Geraldine Jamieson

613 citations

26 papers · 345 · h-index 11

Impact in

Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability
Electrical and Electronic Engineering top 10%
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Photonic and Optical Devices
- Advancements in Semiconductor Devices and Circuit Design
- Semiconductor Lasers and Optical Devices

Papers in

Electrical and Electronic Engineering 24
- 3D IC and TSV technologies 15
- Semiconductor materials and devices 10
- Electronic Packaging and Soldering Technologies 9
- Advanced MEMS and NEMS Technologies 2
Biomedical Engineering 10
- Nanofabrication and Lithography Techniques 4
- Advanced Surface Polishing Techniques 4

Co-authors: J. Bömmels (5 shared papers)Christopher J. Wilson (5 shared papers)Christoph Adelmann (5 shared papers)Shreya Kundu (5 shared papers)Anshul Gupta (5 shared papers)Zsolt Tökei (5 shared papers)Shibesh Dutta (4 shared papers)Eric Beyne (13 shared papers)
Journals: IEEE Electron Device Letters (2 papers)Optics Express (1 paper)Microelectronic Engineering (1 paper)Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (1 paper)
Partner nations: Belgium Netherlands United States

In The Last Decade

Geraldine Jamieson

22 papers receiving 332 citations

Peers

Countries citing papers authored by Geraldine Jamieson

Since Specialization

Citations

This map shows the geographic impact of Geraldine Jamieson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Geraldine Jamieson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Geraldine Jamieson more than expected).

Fields of papers citing papers by Geraldine Jamieson

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Geraldine Jamieson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Geraldine Jamieson. The network helps show where Geraldine Jamieson may publish in the future.

Co-authors

The 25 scholars most cited alongside Geraldine Jamieson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Geraldine Jamieson Line = papers co-authored together Geraldine Jamieson links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Highly Scaled Ruthenium Interconnects IEEE Electron Device Letters ·Shibesh Dutta, Shreya Kundu, Anshul Gupta, Geraldine Jamieson, Juan Fernando Gomez Granados, J. Bömmels, Christopher J. Wilson, Zsolt Tökei, Christoph Adelmann	2017	70
2	Sub-100 nm² Cobalt Interconnects IEEE Electron Device Letters ·Shibesh Dutta, Sofie Beyne, Anshul Gupta, Shreya Kundu, Sven Van Elshocht, H. Bender, Geraldine Jamieson, Wilfried Vandervorst, J. Bömmels, Christopher J. Wilson, Zsolt Tökei, Christoph Adelmann	2018	62
3	High-Aspect-Ratio Ruthenium Lines for Buried Power Rail Anshul Gupta, Shreya Kundu, Lieve Teugels, J. Bömmels, Christoph Adelmann, N. Heylen, Geraldine Jamieson, Olalla Varela Pedreira, Ivan Ciofi, Bharani Chava, Christopher J. Wilson, Zsolt Tökei	2018	44
4	Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing Optics Express ·Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas De Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Günther Roelkens, Dries Van Thourhout	2018	24
5	3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects Jaber Derakhshandeh, Inge De Preter, Carine Gerets, Lin Hou, N. Heylen, Eric Beyne, Gerald Beyer, John Slabbekoorn, Vikas Dubey, Anne Jourdain, Goedele Potoms, Fumihiro Inoue, Geraldine Jamieson, K. Vandersmissen, Samuel Suhard, Tomas Webers, Giovanni Capuz, Teng Wang, Kenneth June Rebibis, Andy Miller	2016	23
6	Alternative Metals: From AB Initio Screening to Calibrated Narrow Line Models Christoph Adelmann, Kirouban Sankaran, Shibesh Dutta, Anshul Gupta, Shreya Kundu, Geraldine Jamieson, Kristof Moors, Nicolo Pinna, Ivan Ciofi, Sven Van Eishocht, J. Bömmels, G. Boccardi, Christopher J. Wilson, Geoffrey Pourtois, Zsolt Tökei	2018	17
7	Key elements for sub-50μm pitch micro bump processes Joeri De Vos, Lieve Bogaerts, Thibault Buisson, Carine Gerets, Geraldine Jamieson, K. Vandersmissen, Antonio Manna, Eric Beyne	2013	16
8	Ruthenium interconnects with 58 nm² cross-section area using a metal-spacer process Shibesh Dutta, Shreya Kundu, Lianggong Wen, Geraldine Jamieson, Kristof Croes, Anshul Gupta, J. Bömmels, Christopher J. Wilson, Christoph Adelmann, Zsolt Tökei	2017	15
9	CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference ·S. Severi, J. Heck, T.-K. Chou, Nickolai Belov, J.-S. Park, D. Harrar, Amit Kumar Jain, R. Van Hoof, Bert Du Bois, Jeroen De Coster, Olalla Varela Pedreira, Myriam Willegems, Jan Vaes, Geraldine Jamieson, L. Haspeslagh, Donald E. Adams, Valluri Rao, Stefaan Decoutere, Ann Witvrouw	2009	14
10	"Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects Joeri De Vos, Stefaan Van Huylenbroeck, Anne Jourdain, Nancy Heylen, Lan Peng, Geraldine Jamieson, Nina Tutunjyan, Stefano Sardo, Andy Miller, Eric Beyne	2018	14
11	A Highly Reliable 1.4μm Pitch Via-Last TSV Module for Wafer-to-Wafer Hybrid Bonded 3D-SOC Systems Stefaan Van Huylenbroeck, Joeri De Vos, Zaid El-Mekki, Geraldine Jamieson, Nina Tutunjyan, Karthik Muga, Michele Stucchi, Andy Miller, Gerald Beyer, Eric Beyne	2019	10
12	Die to wafer 3D stacking for below 10um pitch microbumps Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller	2016	9
13	Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·Jaber Derakhshandeh, Eric Beyne, Gerald Beyer, Giovanni Capuz, Vladimir Cherman, Inge De Preter, Carine Gerets, Ehsan Shafahian, Koen Kennes, Geraldine Jamieson, Tom Cochet, Tomas Webers, Bert Tobback, Geert Van der Plas, Douglas Charles La Tulipe, Alain Phommahaxay, Andy Miller	2022	7
14	A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps Jaber Derakhshandeh, Carine Gerets, Fumihiro Inoue, Giovanni Capuz, Vladimir Cherman, Melina Lofrano, Lin Hou, Tom Cochet, Inge De Preter, Tomas Webers, Pieter Bex, Geraldine Jamieson, Masataka Maehara, Ehsan Shafahian, Julien Bertheau, Eric Beyne, Douglas Charles La Tulipe, Gerald Beyer, Geert Van der Plas, Andy Miller	2021	3
15	A Highly Reliable 1×5μm Via-last TSV Module Stefaan Van Huylenbroeck, Yunlong Li, Joeri De Vos, Geraldine Jamieson, Nina Tutunjyan, Andy Miller, Gerald Beyer, Eric Beyne	2018	3
16	Low temperature zero-level hermetic packaging for MEMS based on solder and polymer bonding Piet De Moor, Kris Baert, Bert Du Bois, Geraldine Jamieson, Anne Jourdain, H.A.C. Tilmans, Myriam Van De Peer, Ann Witvrouw, Chris Van Hoof	2003	2
17	Alternative patterning techniques enabling fine pitch interconnection on topography surfaces F. Iker, Takuo Funaya, Geraldine Jamieson, Eric Beyne	2010	2
18	The Minipackage: a flexible wafer-level packaging solution for MEMS Piet De Moor, Kris Baert, Lieve Bogaerts, Bert Du Bois, Geraldine Jamieson, Anne Jourdain, Chris Van Hoof	2004	2
19	A Descum Review for Cleaning Surfaces in Polymer Embedded Process Flows Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena ·Geraldine Jamieson, Carine Gerets, F. Duval, Nga Pham, F. Iker, Takuo Funaya, Werner Boullart	2012	2
20	Process related challenges for 3D face to face stacking test vehicles using a 40/50μm pitch CuSn microbump configuration Lieve Bogaerts, Joeri De Vos, Carine Gerets, Geraldine Jamieson, K. Vandersmissen, Antonio Manna	2012	2

About Geraldine Jamieson

Geraldine Jamieson is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 26 papers that have together received 345 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Semiconductor materials and devices (10 papers), Electronic Packaging and Soldering Technologies (9 papers), Copper Interconnects and Reliability (7 papers), Nanofabrication and Lithography Techniques (4 papers), Advanced Surface Polishing Techniques (4 papers), Advanced MEMS and NEMS Technologies (2 papers) and Mechanical and Optical Resonators (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (125 citations), Electrical and Electronic Engineering (319 citations), Atomic and Molecular Physics, and Optics (81 citations), Hardware and Architecture (13 citations) and Automotive Engineering (17 citations). Geraldine Jamieson has collaborated with scholars based in Belgium, Netherlands and United States. Frequent co-authors include J. Bömmels, Christopher J. Wilson, Christoph Adelmann, Shreya Kundu, Anshul Gupta, Zsolt Tökei, Shibesh Dutta, Eric Beyne, Wilfried Vandervorst and N. Heylen. Their work appears in journals such as IEEE Electron Device Letters, Optics Express, Microelectronic Engineering, Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena and 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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