T. Spooner

1.3k total citations
49 papers, 472 citations indexed

About

T. Spooner is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, T. Spooner has authored 49 papers receiving a total of 472 indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Electrical and Electronic Engineering, 42 papers in Electronic, Optical and Magnetic Materials and 11 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in T. Spooner's work include Copper Interconnects and Reliability (42 papers), Semiconductor materials and devices (34 papers) and Electronic Packaging and Soldering Technologies (17 papers). T. Spooner is often cited by papers focused on Copper Interconnects and Reliability (42 papers), Semiconductor materials and devices (34 papers) and Electronic Packaging and Soldering Technologies (17 papers). T. Spooner collaborates with scholars based in United States, Japan and Ireland. T. Spooner's co-authors include D. Edelstein, T. Nogami, James J. Kelly, Huai Huang, Linlin Zhao, Xingxing Zhang, Meng‐Dong He, T. Standaert, H. Shobha and Griselda Bonilla and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Physics D Applied Physics.

In The Last Decade

T. Spooner

44 papers receiving 444 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
T. Spooner United States 13 412 312 109 83 76 49 472
M. Angyal United States 10 379 0.9× 238 0.8× 64 0.6× 72 0.9× 44 0.6× 28 456
Jing‐Cheng Lin Taiwan 10 308 0.7× 171 0.5× 42 0.4× 102 1.2× 177 2.3× 17 402
Jeff Gambino United States 10 310 0.8× 108 0.3× 60 0.6× 62 0.7× 27 0.4× 59 344
James G. Ryan United States 10 224 0.5× 142 0.5× 66 0.6× 117 1.4× 82 1.1× 25 352
D. Canaperi United States 13 599 1.5× 235 0.8× 116 1.1× 85 1.0× 70 0.9× 45 677
M. Fayolle France 13 356 0.9× 165 0.5× 68 0.6× 214 2.6× 64 0.8× 41 505
Ahila Krishnamoorthy Singapore 15 597 1.4× 462 1.5× 82 0.8× 79 1.0× 86 1.1× 41 641
Christine Hau-Riege United States 13 526 1.3× 444 1.4× 62 0.6× 76 0.9× 75 1.0× 29 583
Gayle Murdoch Belgium 11 296 0.7× 131 0.4× 64 0.6× 69 0.8× 34 0.4× 39 346
Chen Wu Belgium 11 391 0.9× 290 0.9× 79 0.7× 93 1.1× 73 1.0× 37 460

Countries citing papers authored by T. Spooner

Since Specialization
Citations

This map shows the geographic impact of T. Spooner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Spooner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Spooner more than expected).

Fields of papers citing papers by T. Spooner

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Spooner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Spooner. The network helps show where T. Spooner may publish in the future.

Co-authorship network of co-authors of T. Spooner

This figure shows the co-authorship network connecting the top 25 collaborators of T. Spooner. A scholar is included among the top collaborators of T. Spooner based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Spooner. T. Spooner is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Peethala, B., Devika Sil, Nicholas A. Lanzillo, et al.. (2021). Metal Wet Recess Challenges and Solutions for beyond 7nm Fully Aligned Via Integration. 1–3. 1 indexed citations
2.
Lanzillo, Nicholas A., K. Motoyama, Huai Huang, Robert R. Robison, & T. Spooner. (2020). Via resistance and reliability trends in copper interconnects with ultra-scaled barrier layers. Applied Physics Letters. 116(16). 12 indexed citations
3.
Ghosh, Somnath, et al.. (2020). A Study of Metal on Metal Multiple Patterning Scheme. 52. 25–27. 2 indexed citations
4.
Motoyama, K., O. van der Straten, K. Cheng, et al.. (2020). Co-doped Ru liners for highly reliable Cu interconnects with selective Co cap. 13–15. 6 indexed citations
5.
Kelly, James J., Huai Huang, C.‐K. Hu, et al.. (2016). Experimental study of nanoscale Co damascene BEOL interconnect structures. 40–42. 43 indexed citations
6.
Yang, C.-C., T. Spooner, P. McLaughlin, et al.. (2016). Pre-liner dielectric nitridation for resistance reduction in copper interconnects. 89–91. 4 indexed citations
7.
Ando, Takashi, E. Cartier, P. Jamison, et al.. (2016). CMOS compatible MIM decoupling capacitor with reliable sub-nm EOT high-k stacks for the 7 nm node and beyond. 11 indexed citations
8.
Huang, Huai, R. Patlolla, Wei Wang, et al.. (2016). Ruthenium interconnect resistivity and reliability at 48 nm pitch. 31–33. 38 indexed citations
9.
Standaert, T., et al.. (2016). A Study of Tungsten Metallization for the Advanced BEOL Interconnections. Qucosa - Monarch (Chemnitz University of Technology). 1 indexed citations
10.
Nguyen, S., A. Grill, S. A. Cohen, et al.. (2012). Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices. ECS Transactions. 41(43). 3–9. 4 indexed citations
11.
Shimada, Keita, Shao‐Tuan Chen, H. Shobha, et al.. (2012). 56nm-pitch low-k/Cu dual-damascene interconnects integration with sidewall image transfer (SIT) patterning scheme. 7972. 1–3. 1 indexed citations
12.
Lin, Qinghuang, Alshakim Nelson, Luisa Bozano, et al.. (2011). Extending photo-patternable low-κ concept to 193nm lithography and e-beam lithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7972. 79721A–79721A. 3 indexed citations
13.
Ogino, Atsushi, et al.. (2011). Moisture Uptake Impact on Damage Layer of Porous Low-k Film in 80nm-Pitched Cu Interconnects. ECS Transactions. 41(7). 405–413. 5 indexed citations
14.
Shobha, H., Anita Madan, Richard J. Murphy, et al.. (2011). Improvement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner. 8 5. 1–3. 2 indexed citations
15.
Lin, Qinghuang, Alshakim Nelson, P. J. Brock, et al.. (2010). Multilevel integration of patternable low-κ material into advanced Cu BEOL. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7639. 76390J–76390J. 2 indexed citations
16.
Spooner, T., John Arnold, D. Canaperi, et al.. (2009). The Effect of Material and Process Interactions on BEOL Integration. ECS Transactions. 25(7). 279–289. 8 indexed citations
17.
Wang, Pei‐I, et al.. (2008). Conduction Mechanisms of Ta/Porous SiCOH Films under Electrical Bias. Journal of The Electrochemical Society. 155(12). G283–G283. 21 indexed citations
18.
Ryan, E. Todd, Jeremy I. Martin, Griselda Bonilla, et al.. (2007). Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface. Journal of The Electrochemical Society. 154(7). H604–H604. 6 indexed citations
19.
Iijima, Takashi, Qinghuang Lin, Catherine B. Labelle, et al.. (2006). BEOL Integration of Highly Damage -Resistant Porous Ultra Low-K Material Using Direct CMP and Via-first Process. 21–23. 4 indexed citations
20.
Edelstein, D., A. Cowley, J. Gill, et al.. (2005). Extendibility of PVD barrier/seed for BEOL Cu metallization. 135–137. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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