T. Nogami

1.2k citations

51 papers · 722 indexed · h-index 14

Co-authors: D. Edelstein Alvin L. S. Loke S.S. Wong Changsup Ryu C.-C. Yang Valery M. Dubin James J. Kelly Kee-Won Kwon
Topics: Copper Interconnects and Reliability (38 papers)Semiconductor materials and devices (23 papers)Electronic Packaging and Soldering Technologies (15 papers)
Cited by: Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Mechanics of Materials
Journals: Journal of Applied Physics Journal of The Electrochemical Society IEEE Transactions on Electron Devices
Partner nations: United States Japan Germany

In The Last Decade

T. Nogami

47 papers receiving 679 citations

Peers

Countries citing papers authored by T. Nogami

Since Specialization

Citations

This map shows the geographic impact of T. Nogami's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Nogami with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Nogami more than expected).

Fields of papers citing papers by T. Nogami

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Nogami. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Nogami. The network helps show where T. Nogami may publish in the future.

Co-authorship network of co-authors of T. Nogami

This figure shows the co-authorship network connecting the top 25 collaborators of T. Nogami. A scholar is included among the top collaborators of T. Nogami based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Nogami. T. Nogami is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology 2024 ·D. Edelstein,S. Nguyen,Huai Huang,Amod Jog,(unknown),Sabyasachi Ghosh,Nicholas A. Lanzillo,Maria José Lo Faro,(unknown),(unknown),(unknown),Yann Mignot,T. Nogami,Florian Ion Tiberiu Petrescu,(unknown),(unknown),A. Simon,Linda Wangoh,Han Zhang	0
2	Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams 2023 ·Journal of Applied Physics ·Akira Uedono,T. Nogami,Oleg Gluschenkov,(unknown),(unknown),Toshiyuki Tabata,(unknown),(unknown),Ian Brown,(unknown)	2
3	Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects 2022 ·2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ·T. Nogami,Oleg Gluschenkov,(unknown),Son T. Nguyen,B. Peethala,Huai Huang,H. Shobha,Nicholas A. Lanzillo,R. Patlolla,Devika Sil,Andrew Simon,D. Edelstein,Nelson Felix,Junjun Liu,Toshiyuki Tabata,Fulvio Mazzamuto,(unknown),(unknown),(unknown),Akira Uedono	6
4	Novel low k Dielectric materials for nano device interconnect technology 2020 ·S. Nguyen,H. Shobha,(unknown),(unknown),(unknown),T. Nogami,E. Liniger,Sidney Cohen,Chunhua Hu,Huai Huang,(unknown),D. Canaperi,B. Peethala,T. Standaert,Griselda Bonilla	2
5	Overview of interconnect technology for 7nm node and beyond - New materials and technologies to extend Cu and to enable alternative conductors (invited) 2019 ·T. Nogami	13
6	Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications 2017 ·ECS Transactions ·Xiaoxuan Sun,B. Peethala,Marinus Hopstaken,(unknown),P. McLaughlin,O. van der Straten,J. Demarest,K. Motoyama,T. Nogami,(unknown),(unknown),James J. Kelly	2
7	Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines 2017 ·T. Nogami,R. Patlolla,James J. Kelly,(unknown),Huai Huang,J. Demarest,(unknown),Robert Hengstebeck,Xingxing Zhang,G. Lian,B. Peethala,Prasad Bhosale,(unknown),H. Shobha,S. Nguyen,P. McLaughlin,T. Standaert,D. Canaperi,D. Edelstein,Vamsi Paruchuri	18
8	Experimental study of nanoscale Co damascene BEOL interconnect structures 2016 ·James J. Kelly,(unknown),Huai Huang,C.‐K. Hu,E. Liniger,R. Patlolla,B. Peethala,Praneet Adusumilli,H. Shobha,T. Nogami,T. Spooner,E. Huang,D. Edelstein,D. Canaperi,V. Kamineni,Frank W. Mont,S. Siddiqui	43
9	Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers 2014 ·ECS Transactions ·James J. Kelly,(unknown),T. Nogami,O. van der Straten,J. Demarest,Juntao Li,Richard Murphy,(unknown),(unknown),C. Parks,Patrick W. DeHaven,Anita Madan,D. Edelstein	2
10	CVD and ALD Co(W) Films Using Amidinato Precursors as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects 2013 ·ECS Journal of Solid State Science and Technology ·(unknown),(unknown),T. Nogami,Nobuo Tajima,Takeshi Momose,Yoshihiko Kobayashi,Yukihiro Shimogaki	15
11	Electromigration comparison of selective CVD cobalt capping with PVD Ta(N) and CVD cobalt liners on 22nm-groundrule dual-damascene Cu interconnects 2013 ·A. Simon,T. Bolom,Chunping Niu,F.H. Baumann,Chunhua Hu,C. Parks,Joyeeta Nag,(unknown),(unknown),C.-C. Yang,S. Nguyen,H. Shobha,T. Nogami,(unknown),Xuejun Ren,(unknown),Joseph F. AuBuchon	31
12	Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects 2012 ·ECS Transactions ·James J. Kelly,T. Nogami,O. van der Straten,J. Demarest,Juntao Li,(unknown),(unknown),Christopher Parks,Patrick W. DeHaven,(unknown),E. Liniger	2
13	Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects 2010 ·IEEE Electron Device Letters ·C.-C. Yang,Sidney Cohen,T. M. Shaw,(unknown),T. Nogami,D. Edelstein	69
14	Structural Analysis of the Fundamental Polymer of the Sheath Constructed bySphaerotilus natans 2007 ·Bioscience Biotechnology and Biochemistry ·Minoru Takeda,Yohei Miyanoiri,T. Nogami,Kanae Oda,Tatsuya Saito,Katsuya Kato,Jun‐ichi Koizumi,Masato Katahira	8
15	ANALYSIS OF STREAM CHANNEL GEOMETRY AND PHYSIOGRAPHIC FORMATIVE PROCESS IN VALLEY FLATS 2007 ·PROCEEDINGS OF HYDRAULIC ENGINEERING ·T. Nogami,Yasuharu WATANABE,Hiroyasu Yasuda,(unknown)	0
16	QUANTITATIVE CLASSIFICATION OF TOPOGRAPHICAL FEATURES OF STEEP-STREAM RIVERBEDS 2003 ·PROCEEDINGS OF HYDRAULIC ENGINEERING ·T. Nogami,Yasuharu WATANABE,(unknown)	0
17	New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization 2003 ·(unknown),(unknown),(unknown),(unknown),(unknown),Susumu Sato,(unknown),Y. Segawa,Masatou Ishihara,(unknown),T. Nogami	1
18	Microstructure and reliability of copper interconnects 1999 ·IEEE Transactions on Electron Devices ·Changsup Ryu,Kee-Won Kwon,Alvin L. S. Loke,(unknown),T. Nogami,Valery M. Dubin,(unknown),G.W. Ray,S.S. Wong	139
19	Suppressed Si precipitation at an AlSi/Si contact by the presence of thin SiO₂film on the Si substrate 1994 ·Semiconductor Science and Technology ·T. Nogami,(unknown),(unknown),(unknown),Osamu Haida	3
20	Electromigration lifetime as a function of line length or step number 1992 ·T. Nogami,(unknown),(unknown),(unknown),Chihiro Maeda,Osamu Haida	3

About T. Nogami

T. Nogami is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Music, having authored 51 papers that have together received 722 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (38 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (15 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (430 citations), Electrical and Electronic Engineering (562 citations) and Mechanics of Materials (127 citations). T. Nogami has collaborated with scholars based in United States, Japan and Germany. Frequent co-authors include D. Edelstein, Alvin L. S. Loke, S.S. Wong, Changsup Ryu, C.-C. Yang, Valery M. Dubin, James J. Kelly, Kee-Won Kwon, G.W. Ray and T. Spooner. Their work appears in journals such as Journal of Applied Physics, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices.

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