S. Nguyen

1.5k citations

56 papers · 964 indexed · h-index 16

Impact in

Electronic, Optical and Magnetic Materials top 5%
- Copper Interconnects and Reliability
Electrical and Electronic Engineering top 5%
- Semiconductor materials and devices
- Thin-Film Transistor Technologies
- Plasma Diagnostics and Applications
- Advancements in Semiconductor Devices and Circuit Design

Papers in

Electronic, Optical and Magnetic Materials 38
- Copper Interconnects and Reliability 36
Electrical and Electronic Engineering 54
- Semiconductor materials and devices 45
- 3D IC and TSV technologies 8
- Electronic Packaging and Soldering Technologies 6
- Advancements in Semiconductor Devices and Circuit Design 5

Co-authors: A. Grill Deepika Priyadarshini S. M. Gates D. Dobuzinsky A. K. Stamper D. Harmon D. Többen S. R. Stiffler
Journals: Journal of The Electrochemical Society (7 papers)Applied Physics Letters (3 papers)IBM Journal of Research and Development (3 papers)ECS Journal of Solid State Science and Technology (2 papers)Thin Solid Films (2 papers)
Partner nations: United States Germany South Korea

In The Last Decade

S. Nguyen

52 papers receiving 919 citations

Peers

Countries citing papers authored by S. Nguyen

Since Specialization

Citations

This map shows the geographic impact of S. Nguyen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Nguyen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Nguyen more than expected).

Fields of papers citing papers by S. Nguyen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Nguyen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Nguyen. The network helps show where S. Nguyen may publish in the future.

Co-authors

The 25 scholars most cited alongside S. Nguyen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with S. Nguyen Line = papers co-authored together S. Nguyen links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology D. Edelstein, S. Nguyen, Huai Huang, Amod Jog, Jennifer Church, Sabyasachi Ghosh, Nicholas A. Lanzillo, Maria José Lo Faro, S. McDermott, D. Metzler, Carisa K. Meagher, Yann Mignot, T. Nogami, Florian Ion Tiberiu Petrescu, M. Shoudy, Mary Claire Silvestre, A. Simon, Linda Wangoh, Han Zhang	2024	0
2	Reactive Vapor-Phase Inhibitors for Area-Selective Depositions at Tunable Critical Dimensions ACS Applied Materials & Interfaces ·Lawal Adewale Ogunfowora, Ishwar Singh, Noel Arellano, Thomas G. Pattison, Teddie Magbitang, Khanh Nguyen, Brandi Ransom, Krystelle Lionti, S. Nguyen, Teya Topura, Eugene Delenia, Mark Sherwood, Brett M. Savoie, Rudy J. Wojtecki	2024	7
3	Improved Air Spacer for Highly Scaled CMOS Technology IEEE Transactions on Electron Devices ·Kangguo Cheng, Chanro Park, Heng Wu, Juntao Li, S. Nguyen, Jingyun Zhang, Miaomiao Wang, S. Mehta, Zuoguang Liu, Rena M. Conti, Nicolas Loubet, Julien Frougier, Andrew Greene, Tenko Yamashita, B. Haran, R. Divakaruni	2020	9
4	Improved Air Spacer Co-Integrated with Self-Aligned Contact (SAC) and Contact over Active Gate (COAG) for Highly Scaled CMOS Technology Kangguo Cheng, Chanro Park, Heng Wu, Juntao Li, S. Nguyen, Jingyun Zhang, Miaomiao Wang, S. Mehta, Zuoguang Liu, Rena M. Conti, Nicolas Loubet, Julien Frougier, Andrew Greene, Tenko Yamashita, Bala Haran, R. Divakaruni	2020	9
5	Novel low k Dielectric materials for nano device interconnect technology S. Nguyen, H. Shobha, Thomas J Haigh, J. Chen, J. Lee, T. Nogami, E. Liniger, Sidney Cohen, Chunhua Hu, Huai Huang, Yu Yao, D. Canaperi, B. Peethala, T. Standaert, Griselda Bonilla	2020	2
6	Surface Initiated Polymer Thin Films for the Area Selective Deposition and Etching of Metal Oxides ACS Nano ·Thomas G. Pattison, Alexander E. Hess, Noel Arellano, Nicholas A. Lanzillo, S. Nguyen, Holt Bui, Charles Rettner, Hoa Truong, Alexander Friz, Teya Topuria, Anthony Fong, Brian Hughes, Andy Tek, Anuja DeSilva, Robert D. Miller, Greg G. Qiao, Rudy J. Wojtecki	2020	28
7	Pinch Off Plasma Chemical Vapor Deposition Process and Material Technology for Nano-Device Air Gap/Spacer Formation ECS Meeting Abstracts ·S. Nguyen, Thomas J Haigh, Kangguo Cheng, Christian Penny, Chanro Park, S. Mehta, Tenko Yamashita, Liying Jiang, D. Canaperi	2018	1
8	Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines T. Nogami, R. Patlolla, James J. Kelly, Benjamin D. Briggs, Huai Huang, J. Demarest, J. Li, Robert Hengstebeck, Xingxing Zhang, G. Lian, B. Peethala, Prasad Bhosale, J. Maniscalco, H. Shobha, S. Nguyen, P. McLaughlin, T. Standaert, D. Canaperi, D. Edelstein, Vamsi Paruchuri	2017	18
9	BEOL Dielectric Processing for Cu-Low k Nano Interconnect- Impact of Plasma CVD Initial Transient Phenomena (ITP) ECS Transactions ·S. Nguyen, H. Shobha, Thomas J Haigh, Deepika Priyadarshini, D. Canaperi	2017	1
10	Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect ECS Journal of Solid State Science and Technology ·S. Nguyen, Shobha Hosadugra, Thomas J Haigh, Yu Yao, L. Tai, Sidney Cohen, T. M. Shaw, Chao Hu, E. Liniger, Kumar Virwani, A. J. Kellock, D. Canaperi	2017	9
11	Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects ECS Meeting Abstracts ·Deepika Priyadarshini, S. Nguyen, H. Shobha, E. Todd Ryan, Steven M Gates, Huai Huang, James Chen, E. Liniger, S. A. Cohen, Chao-Kun Hu, Anita Madan, Ellen Adams, S. Molis, Thomas J Haigh, Griselda Bonilla, T. Standaert, D. Canaperi, A. Grill	2015	1
12	Advanced metal and dielectric barrier cap films for Cu low k interconnects Deepika Priyadarshini, S. Nguyen, H. Shobha, Sidney Cohen, T. M. Shaw, E. Liniger, Chao Hu, C. Parks, Ed Adams, Jay Burnham, A. Simon, Griselda Bonilla, A. Grill, D. Canaperi, D. Edelstein, Duane Collins, Mihaela Balseanu, M. Stolfi, Xuejun Ren, K. Shah	2014	11
13	Electromigration comparison of selective CVD cobalt capping with PVD Ta(N) and CVD cobalt liners on 22nm-groundrule dual-damascene Cu interconnects A. Simon, T. Bolom, Chunping Niu, F.H. Baumann, Chunhua Hu, C. Parks, Joyeeta Nag, H. Kim, J. Y. Lee, C.-C. Yang, S. Nguyen, H. Shobha, T. Nogami, S. Guggilla, Xuejun Ren, D. Sabens, Joseph F. AuBuchon	2013	31
14	Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices ECS Transactions ·S. Nguyen, Thomas J Haigh, M. Tagami, A. Grill, S. A. Cohen, H. Shobha, Chao-Kun Hu, Ed Adams, E. Liniger, T. M. Shaw, Tien Cheng, Hakeem Yusuff, Yiheng Xu, Tze‐Man Ko, S. Molis, T. Spooner, Spyridon Skordas, Xiaohu Liu, Griselda Bonilla, Dan Edelstein	2012	4
15	In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects C.-C. Yang, F. Chen, B. Li, H. Shobha, S. Nguyen, A. Grill, Wenyao Ye, Joseph F. AuBuchon, Mei-Yee Shek, D. Edelstein	2012	3
16	A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4) J. Bao, N. Lustig, Edward Engbrecht, J. Gill, R. G. Filippi, T. C. Lee, Kaushik Chanda, D. Kioussis, A. Lisi, Tien Cheng, S. B. Law, A. Simon, P. Flaitz, Jihong Choi, Wei‐Tsu Tseng, E. M. Zielinski, S. M. Gates, A. Grill, S. Nguyen, H. Shobha	2010	1
17	Plasma Deposition and Development of Ultralow-k Bilayer SiCN_x/SiCN_y Dielectric Cu Cap for 32 nm CMOS Devices ECS Meeting Abstracts ·S. Nguyen, A. Grill, S. A. Cohen, H. Shobha, N. Klymko, E. Simonyi, Thomas J Haigh, Chenming Hu, Ellen Adams, E. Liniger, Anita Madan, T. M. Shaw, E. Todd Ryan, Tien Cheng, Joshua Herman, Robert M. Young	2009	2
18	High Selectivity Magnetically Enhanced Reactive Ion Etching of Boron Nitride Films Journal of The Electrochemical Society ·D. Cote, S. Nguyen, David Dobuzinsky, C. Basa, B. Neureither	1994	5
19	Substrate Trenching Mechanism during Plasma and Magnetically Enhanced Polysilicon Etching Journal of The Electrochemical Society ·S. Nguyen, D. Dobuzinsky, S. R. Stiffler, Greg S. Chrisman	1991	39
20	Excimer laser-assisted etching of polysilicon at 193 nm Journal of materials research/Pratt's guide to venture capital sources ·M. Armacost, S. V. Babu, S. Nguyen, John F. Rembetski	1987	3

About S. Nguyen

S. Nguyen is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Condensed Matter Physics and Atomic and Molecular Physics, and Optics, having authored 56 papers that have together received 964 indexed citations. Recurring topics across this work include Semiconductor materials and devices (45 papers), Copper Interconnects and Reliability (36 papers), Metal and Thin Film Mechanics (17 papers), 3D IC and TSV technologies (8 papers), Semiconductor materials and interfaces (7 papers), Electronic Packaging and Soldering Technologies (6 papers), GaN-based semiconductor devices and materials (5 papers) and Advancements in Semiconductor Devices and Circuit Design (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (466 citations), Electrical and Electronic Engineering (795 citations), Mechanics of Materials (204 citations), Ceramics and Composites (45 citations) and Materials Chemistry (283 citations). S. Nguyen has collaborated with scholars based in United States, Germany and South Korea. Frequent co-authors include A. Grill, Deepika Priyadarshini, S. M. Gates, D. Dobuzinsky, A. K. Stamper, D. Harmon, D. Többen, S. R. Stiffler, H. Shobha and C.-C. Yang. Their work appears in journals such as Journal of The Electrochemical Society, Applied Physics Letters, IBM Journal of Research and Development, ECS Journal of Solid State Science and Technology and Thin Solid Films.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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