Huai Huang

1.5k total citations
72 papers, 1.0k citations indexed

About

Huai Huang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Huai Huang has authored 72 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 56 papers in Electrical and Electronic Engineering, 42 papers in Electronic, Optical and Magnetic Materials and 17 papers in Mechanics of Materials. Recurrent topics in Huai Huang's work include Copper Interconnects and Reliability (40 papers), Semiconductor materials and devices (38 papers) and Metal and Thin Film Mechanics (17 papers). Huai Huang is often cited by papers focused on Copper Interconnects and Reliability (40 papers), Semiconductor materials and devices (38 papers) and Metal and Thin Film Mechanics (17 papers). Huai Huang collaborates with scholars based in United States, Taiwan and China. Huai Huang's co-authors include Yahong Rosa Zheng, Paul S. Ho, Hualiang Shi, Denis Shamiryan, Adam Urbanowicz, Т. В. Рахимова, Jean‐François de Marneffe, Mikhaı̈l R. Baklanov, Hong‐Tsu Young and Grant M. Kloster and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

Huai Huang

64 papers receiving 976 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Huai Huang United States 15 810 546 268 169 143 72 1.0k
А. Б. Ринкевич Russia 15 235 0.3× 386 0.7× 141 0.5× 228 1.3× 121 0.8× 173 912
Scott Keller United States 15 190 0.2× 475 0.9× 155 0.6× 343 2.0× 182 1.3× 37 876
Christine Kirchhof Germany 19 355 0.4× 759 1.4× 42 0.2× 552 3.3× 445 3.1× 24 1.1k
А. С. Татаренко Russia 19 318 0.4× 909 1.7× 87 0.3× 805 4.8× 281 2.0× 47 1.2k
M. Hecker Germany 20 537 0.7× 359 0.7× 233 0.9× 330 2.0× 202 1.4× 110 1.2k
Dirk Meyners Germany 23 523 0.6× 1.1k 2.0× 76 0.3× 749 4.4× 615 4.3× 62 1.6k
Guoliang Yu China 15 263 0.3× 258 0.5× 66 0.2× 283 1.7× 83 0.6× 66 584
Albrecht Jander United States 16 307 0.4× 199 0.4× 56 0.2× 130 0.8× 255 1.8× 63 765
N. Lagakos United States 14 594 0.7× 63 0.1× 64 0.2× 168 1.0× 193 1.3× 51 884
G. Vértesy Hungary 18 452 0.6× 591 1.1× 103 0.4× 492 2.9× 144 1.0× 137 1.4k

Countries citing papers authored by Huai Huang

Since Specialization
Citations

This map shows the geographic impact of Huai Huang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huai Huang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huai Huang more than expected).

Fields of papers citing papers by Huai Huang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Huai Huang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huai Huang. The network helps show where Huai Huang may publish in the future.

Co-authorship network of co-authors of Huai Huang

This figure shows the co-authorship network connecting the top 25 collaborators of Huai Huang. A scholar is included among the top collaborators of Huai Huang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Huai Huang. Huai Huang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
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Cheng, Kuo‐Hsing, et al.. (2024). A 10 Gb/s Full-Rate Receiver with RX-FFE Compensation. 1–4.
4.
Salunke, Jagadish K., et al.. (2024). A design approach for ultra-low-k dielectric organosiloxane polymers. 1–3. 1 indexed citations
5.
Edelstein, D., S. Nguyen, Huai Huang, et al.. (2024). The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology. 1–4.
6.
7.
Nogami, T., Oleg Gluschenkov, Son T. Nguyen, et al.. (2022). Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). 423–424. 6 indexed citations
8.
Huang, Huai & Matthew Schmidt. (2022). A systematic review of theory-informed design and implementation of digital game-based language learning. 14–34. 3 indexed citations
9.
Lanzillo, Nicholas A., K. Motoyama, Huai Huang, Robert R. Robison, & T. Spooner. (2020). Via resistance and reliability trends in copper interconnects with ultra-scaled barrier layers. Applied Physics Letters. 116(16). 12 indexed citations
10.
Huang, Huai & Yahong Rosa Zheng. (2017). Node localization in 3-D by magnetic-induction communications in wireless sensor networks. 78. 5 indexed citations
11.
Nogami, T., R. Patlolla, James J. Kelly, et al.. (2017). Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines. 1–3. 18 indexed citations
12.
Huang, Huai. (2017). Node localization in underwater sensor networks (UWSN). 3 indexed citations
13.
Kelly, James J., Huai Huang, C.‐K. Hu, et al.. (2016). Experimental study of nanoscale Co damascene BEOL interconnect structures. 40–42. 43 indexed citations
14.
Priyadarshini, Deepika, S. Nguyen, H. Shobha, et al.. (2015). Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects. ECS Meeting Abstracts. MA2015-02(18). 824–824. 1 indexed citations
15.
Baklanov, Mikhaı̈l R., Jean‐François de Marneffe, Denis Shamiryan, et al.. (2013). Plasma processing of low-k dielectrics. Journal of Applied Physics. 113(4). 243 indexed citations
16.
Shi, Hua‐Tian, Huai Huang, Brook Chao, et al.. (2008). Mechanistic Study of CO<inf>2</inf> Plasma Damage to OSG Low k Dielectrics. 26. 31–33. 1 indexed citations
17.
Shi, Hua‐Tian, Huai Huang, Paul S. Ho, et al.. (2007). Mechanistic Study of Plasma Damage and CH4 Recovery of Low k Dielectric Surface. 147–149. 7 indexed citations
18.
Ke, Wen-Cheng, et al.. (2004). Microphotoluminescence spectra of hillocks in Al0.11Ga0.89N films. Applied Physics Letters. 85(15). 3047–3049. 10 indexed citations
19.
Huang, Huai, et al.. (2002). Photoluminescence and photoluminescence excitation studies of as-grown and P-implanted GaN: On the nature of yellow luminescence. Applied Physics Letters. 80(18). 3349–3351. 15 indexed citations
20.
Huang, Huai, et al.. (2000). Time-resolved photoluminescence study of isoelectronic In-doped GaN films grown by metalorganic vapor-phase epitaxy. Applied Physics Letters. 76(22). 3224–3226. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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