G. Lian

793 citations

17 papers · 481 indexed · h-index 10

Impact in

Structural Biology
Electrical and Electronic Engineering top 10%
- Semiconductor materials and devices
- Advancements in Battery Materials
- Advancements in Semiconductor Devices and Circuit Design

Papers in

Structural Biology 2
Surfaces, Coatings and Films 3
- Electron and X-Ray Spectroscopy Techniques 3

Co-authors: Elizabeth C. Dickey Mahendra K. Sunkara Rodolfo Miranda Shashank Sharma D. Ferrer Luigi Colombo Babak Fallahazad Seyoung Kim
Journals: Microscopy and Microanalysis (3 papers)Applied Physics Letters (2 papers)ACS Applied Energy Materials (1 paper)IEEE Electron Device Letters (1 paper)Electronics (1 paper)
Partner nations: United States United Kingdom China

In The Last Decade

G. Lian

15 papers receiving 459 citations

Peers

Countries citing papers authored by G. Lian

Since Specialization

Citations

This map shows the geographic impact of G. Lian's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Lian with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Lian more than expected).

Fields of papers citing papers by G. Lian

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Lian. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Lian. The network helps show where G. Lian may publish in the future.

Co-authorship network

The 25 scholars most cited alongside G. Lian, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with G. Lian Line = papers co-authored together G. Lian links everyone, so they are left out of the graph.

All Works

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17 of 17 papers shown

#	Work
1	Switch Open-Circuit Fault Diagnosis of the Vienna Rectifier Using the Transformer–BiTCN Network with Improved Snow Geese Algorithm Optimization Electronics ·Yaping Deng, Hao Jia, G. Lian, Xiaofeng Wang, Yannan Liu	2025	0
2	Effect of carbon blacks on electrical conduction and conductive binder domain of next-generation lithium-ion batteries Journal of Power Sources ·Xuesong Lu, G. Lian, James F. Parker, Ruihuan Ge, Milan K. Sadan, Rachel M. Smith, Denis Cumming	2023	51
3	Microstructure of Conductive Binder Domain for Electrical Conduction in Next‐Generation Lithium‐Ion Batteries Energy Technology ·Xuesong Lu, G. Lian, Ruihuan Ge, James F. Parker, Milan K. Sadan, Rachel M. Smith, Denis Cumming	2023	2
4	Co, Ni-Free Ultrathick Free-Standing Dry Electrodes for Sustainable Lithium-Ion Batteries ACS Applied Energy Materials ·Milan K. Sadan, G. Lian, Rachel M. Smith, Denis Cumming	2023	15
5	Mechanisms of Electromigration Damage in Cu Interconnects Chunhua Hu, L. Gignac, G. Lian, C. Cabral, K. Motoyama, H. Shobha, J. Demarest, Santanu Chacraverti, Chris Breslin, Rahul Sima, J. Benedict, P. McLaughlin, Maiara Felippe Moraes, Xing‐Wen Fan	2018	19
6	Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines T. Nogami, R. Patlolla, James J. Kelly, Linda Versea, Huai Huang, J. Demarest, Gulfia Shafkatovna Davletkulova, Robert Hengstebeck, Xingxing Zhang, G. Lian, B. Peethala, Prasad Bhosale, Rezky Ramdhany Senjaya, H. Shobha, S. Nguyen, P. McLaughlin, T. Standaert, D. Canaperi, D. Edelstein, Vamsi Paruchuri	2017	18
7	Line Resistance Reduction in Advanced Copper Interconnects IEEE Electron Device Letters ·C.-C. Yang, 川田昭孝, Huai Huang, Rahul Sima, G. Lian, D. Edelstein, Griselda Bonilla	2017	5
8	Microstructure modulation for resistance reduction in copper interconnects C.-C. Yang, T. Spooner, P. McLaughlin, Chao Hu, Huai Huang, Yann Mignot, Rahul Sima, G. Lian, Ines Ben Hlima, 川田昭孝, D. Edelstein	2017	12
9	Application of Low Energy Broad Ion Beam Milling to Improve the Quality of FIB Prepared TEM Samples Microscopy and Microanalysis ·N. N. Belozerova, Stephen Mick, C. B. Vartuli, Jinwook Chung, G. Lian	2013	1
10	Scaling of Al2O3 dielectric for graphene field-effect transistors Applied Physics Letters ·Babak Fallahazad, Kayoung Lee, G. Lian, Seyoung Kim, Chris M. Corbet, D. Ferrer, Luigi Colombo, Emanuel Tutuc	2012	107
11	Ferromagnetism in Mn-implanted epitaxially grown Ge on Si(100) Physical Review B ·Samaresh Guchhait, Gao Yanfeng, Hendrik Ohldag, Apurva Mehta, Elke Arenholz, G. Lian, 忠康岩田, D. Ferrer, J. T. Markert, Luigi Colombo, Sanjay K. Banerjee	2011	9
12	Comparison of convergent beam electron diffraction and geometric phase analysis for strain measurement in a strained silicon device Journal of Microscopy ·David R. Diercks, G. Lian, Jaehak Chung, Michael J. Kaufman	2010	15
13	Local Lattice Strain Measurement using Geometric Phase Analysis of Annular Dark Field Images from Scanning Transmission Electron Microscopy Microscopy and Microanalysis ·Jaehak Chung, G. Lian, L. Rabenberg	2010	0
14	Challenging Analysis for the Gate Stack and Strained Channel of the Advanced CMOS Microscopy and Microanalysis ·G. Lian, C. B. Vartuli, Jaehak Chung	2008	1
15	Temperature dependence of the work function of ruthenium-based gate electrodes Thin Solid Films ·Husam N. Alshareef, H.C. Wen, H.F. Luan, Kwang‐Il Choi, H. R. Harris, Y. Senzaki, P. Majhi, Kock H. H., Brendan Foran, G. Lian	2006	12
16	Bulk synthesis of silicon nanowires using a low-temperature vapor–liquid–solid method Applied Physics Letters ·Mahendra K. Sunkara, Shashank Sharma, Rodolfo Miranda, G. Lian, Elizabeth C. Dickey	2001	213
17	Metalorganic Chemical Vapor Deposition of Ruthenium-Doped Diamond like Carbon Films NASA Technical Reports Server (NASA) ·Mahendra K. Sunkara, LS Boggia, G. Lian, Elizabeth C. Dickey	2001	1

About G. Lian

G. Lian is a scholar working on Structural Biology, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Automotive Engineering, having authored 17 papers that have together received 481 indexed citations. Recurring topics across this work include Semiconductor materials and devices (5 papers), Copper Interconnects and Reliability (4 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Electronic Packaging and Soldering Technologies (3 papers), Advancements in Battery Materials (3 papers), Electron and X-Ray Spectroscopy Techniques (3 papers), Force Microscopy Techniques and Applications (2 papers) and Graphene research and applications (2 papers). The work is most often cited by research in Structural Biology (9 citations), Electrical and Electronic Engineering (334 citations), Electronic, Optical and Magnetic Materials (93 citations), Materials Chemistry (231 citations) and Biomedical Engineering (187 citations). G. Lian has collaborated with scholars based in United States, United Kingdom and China. Frequent co-authors include Elizabeth C. Dickey, Mahendra K. Sunkara, Rodolfo Miranda, Shashank Sharma, D. Ferrer, Luigi Colombo, Babak Fallahazad, Seyoung Kim, Kayoung Lee and Emanuel Tutuc. Their work appears in journals such as Microscopy and Microanalysis, Applied Physics Letters, ACS Applied Energy Materials, IEEE Electron Device Letters and Electronics.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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