.6×	170 0.7×	118 0.8×	49 0.4×	71 0.8×	15	411
Christine Hau-Riege United States	13	526 0.9×	444 1.9×	36 0.2×	62 0.5×	76 0.9×	29	583
Hideki Kitada Japan	12	469 0.8×	96 0.4×	141 0.9×	67 0.6×	44 0.5×	61	534
L.J. Tang Singapore	11	349 0.6×	89 0.4×	103 0.7×	71 0.6×	172 2.0×	32	434
Ahila Krishnamoorthy Singapore	15	597 1.0×	462 2.0×	63 0.4×	82 0.7×	79 0.9×	41	641
M. Rivoire France	14	397 0.7×	184 0.8×	96 0.6×	163 1.4×	74 0.9×	47	552

Countries citing papers authored by D. Canaperi

Since Specialization

Citations

This map shows the geographic impact of D. Canaperi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Canaperi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Canaperi more than expected).

Fields of papers citing papers by D. Canaperi

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Canaperi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Canaperi. The network helps show where D. Canaperi may publish in the future.

Co-authorship network of co-authors of D. Canaperi

This figure shows the co-authorship network connecting the top 25 collaborators of D. Canaperi. A scholar is included among the top collaborators of D. Canaperi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Canaperi. D. Canaperi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Tseng, Wei‐Tsu, et al.. (2024). Post Tungsten CMP Cleaning: Optimization for Cleaning Efficiency and Corrosion Reduction. ECS Journal of Solid State Science and Technology. 13(11). 114004–114004. 2 indexed citations

Tseng, Wei‐Tsu, et al.. (2021). CMP Defect Reduction and Mitigation: Practices and Future Trends. 1–6. 4 indexed citations

Nguyen, S., H. Shobha, T. Nogami, et al.. (2020). Novel low k Dielectric materials for nano device interconnect technology. 11306. 117–118. 2 indexed citations

Patlolla, R., K. Motoyama, B. Peethala, et al.. (2018). CMP Development for Ru Liner Structures beyond 14nm. ECS Journal of Solid State Science and Technology. 7(8). P397–P401. 12 indexed citations

Carr, Adra, B. Peethala, M. Raymond, et al.. (2017). Impact of surface preparation for n-type Si:P and p-type SiGe:B semiconductors on low resistance silicide contacts. Microelectronic Engineering. 173. 22–26. 7 indexed citations

Nguyen, S., Sidney Cohen, T. M. Shaw, et al.. (2017). Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect. ECS Journal of Solid State Science and Technology. 6(7). P429–P434. 9 indexed citations

Nguyen, S., et al.. (2017). BEOL Dielectric Processing for Cu-Low k Nano Interconnect- Impact of Plasma CVD Initial Transient Phenomena (ITP). ECS Transactions. 75(33). 5–13. 1 indexed citations

Peethala, B., Frank W. Mont, S. Molis, et al.. (2016). Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures. Microelectronic Engineering. 161. 98–103. 4 indexed citations

Huang, Huai, R. Patlolla, Wei Wang, et al.. (2016). Ruthenium interconnect resistivity and reliability at 48 nm pitch. 31–33. 38 indexed citations

10.

Priyadarshini, Deepika, S. Nguyen, H. Shobha, et al.. (2015). Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects. ECS Meeting Abstracts. MA2015-02(18). 824–824. 1 indexed citations

11.

Kelly, James J., C. Surisetty, & D. Canaperi. (2012). Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization. Comptes Rendus Chimie. 16(1). 15–20. 4 indexed citations

12.

Spooner, T., John Arnold, D. Canaperi, et al.. (2009). The Effect of Material and Process Interactions on BEOL Integration. ECS Transactions. 25(7). 279–289. 8 indexed citations

13.

Koester, Steven J., K. L. Saenger, J. O. Chu, et al.. (2005). Laterally scaled Si-Si/sub 0.7/Ge/sub 0.3/ n-MODFETs with f/sub max/>200 GHz and low operating bias. IEEE Electron Device Letters. 26(3). 178–180. 9 indexed citations

14.

Koester, Steven J., K. L. Saenger, J. O. Chu, et al.. (2005). Improved DC and RF performance in Si/SiGe n-MODFETs with ion-implanted buried p-well doping. IEEE Electron Device Letters. 26(11). 817–819. 1 indexed citations

15.

Rim, K., K. Chan, L. Shi, et al.. (2004). Fabrication and mobility characteristics of ultra-thin strained Si directly on insulator (SSDOI) MOSFETs. 3.1.1–3.1.4. 103 indexed citations

16.

Hu, Chunhua, D. Canaperi, Lynne Gignac, et al.. (2004). Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects. 222–228. 37 indexed citations

17.

Koester, Steven J., K. L. Saenger, J. O. Chu, et al.. (2004). Laterally-scaled Si/SiGe n-MODFETs with in situ and ion-implanted p-well doping. 107–108. 2 indexed citations

18.

Canaperi, D., et al.. (2004). CVD Rhenium and PVD Tantalum Gate MOSFETs Fabricated With a Replacement Technique. IEEE Electron Device Letters. 25(12). 775–777. 3 indexed citations

19.

Hu, C.‐K., Lynne Gignac, R. Rosenberg, et al.. (2004). Atom motion of Cu and Co in Cu damascene lines with a CoWP cap. Applied Physics Letters. 84(24). 4986–4988. 35 indexed citations

20.

Chu, J. O., C. D’Emic, Steven J. Koester, et al.. (2002). Electron and hole mobility enhancement in strained SOI by wafer bonding. IEEE Transactions on Electron Devices. 49(9). 1566–1571. 43 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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