Cindy Goldberg

1.2k total citations
30 papers, 783 citations indexed

About

Cindy Goldberg is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Cindy Goldberg has authored 30 papers receiving a total of 783 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 13 papers in Mechanics of Materials. Recurrent topics in Cindy Goldberg's work include Copper Interconnects and Reliability (17 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (12 papers). Cindy Goldberg is often cited by papers focused on Copper Interconnects and Reliability (17 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (12 papers). Cindy Goldberg collaborates with scholars based in United States, France and Italy. Cindy Goldberg's co-authors include W. Ben Kibler, T. Jeff Chandler, L.L. Mercado, Alain E. Kaloyeros, Barry Arkles, D. R. Frear, Guillermo M. Nuesca, Gregory M. Peterson, Scott Pozder and John J. Sullivan and has published in prestigious journals such as Journal of The Electrochemical Society, The American Journal of Sports Medicine and Thin Solid Films.

In The Last Decade

Cindy Goldberg

29 papers receiving 737 citations

Peers

Countries citing papers authored by Cindy Goldberg

Since Specialization

Citations

This map shows the geographic impact of Cindy Goldberg's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cindy Goldberg with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cindy Goldberg more than expected).

Fields of papers citing papers by Cindy Goldberg

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cindy Goldberg. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cindy Goldberg. The network helps show where Cindy Goldberg may publish in the future.

Co-authorship network of co-authors of Cindy Goldberg

This figure shows the co-authorship network connecting the top 25 collaborators of Cindy Goldberg. A scholar is included among the top collaborators of Cindy Goldberg based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cindy Goldberg. Cindy Goldberg is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Hybridization of XRF/XPS and scatterometry for Cu CMP process control 2015 ·Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·(unknown), (unknown), Kwang-Hoon Kim, (unknown), K. Motoyama, (unknown), T. Standaert, John G. Gaudiello, Cindy Goldberg	4
2	Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes 2013 ·MRS Proceedings ·John H. Zhang, Wei‐Tsu Tseng, (unknown), Ben Kim, P. Flaitz, (unknown), Cindy Goldberg, (unknown), (unknown)	1
3	Optimizing Stressor Film Deposition Sequence in Polish Rate Order for Best Planarization 2011 ·MRS Proceedings ·John H. Zhang, (unknown), J. Strane, (unknown), Laertis Economikos, Lindsey Hall, Jie Chen, (unknown), (unknown), (unknown), Paulo Ferreira, Walter Kleemeier, Cindy Goldberg, (unknown), (unknown), J. Sudijono, Xiaomeng Chen, (unknown)	1
4	Full Copper Electrochemical Mechanical Planarization (Ecmp) as a Technology Enabler for the 45 and 32nm Nodes 2007 ·M. Mellier, (unknown), (unknown), (unknown), (unknown), M. Rivoire, Cindy Goldberg, (unknown), (unknown), (unknown), (unknown), Stan Tsai, (unknown), (unknown), (unknown)	4
5	Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types 2005 ·Cindy Goldberg, (unknown), Vincent Fiori, Robert Fox, Kai‐Uwe Hess, (unknown), A. Humbert, (unknown), (unknown), (unknown), S. Orain, Scott Pozder, (unknown), (unknown), (unknown), (unknown), (unknown)	13
6	Elastic constants of low-k and barrier dielectric films measured by Brillouin light scattering 2005 ·Thin Solid Films ·G. Carlotti, (unknown), N. Casanova, Cindy Goldberg, G. Socino	24
7	Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics 2005 ·R.J.O.M. Hoofman, (unknown), (unknown), R. Daamen, (unknown), V. Arnal, (unknown), L.G. Gosset, A. Humbert, W.F.A. Besling, Cindy Goldberg, Robert Fox, (unknown), C. Guedj, (unknown), V. Jousseaume, L. Arnaud, (unknown), J. Torrès, G. Passemard	8
8	Analysis of flip-chip packaging challenges on copper low-k interconnects 2004 ·L.L. Mercado, Cindy Goldberg, (unknown), (unknown), (unknown)	39
9	Analysis of flip-chip packaging challenges on copper/low-k interconnects 2003 ·IEEE Transactions on Device and Materials Reliability ·L.L. Mercado, Cindy Goldberg, (unknown), (unknown), Scott Pozder	69
10	Interconnect mechanical reliability with low κ dielectric as final ILD 2003 ·Cindy Goldberg, L.L. Mercado, (unknown), (unknown)	2
11	Integration of SiCN as a low κ etch stop and Cu passivation in a high performance Cu/low κ interconnect 2003 ·Jeremy I. Martin, (unknown), (unknown), Fanghao Huang, (unknown), (unknown), (unknown), Linlin Zhao, J. Werking, Cindy Goldberg, (unknown), T. Sparks, (unknown)	9
12	ChemInform Abstract: Interlayer Mediated Epitaxy of Cobalt Silicide on Silicon (100) from Low Temperature Chemical Vapor Deposition of Cobalt. 2001 ·ChemInform ·(unknown), Guillermo M. Nuesca, Cindy Goldberg, Gregory M. Peterson, Alain E. Kaloyeros, Barry Arkles, John J. Sullivan	2
13	Interlayer Mediated Epitaxy of Cobalt Silicide on Silicon (100) from Low Temperature Chemical Vapor Deposition of Cobalt Formation Mechanisms and Associated Properties 2001 ·Journal of The Electrochemical Society ·(unknown), Guillermo M. Nuesca, Cindy Goldberg, Gregory M. Peterson, Alain E. Kaloyeros, Barry Arkles, John J. Sullivan	30
14	The Use of the Four-Point Bending Technique for Determining the Strength of Low K Dielectric/Barrier Interface 2000 ·MRS Proceedings ·Ting Y. Tsui, Cindy Goldberg, (unknown), (unknown), (unknown), (unknown), Eric Jackson, (unknown), (unknown), Jeremy I. Martin, (unknown)	1
15	Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications 1999 ·Journal of materials research/Pratt's guide to venture capital sources ·Xiaomeng Chen, G. G. Peterson, Cindy Goldberg, (unknown), H. L. Frisch, Alain E. Kaloyeros, Barry Arkles, John J. Sullivan	18
16	The Effects of Processing Parameters in the Low‐Temperature Chemical Vapor Deposition of Titanium Nitride from Tetraiodotitanium 1998 ·Journal of The Electrochemical Society ·(unknown), Cindy Goldberg, (unknown), A. Upham, Andreas Knorr, (unknown), Gregory M. Peterson, Alain E. Kaloyeros, Barry Arkles	10
17	Barrier Properties of Titanium Nitride Films Grown by Low Temperature Chemical Vapor Deposition from Titanium Tetraiodide 1997 ·Journal of The Electrochemical Society ·(unknown), Cindy Goldberg, (unknown), A. Upham, D. Manger, Gregory M. Peterson, (unknown), Alain E. Kaloyeros, Barry Arkles, Ajit Paranjpe	37
18	ChemInform Abstract: Barrier Properties of Titanium Nitride Films Grown by Low Temperature Chemical Vapor Deposition from Titanium Tetraiodide. 1997 ·ChemInform ·(unknown), Cindy Goldberg, (unknown), A. Upham, D. Manger, Gregory M. Peterson, (unknown), Alain E. Kaloyeros, Barry Arkles, Ajit Paranjpe	1
19	In situ quadrupole mass spectroscopy studies of water and solvent coordination to copper(II) β-diketonate precursors: implications for the chemical vapor deposition of copper 1995 ·Materials Chemistry and Physics ·Zheng Bo, Cindy Goldberg, Eric Eisenbraun, Jun Liu, Alain E. Kaloyeros, Paul J. Toscano, S. P. Murarka, (unknown), John J. Sullivan	9
20	Chemical vapor deposition based copper interconnects for ULSI multilevel metallization schemes. 1995 ·(unknown), Aaron R. Burke, Cindy Goldberg, (unknown), (unknown), D. Manger, M. Lipiński, Alain E. Kaloyeros	1

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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