M. Angyal

854 total citations
28 papers, 456 citations indexed

About

M. Angyal is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, M. Angyal has authored 28 papers receiving a total of 456 indexed citations (citations by other indexed papers that have themselves been cited), including 27 papers in Electrical and Electronic Engineering, 18 papers in Electronic, Optical and Magnetic Materials and 4 papers in Biomedical Engineering. Recurrent topics in M. Angyal's work include Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (15 papers) and Electronic Packaging and Soldering Technologies (13 papers). M. Angyal is often cited by papers focused on Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (15 papers) and Electronic Packaging and Soldering Technologies (13 papers). M. Angyal collaborates with scholars based in United States, Switzerland and Japan. M. Angyal's co-authors include Yosi Shacham‐Diamand, Valery M. Dubin, C. Christiansen, J.S. Reid, M.−A. Nicolet, J. Gill, V. McGahay, R. G. Filippi, Matthew Sendelbach and S. Zangooie and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

M. Angyal

24 papers receiving 435 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
M. Angyal United States	10	379	238	81	72	64	28	456
Thierry Mourier France	9	359 0.9×	112 0.5×	94 1.2×	50 0.7×	41 0.6×	49	405
Ahila Krishnamoorthy Singapore	15	597 1.6×	462 1.9×	63 0.8×	79 1.1×	82 1.3×	41	641
R. Goldblatt United States	8	278 0.7×	135 0.6×	50 0.6×	65 0.9×	28 0.4×	15	359
Gayle Murdoch Belgium	11	296 0.8×	131 0.6×	40 0.5×	69 1.0×	64 1.0×	39	346
W. Zhang Belgium	8	276 0.7×	104 0.4×	68 0.8×	61 0.8×	63 1.0×	14	354
Kamal H. Baloch United States	4	170 0.4×	136 0.6×	63 0.8×	159 2.2×	96 1.5×	6	365
W. Cote United States	8	334 0.9×	170 0.7×	118 1.5×	71 1.0×	49 0.8×	15	411
Noel D’Souza United States	7	124 0.3×	165 0.7×	93 1.1×	94 1.3×	174 2.7×	12	356
Jeff Gambino United States	10	310 0.8×	108 0.5×	48 0.6×	62 0.9×	60 0.9×	59	344
M. Fayolle France	13	356 0.9×	165 0.7×	130 1.6×	214 3.0×	68 1.1×	41	505

Countries citing papers authored by M. Angyal

Since Specialization

Citations

This map shows the geographic impact of M. Angyal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Angyal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Angyal more than expected).

Fields of papers citing papers by M. Angyal

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Angyal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Angyal. The network helps show where M. Angyal may publish in the future.

Co-authorship network of co-authors of M. Angyal

This figure shows the co-authorship network connecting the top 25 collaborators of M. Angyal. A scholar is included among the top collaborators of M. Angyal based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Angyal. M. Angyal is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Zamdmer, N., K. Onishi, D. Chidambarrao, et al.. (2023). Design and Analysis of Discrete FET Monitors in 7nm FinFET Product for Robust Technology Validation. 1–3.

Li, You, et al.. (2015). 3D integration ESD protection design and analysis. 1–6.

Sakuma, Katsuyuki, M. J. Interrante, M. Angyal, et al.. (2015). An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates. 318–324. 25 indexed citations

Angyal, M., et al.. (2014). Variability Modeling and Process Optimization for the 32 nm BEOL Using In-Line Scatterometry Data. IEEE Transactions on Semiconductor Manufacturing. 27(2). 260–268. 2 indexed citations

Hu, Chunhua, Lynne Gignac, Chris Breslin, et al.. (2012). Electromigration in Cu(Al) and Cu(Mn) damascene lines. Journal of Applied Physics. 111(9). 40 indexed citations

Christiansen, C., et al.. (2012). Geometry, kinetics, and short length effects of electromigration in Mn doped Cu interconnects at the 32nm technology node. 5E.1.1–5E.1.4. 8 indexed citations

Zangooie, S., et al.. (2011). Enabling Scatterometry as an In-Line Measurement Technique for 32 nm BEOL Application. IEEE Transactions on Semiconductor Manufacturing. 24(4). 499–512. 14 indexed citations

Simon, A., F.H. Baumann, T. Bolom, et al.. (2010). Effect of TaN Stoichiometry on Barrier Oxidation and Defect Density in 32nm Cu/Ultra-Low K Interconnects. MRS Proceedings. 1249. 1 indexed citations

Huang, E., et al.. (2010). A comparative study of ULK conduction mechanisms and TDDB characteristics for Cu interconnects with and without CoWP metal cap at 32nm technology. 1–3. 5 indexed citations

10.

Chen, F., M. Shinosky, J. Gambino, et al.. (2009). Critical ultra low-k TDDB reliability issues for advanced CMOS technologies. 464–475. 18 indexed citations

11.

Gambino, J., et al.. (2009). Correlation between I–V slope and TDDB voltage acceleration for Cu/low-k interconnects. 95. 182–184. 5 indexed citations

12.

Zangooie, S., et al.. (2008). Characterization of 32nm node BEOL grating structures using scatterometry. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6922. 69220S–69220S. 6 indexed citations

13.

McLaughlin, P., V. McGahay, M. Angyal, et al.. (2007). Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections. 196–198. 6 indexed citations

14.

Fischer, A., Oliver Aubel, J. Gill, et al.. (2007). Reliability Challenges in Copper Metallizations arising with the PVD Resputter Liner Engineering for 65nm and Beyond. 511–515. 11 indexed citations

15.

Angyal, M., et al.. (2007). Characterization, Modeling and Extraction of Cu Wire Resistance for 65 nm Technology. 57–60. 2 indexed citations

16.

Steegen, An, D. Coolbaugh, V. Ramachandran, et al.. (2007). Technology Elements of a Common Platform Bulk Foundry Offering (Invited). 41. 259–262. 2 indexed citations

17.

Christiansen, C., et al.. (2006). Via-Depletion Electromigration in Copper Interconnects. IEEE Transactions on Device and Materials Reliability. 6(2). 163–168. 20 indexed citations

18.

Christiansen, C., et al.. (2006). Via-Depletion Electromigration in Copper Interconnects. 22–26. 2 indexed citations

19.

Kolagunta, V., et al.. (2002). Inline monitoring of multi-level dual inlaid copper interconnect technologies. 247–249. 2 indexed citations

20.

Angyal, M., Yosi Shacham‐Diamand, J.S. Reid, & M.−A. Nicolet. (1995). Performance of tantalum-silicon-nitride diffusion barriers between copper and silicon dioxide. Applied Physics Letters. 67(15). 2152–2154. 37 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact