Wilfried Haensch
About
In The Last Decade
Wilfried Haensch
143 papers receiving 7.7k citations
Hit Papers
Peers
Comparison fields: 5 of 92
- Electrical and Electronic Engineering 6.3k
- Materials Chemistry 2.9k
- Biomedical Engineering 2.0k
- Atomic and Molecular Physics, and Optics 897
- Hardware and Architecture 595
Countries citing papers authored by Wilfried Haensch
This map shows the geographic impact of Wilfried Haensch's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wilfried Haensch with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wilfried Haensch more than expected).
Fields of papers citing papers by Wilfried Haensch
This network shows the impact of papers produced by Wilfried Haensch. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wilfried Haensch. The network helps show where Wilfried Haensch may publish in the future.
Co-authorship network of co-authors of Wilfried Haensch
This figure shows the co-authorship network connecting the top 25 collaborators of Wilfried Haensch. A scholar is included among the top collaborators of Wilfried Haensch based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wilfried Haensch. Wilfried Haensch is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 17 | |
| 2 | 3 | |
| 3 | 11 | |
| 4 | 7 | |
| 5 | 33 | |
| 6 | 5 | |
| 7 | 124 | |
| 8 | 181 | |
| 9 | 404 | |
| 10 | 1 | |
| 11 | 13 | |
| 12 | 254 | |
| 13 | 2 | |
| 14 | Modeling of width-quantization-induced variations in logic FinFETs for 22nm and beyond | 22 |
| 15 | Scaling of SOI FinFETs down to fin width of 4 nm for the 10nm technology node | 11 |
| 16 | 88 | |
| 17 | 4 | |
| 18 | Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding | 5 |
| 19 | 198 | |
| 20 | 27 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.