N. Klymko

839 total citations
25 papers, 422 citations indexed

About

N. Klymko is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, N. Klymko has authored 25 papers receiving a total of 422 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 5 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in N. Klymko's work include Semiconductor materials and devices (17 papers), Advancements in Semiconductor Devices and Circuit Design (8 papers) and Copper Interconnects and Reliability (5 papers). N. Klymko is often cited by papers focused on Semiconductor materials and devices (17 papers), Advancements in Semiconductor Devices and Circuit Design (8 papers) and Copper Interconnects and Reliability (5 papers). N. Klymko collaborates with scholars based in United States, France and Taiwan. N. Klymko's co-authors include S. Nunes, R. Flitsch, J. Paraszczak, Da‐Yuan Shih, R. Hull, Eugene A. Fitzgerald, D.A. Antoniadis, Judy L. Hoyt, Minjoo Larry Lee and Dalaver H. Anjum and has published in prestigious journals such as Applied Physics Letters, IEEE Transactions on Electron Devices and IEEE Electron Device Letters.

In The Last Decade

N. Klymko

25 papers receiving 401 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
N. Klymko United States 11 364 113 77 69 46 25 422
S. Escoubas France 11 281 0.8× 136 1.2× 127 1.6× 84 1.2× 17 0.4× 42 371
Emil V. Jelenković Hong Kong 11 344 0.9× 137 1.2× 223 2.9× 94 1.4× 50 1.1× 40 466
W. Zhang Belgium 8 276 0.8× 68 0.6× 61 0.8× 63 0.9× 50 1.1× 14 354
K. Reimann Netherlands 12 252 0.7× 157 1.4× 111 1.4× 53 0.8× 12 0.3× 28 333
M.J. Kim United States 9 207 0.6× 69 0.6× 108 1.4× 32 0.5× 31 0.7× 15 313
P. Nagarkar United States 7 149 0.4× 53 0.5× 109 1.4× 73 1.1× 33 0.7× 14 260
Werner Frammelsberger Germany 10 263 0.7× 79 0.7× 185 2.4× 161 2.3× 25 0.5× 28 389
Ole Lühn Belgium 9 447 1.2× 71 0.6× 90 1.2× 111 1.6× 24 0.5× 18 475
Pavel Dutta United States 12 278 0.8× 147 1.3× 130 1.7× 68 1.0× 8 0.2× 38 351
Thierry Mourier France 9 359 1.0× 94 0.8× 50 0.6× 41 0.6× 29 0.6× 49 405

Countries citing papers authored by N. Klymko

Since Specialization
Citations

This map shows the geographic impact of N. Klymko's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Klymko with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Klymko more than expected).

Fields of papers citing papers by N. Klymko

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Klymko. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Klymko. The network helps show where N. Klymko may publish in the future.

Co-authorship network of co-authors of N. Klymko

This figure shows the co-authorship network connecting the top 25 collaborators of N. Klymko. A scholar is included among the top collaborators of N. Klymko based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Klymko. N. Klymko is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lavoie, C., Ahmet S. Özcan, F.H. Baumann, et al.. (2014). Challenges of nickel silicidation in CMOS technologies. Microelectronic Engineering. 137. 79–87. 45 indexed citations
2.
Chen, Kuan‐Neng, Fei Liu, Chun‐An Cheng, et al.. (2012). Cu-based bonding technology for 3D integration applications. 95. 1–4. 1 indexed citations
3.
Maitra, K., A. Khakifirooz, Veeraraghavan Basker, et al.. (2011). Aggressively Scaled Strained-Silicon-on-Insulator Undoped-Body High- $\kappa$/Metal-Gate nFinFETs for High-Performance Logic Applications. IEEE Electron Device Letters. 32(6). 713–715. 19 indexed citations
4.
Wakil, J., Patrick W. DeHaven, N. Klymko, & Shaochen Chen. (2011). Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models. Journal of Electronic Packaging. 133(3). 6 indexed citations
5.
Nguyen, S., T. M. Shaw, S. Molis, et al.. (2010). Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation. ECS Transactions. 33(12). 137–145. 3 indexed citations
6.
Belyansky, Michael, et al.. (2009). Strain characterization: techniques and applications. Solid State Technology. 52(2). 26–29. 11 indexed citations
7.
Nguyen, S., A. Grill, S. A. Cohen, et al.. (2009). Plasma Deposition and Development of Ultralow-k Bilayer SiCNx/SiCNy Dielectric Cu Cap for 32 nm CMOS Devices. ECS Meeting Abstracts. MA2009-02(26). 2159–2159. 2 indexed citations
8.
Belyansky, Michael, M. A. Chace, Oleg Gluschenkov, et al.. (2008). Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 26(3). 517–521. 26 indexed citations
9.
Tseng, Wei‐Tsu, D. Kioussis, Hyunki Kim, et al.. (2008). Evaluation of Barrier CMP Slurries and Characterization of ULK Material Properties Shifts Due to CMP. ECS Transactions. 13(2). 293–306. 3 indexed citations
10.
Nguyen, S., Mark Sherwood, N. Klymko, et al.. (2008). Lightly Porous SiCOH 2.7 Dielectric Film Development for 65/45/32 nm Advanced Nanoelectronic CMOS Devices. ECS Meeting Abstracts. MA2008-02(28). 2076–2076. 1 indexed citations
11.
Yu, R., R. Polastre, L. Shi, et al.. (2006). Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding. Symposium on VLSI Technology. 170–171. 5 indexed citations
12.
Madan, Anita, N. Klymko, Jinghong Li, et al.. (2006). Systematic Characterization of Pseudomorphic (110) Intrinsic SiGe Epitaxial Films for Hybrid Orientation Technology with Embedded SiGe Source/Drain. MRS Proceedings. 913. 2 indexed citations
13.
Yang, Min, J. Holt, Siddhartha Panda, et al.. (2005). Investigation of CMOS devices with embedded sige source/drain on hybrid orientation substrates. 28–29. 20 indexed citations
14.
Rim, K., K. Chan, L. Shi, et al.. (2004). Fabrication and mobility characteristics of ultra-thin strained Si directly on insulator (SSDOI) MOSFETs. 3.1.1–3.1.4. 103 indexed citations
15.
Xia, Guangrui, Hasan M. Nayfeh, Minjoo Larry Lee, et al.. (2004). Impact of Ion Implantation Damage and Thermal Budget on Mobility Enhancement in Strained-Si N-Channel MOSFETs. IEEE Transactions on Electron Devices. 51(12). 2136–2144. 17 indexed citations
16.
Chléirigh, Cáit Ní, Minjoo Larry Lee, Arthur J. Pitera, et al.. (2003). Fabrication of ultra-thin strained silicon on insulator. Journal of Electronic Materials. 32(9). 972–975. 21 indexed citations
17.
Chléirigh, Cáit Ní, Minjoo Larry Lee, Arthur J. Pitera, et al.. (2003). Effect of rapid thermal annealing on strain in ultrathin strained silicon on insulator layers. Applied Physics Letters. 83(5). 875–877. 35 indexed citations
18.
Whitley, Andrew, et al.. (2001). <title>Use of a high-dispersion spectrograph for optimized visible and UV Raman measurements on semiconductor materials</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4469. 47–56. 1 indexed citations
19.
Shih, Da‐Yuan, N. Klymko, R. Flitsch, J. Paraszczak, & S. Nunes. (1991). Oxygen induced adhesion degradation at metal/polyimide interface. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 9(6). 2963–2974. 45 indexed citations
20.
Paraszczak, J., N. Klymko, R. Flitsch, et al.. (1989). A study of the chemical and physical interaction between copper and polyimide. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 7(3). 1402–1412. 37 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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