E. Liniger

3.8k total citations · 1 hit paper
80 papers, 3.0k citations indexed

About

E. Liniger is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, E. Liniger has authored 80 papers receiving a total of 3.0k indexed citations (citations by other indexed papers that have themselves been cited), including 61 papers in Electrical and Electronic Engineering, 60 papers in Electronic, Optical and Magnetic Materials and 19 papers in Mechanics of Materials. Recurrent topics in E. Liniger's work include Copper Interconnects and Reliability (59 papers), Semiconductor materials and devices (43 papers) and Electronic Packaging and Soldering Technologies (22 papers). E. Liniger is often cited by papers focused on Copper Interconnects and Reliability (59 papers), Semiconductor materials and devices (43 papers) and Electronic Packaging and Soldering Technologies (22 papers). E. Liniger collaborates with scholars based in United States, Germany and Japan. E. Liniger's co-authors include George Y. Onoda, J. R. Lloyd, M.D. Thouless, John W. Hutchinson, Robert F. Cook, T. M. Shaw, Michael Lane, C.‐K. Hu, Lynne Gignac and R. Rosenberg and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

E. Liniger

77 papers receiving 2.9k citations

Hit Papers

Random loose packings of uniform spheres and the dilatanc... 1990 2026 2002 2014 1990 100 200 300 400

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
E. Liniger United States 23 1.6k 1.3k 957 755 423 80 3.0k
Richard P. Vinci United States 26 1.2k 0.7× 681 0.5× 840 0.9× 939 1.2× 356 0.8× 94 2.6k
G. C. A. M. Janssen Netherlands 26 1.2k 0.7× 641 0.5× 1.7k 1.7× 1.4k 1.9× 1.2k 2.8× 122 3.5k
Yu.N. Makarov Russia 32 1.6k 1.0× 805 0.6× 1.3k 1.4× 354 0.5× 474 1.1× 162 3.1k
Pascal Brault France 35 1.7k 1.1× 325 0.2× 1.8k 1.9× 658 0.9× 408 1.0× 176 3.8k
Jerrold A. Floro United States 27 1.3k 0.8× 541 0.4× 1.2k 1.3× 703 0.9× 457 1.1× 89 2.7k
J. C. Bravman United States 36 2.0k 1.2× 1.7k 1.3× 1.7k 1.8× 1.5k 2.0× 814 1.9× 163 4.7k
С. А. Кукушкін Russia 22 1.4k 0.9× 349 0.3× 1.4k 1.4× 356 0.5× 480 1.1× 309 2.7k
Benedetto Bozzini Italy 34 2.6k 1.6× 626 0.5× 1.8k 1.8× 239 0.3× 378 0.9× 297 4.6k
B. Window Australia 27 823 0.5× 711 0.5× 1.1k 1.1× 1.0k 1.3× 201 0.5× 84 2.7k
Paul P. Budenstein United States 11 1.4k 0.9× 412 0.3× 1.1k 1.1× 487 0.6× 434 1.0× 26 2.5k

Countries citing papers authored by E. Liniger

Since Specialization
Citations

This map shows the geographic impact of E. Liniger's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Liniger with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Liniger more than expected).

Fields of papers citing papers by E. Liniger

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Liniger. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Liniger. The network helps show where E. Liniger may publish in the future.

Co-authorship network of co-authors of E. Liniger

This figure shows the co-authorship network connecting the top 25 collaborators of E. Liniger. A scholar is included among the top collaborators of E. Liniger based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. Liniger. E. Liniger is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Nguyen, S., H. Shobha, T. Nogami, et al.. (2020). Novel low k Dielectric materials for nano device interconnect technology. 11306. 117–118. 2 indexed citations
2.
Nguyen, S., Sidney Cohen, T. M. Shaw, et al.. (2017). Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect. ECS Journal of Solid State Science and Technology. 6(7). P429–P434. 9 indexed citations
3.
Priyadarshini, Deepika, S. Nguyen, H. Shobha, et al.. (2015). Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects. ECS Meeting Abstracts. MA2015-02(18). 824–824. 1 indexed citations
4.
Liniger, E., S. A. Cohen, & Griselda Bonilla. (2014). Low-field TDDB reliability data to enable accurate lifetime predictions. 14 indexed citations
5.
Lin, Qinghuang, Alshakim Nelson, Luisa Bozano, et al.. (2011). Extending photo-patternable low-κ concept to 193nm lithography and e-beam lithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7972. 79721A–79721A. 3 indexed citations
6.
Lin, Qinghuang, Alshakim Nelson, P. J. Brock, et al.. (2010). Multilevel integration of patternable low-κ material into advanced Cu BEOL. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7639. 76390J–76390J. 2 indexed citations
7.
Edelstein, D., Kaushik Chanda, E. Liniger, et al.. (2009). Integration and reliability of CVD Ru cap for Cu/Low-k development. 255–257. 3 indexed citations
8.
McLaughlin, P., Lynne Gignac, E. Liniger, et al.. (2008). Enhanced Electromigration in Cu Interconnects Using Upper Level Dummy Vias. ECS Meeting Abstracts. MA2008-02(28). 2071–2071. 1 indexed citations
9.
Gignac, L., et al.. (2007). Electromigration Reliability in Nanoscale Cu Interconnects. MRS Proceedings. 1036. 1 indexed citations
10.
Ryan, E. Todd, Jeremy I. Martin, Griselda Bonilla, et al.. (2007). Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface. Journal of The Electrochemical Society. 154(7). H604–H604. 6 indexed citations
11.
Liniger, E., et al.. (2006). Effect of oxygen at the Cu–SiCxNy interface on electromigration performance of interconnect structures. Thin Solid Films. 513(1-2). 295–299. 7 indexed citations
12.
Lloyd, J. R., Conal E. Murray, S. Ponoth, Sidney Cohen, & E. Liniger. (2006). The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. Microelectronics Reliability. 46(9-11). 1643–1647. 39 indexed citations
13.
Lloyd, J. R., Michael Lane, E. Liniger, et al.. (2005). Electromigration and adhesion. IEEE Transactions on Device and Materials Reliability. 5(1). 113–118. 64 indexed citations
14.
Hu, Chunhua, D. Canaperi, Lynne Gignac, et al.. (2004). Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects. 222–228. 37 indexed citations
15.
Gignac, Lynne, et al.. (2003). Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects. Microelectronic Engineering. 70(2-4). 398–405. 8 indexed citations
16.
Lane, Michael, E. Liniger, & J. R. Lloyd. (2003). Relationship between interfacial adhesion and electromigration in Cu metallization. Journal of Applied Physics. 93(3). 1417–1421. 226 indexed citations
17.
Cook, Robert F., E. Liniger, D. Klaus, E. Simonyi, & S. A. Cohen. (1998). Properties Development During Curing of Low Dielectric-Constant Spin-On Glasses. MRS Proceedings. 511. 14 indexed citations
18.
Hedrick, J. L., R. Miller, Do‐Young Yoon, et al.. (1997). Polymeric Organic−Inorganic Hybrid Nanocomposites:  Preparation of Polyimide-Modified Poly(silsesquioxane) Using Functionalized Poly(amic acid alkyl ester) Precursors. Macromolecules. 30(26). 8512–8515. 60 indexed citations
19.
Thouless, M.D., Henrik Myhre Jensen, & E. Liniger. (1994). Delamination from edge flaws. Proceedings of the Royal Society of London Series A Mathematical and Physical Sciences. 447(1930). 271–279. 27 indexed citations
20.
Cook, Robert F. & E. Liniger. (1993). Kinetics of Indentation Cracking in Glass. Journal of the American Ceramic Society. 76(5). 1096–1105. 84 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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