T. Nogami

1.2k total citations
51 papers, 722 citations indexed

About

T. Nogami is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Ecology. According to data from OpenAlex, T. Nogami has authored 51 papers receiving a total of 722 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electronic, Optical and Magnetic Materials, 37 papers in Electrical and Electronic Engineering and 5 papers in Ecology. Recurrent topics in T. Nogami's work include Copper Interconnects and Reliability (38 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (15 papers). T. Nogami is often cited by papers focused on Copper Interconnects and Reliability (38 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (15 papers). T. Nogami collaborates with scholars based in United States, Japan and Germany. T. Nogami's co-authors include D. Edelstein, Alvin L. S. Loke, S.S. Wong, Changsup Ryu, C.-C. Yang, Valery M. Dubin, James J. Kelly, Kee-Won Kwon, G.W. Ray and T. Spooner and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices.

In The Last Decade

T. Nogami

47 papers receiving 679 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
T. Nogami United States 14 562 430 136 127 102 51 722
Lucas A. Berla United States 6 560 1.0× 152 0.4× 130 1.0× 202 1.6× 139 1.4× 7 815
A. Béré France 12 291 0.5× 94 0.2× 294 2.2× 284 2.2× 92 0.9× 56 685
Chen Qiu China 12 144 0.3× 72 0.2× 194 1.4× 136 1.1× 77 0.8× 28 555
Yanming Guo China 14 123 0.2× 116 0.3× 125 0.9× 50 0.4× 60 0.6× 46 497
Stephan Merzsch Germany 17 523 0.9× 187 0.4× 282 2.1× 56 0.4× 367 3.6× 42 975
S. N. Kallaev Russia 12 73 0.1× 212 0.5× 251 1.8× 107 0.8× 19 0.2× 61 440
Svetlana Dligatch Australia 13 145 0.3× 52 0.1× 211 1.6× 48 0.4× 50 0.5× 27 435
Haibo Su China 9 183 0.3× 243 0.6× 83 0.6× 66 0.5× 5 0.0× 27 454
Shuang Luo China 13 114 0.2× 73 0.2× 183 1.3× 59 0.5× 34 0.3× 36 468

Countries citing papers authored by T. Nogami

Since Specialization
Citations

This map shows the geographic impact of T. Nogami's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Nogami with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Nogami more than expected).

Fields of papers citing papers by T. Nogami

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Nogami. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Nogami. The network helps show where T. Nogami may publish in the future.

Co-authorship network of co-authors of T. Nogami

This figure shows the co-authorship network connecting the top 25 collaborators of T. Nogami. A scholar is included among the top collaborators of T. Nogami based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Nogami. T. Nogami is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Edelstein, D., S. Nguyen, Huai Huang, et al.. (2024). The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology. 1–4.
2.
Uedono, Akira, et al.. (2023). Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams. Journal of Applied Physics. 134(13). 2 indexed citations
3.
Nogami, T., Oleg Gluschenkov, Son T. Nguyen, et al.. (2022). Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). 423–424. 6 indexed citations
4.
Nguyen, S., H. Shobha, T. Nogami, et al.. (2020). Novel low k Dielectric materials for nano device interconnect technology. 11306. 117–118. 2 indexed citations
5.
6.
Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Transactions. 80(4). 297–309. 2 indexed citations
7.
Nogami, T., R. Patlolla, James J. Kelly, et al.. (2017). Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines. 1–3. 18 indexed citations
8.
Kelly, James J., Huai Huang, C.‐K. Hu, et al.. (2016). Experimental study of nanoscale Co damascene BEOL interconnect structures. 40–42. 43 indexed citations
9.
Kelly, James J., T. Nogami, O. van der Straten, et al.. (2014). Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers. ECS Transactions. 58(17). 17–28. 2 indexed citations
10.
Nogami, T., et al.. (2013). CVD and ALD Co(W) Films Using Amidinato Precursors as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects. ECS Journal of Solid State Science and Technology. 2(7). P311–P315. 15 indexed citations
11.
12.
Kelly, James J., T. Nogami, O. van der Straten, et al.. (2012). Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects. ECS Transactions. 41(43). 23–33. 2 indexed citations
13.
Yang, C.-C., et al.. (2010). Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects. IEEE Electron Device Letters. 31(7). 722–724. 69 indexed citations
14.
Takeda, Minoru, Yohei Miyanoiri, T. Nogami, et al.. (2007). Structural Analysis of the Fundamental Polymer of the Sheath Constructed bySphaerotilus natans. Bioscience Biotechnology and Biochemistry. 71(12). 2992–2998. 8 indexed citations
15.
Nogami, T., et al.. (2007). ANALYSIS OF STREAM CHANNEL GEOMETRY AND PHYSIOGRAPHIC FORMATIVE PROCESS IN VALLEY FLATS. PROCEEDINGS OF HYDRAULIC ENGINEERING. 51. 991–996.
16.
Nogami, T., et al.. (2003). QUANTITATIVE CLASSIFICATION OF TOPOGRAPHICAL FEATURES OF STEEP-STREAM RIVERBEDS. PROCEEDINGS OF HYDRAULIC ENGINEERING. 47. 1087–1092.
17.
Sato, Susumu, et al.. (2003). New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization. 145. 194–196. 1 indexed citations
18.
Ryu, Changsup, Kee-Won Kwon, Alvin L. S. Loke, et al.. (1999). Microstructure and reliability of copper interconnects. IEEE Transactions on Electron Devices. 46(6). 1113–1120. 139 indexed citations
19.
Nogami, T., et al.. (1994). Suppressed Si precipitation at an AlSi/Si contact by the presence of thin SiO2film on the Si substrate. Semiconductor Science and Technology. 9(11). 2138–2143. 3 indexed citations
20.
Nogami, T., et al.. (1992). Electromigration lifetime as a function of line length or step number. 366–372. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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