Griselda Bonilla

1.1k total citations
57 papers, 755 citations indexed

About

Griselda Bonilla is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Griselda Bonilla has authored 57 papers receiving a total of 755 indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 47 papers in Electronic, Optical and Magnetic Materials and 11 papers in Materials Chemistry. Recurrent topics in Griselda Bonilla's work include Copper Interconnects and Reliability (41 papers), Semiconductor materials and devices (35 papers) and Electronic Packaging and Soldering Technologies (19 papers). Griselda Bonilla is often cited by papers focused on Copper Interconnects and Reliability (41 papers), Semiconductor materials and devices (35 papers) and Electronic Packaging and Soldering Technologies (19 papers). Griselda Bonilla collaborates with scholars based in United States, Puerto Rico and Canada. Griselda Bonilla's co-authors include Dillip K. Pradhan, R. N. P. Choudhary, Ram S. Katiyar, E. Liniger, T. M. Shaw, D. Edelstein, E. Liniger, E. Todd Ryan, S. A. Cohen and D. Canaperi and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Griselda Bonilla

56 papers receiving 732 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Griselda Bonilla United States 15 472 447 309 78 78 57 755
Kaishuai Yang China 14 327 0.7× 173 0.4× 481 1.6× 98 1.3× 33 0.4× 32 718
Yongmao Cai China 12 580 1.2× 179 0.4× 395 1.3× 82 1.1× 28 0.4× 19 804
Shaowen Xu China 13 253 0.5× 247 0.6× 242 0.8× 46 0.6× 21 0.3× 36 523
Minmin Zou China 14 496 1.1× 285 0.6× 774 2.5× 99 1.3× 29 0.4× 29 1.0k
D. P. Sherstyuk Russia 10 183 0.4× 316 0.7× 401 1.3× 97 1.2× 24 0.3× 25 554
M. Py France 10 451 1.0× 105 0.2× 512 1.7× 34 0.4× 55 0.7× 19 770
Baojun Chen China 15 940 2.0× 451 1.0× 298 1.0× 143 1.8× 20 0.3× 61 1.1k
Fanghua Tian China 14 473 1.0× 457 1.0× 289 0.9× 106 1.4× 25 0.3× 75 805
Shuai Yin China 16 275 0.6× 203 0.5× 278 0.9× 60 0.8× 12 0.2× 41 615

Countries citing papers authored by Griselda Bonilla

Since Specialization
Citations

This map shows the geographic impact of Griselda Bonilla's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Griselda Bonilla with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Griselda Bonilla more than expected).

Fields of papers citing papers by Griselda Bonilla

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Griselda Bonilla. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Griselda Bonilla. The network helps show where Griselda Bonilla may publish in the future.

Co-authorship network of co-authors of Griselda Bonilla

This figure shows the co-authorship network connecting the top 25 collaborators of Griselda Bonilla. A scholar is included among the top collaborators of Griselda Bonilla based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Griselda Bonilla. Griselda Bonilla is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Mori, Hiroyuki, et al.. (2023). Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage. 1213–1218. 5 indexed citations
2.
Watanabe, Atom O., Xiaoxiong Gu, Frank Libsch, Griselda Bonilla, & Hiroyuki Mori. (2023). Electrical characterization and modeling of 2-μm and 1.5-μm line-and-space high-density signal wiring in organic interposer. 1590–1596. 6 indexed citations
3.
4.
5.
Muralidhar, R., et al.. (2017). A stochastic model for impact of LER on BEOL TDDB. 11. DG–4.1. 5 indexed citations
6.
Ando, Takashi, E. Cartier, P. Jamison, et al.. (2016). CMOS compatible MIM decoupling capacitor with reliable sub-nm EOT high-k stacks for the 7 nm node and beyond. 11 indexed citations
7.
Wu, Ernest Y., J. H. Stathis, Baozhen Li, et al.. (2016). Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications. 49. 3A–1. 1 indexed citations
8.
Priyadarshini, Deepika, S. Nguyen, H. Shobha, et al.. (2015). Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects. ECS Meeting Abstracts. MA2015-02(18). 824–824. 1 indexed citations
9.
Hu, Chao, Chris Breslin, E‐Wen Huang, et al.. (2014). Microstructure, impurity and metal cap effects on Cu electromigration. AIP conference proceedings. 67–78. 8 indexed citations
10.
Liniger, E., S. A. Cohen, & Griselda Bonilla. (2014). Low-field TDDB reliability data to enable accurate lifetime predictions. 14 indexed citations
11.
Hu, C.‐K., E. Liniger, L. Gignac, Griselda Bonilla, & D. Edelstein. (2013). Materials and scaling effects on on-chip interconnect reliability. MRS Proceedings. 1559. 11 indexed citations
12.
Nguyen, S., A. Grill, S. A. Cohen, et al.. (2012). Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices. ECS Transactions. 41(43). 3–9. 4 indexed citations
13.
Hu, Chunhua, Lynne Gignac, Chris Breslin, et al.. (2012). Electromigration in Cu(Al) and Cu(Mn) damascene lines. Journal of Applied Physics. 111(9). 40 indexed citations
14.
Chen, F., M. Shinosky, J. Aitken, et al.. (2011). Invasion percolation model for abnormal TDDB characteristic of ULK dielectrics with Cu interconnect at advanced technology nodes. 2F.2.1–2F.2.8. 5 indexed citations
15.
Lloyd, J. R., et al.. (2009). On the contribution of line-edge roughness to intralevel TDDB lifetime in low-k dielectrics. 410. 602–605. 8 indexed citations
16.
Witt, C., R. Rosenberg, Griselda Bonilla, et al.. (2009). Stress Relaxation in Cu Thin Films. AIP conference proceedings. 156–165. 5 indexed citations
17.
Choudhary, R. N. P., et al.. (2007). Effect of La substitution on structural and electrical properties of Ba(Fe2/3W1/3)O3 nanoceramics. Journal of Materials Science. 42(17). 7423–7432. 91 indexed citations
18.
Gignac, L., et al.. (2007). Electromigration Reliability in Nanoscale Cu Interconnects. MRS Proceedings. 1036. 1 indexed citations
19.
Ryan, E. Todd, Jeremy I. Martin, Griselda Bonilla, et al.. (2007). Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface. Journal of The Electrochemical Society. 154(7). H604–H604. 6 indexed citations
20.
Choudhary, R. N. P., et al.. (2007). Impedance characteristics of Pb(Fe2/3W1/3)O3–BiFeO3 composites. physica status solidi (b). 244(6). 2254–2266. 45 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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