Chunhua Hu

1.3k total citations
42 papers, 847 citations indexed

About

Chunhua Hu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Chunhua Hu has authored 42 papers receiving a total of 847 indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 33 papers in Electronic, Optical and Magnetic Materials and 7 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Chunhua Hu's work include Copper Interconnects and Reliability (32 papers), Electronic Packaging and Soldering Technologies (24 papers) and Semiconductor materials and devices (17 papers). Chunhua Hu is often cited by papers focused on Copper Interconnects and Reliability (32 papers), Electronic Packaging and Soldering Technologies (24 papers) and Semiconductor materials and devices (17 papers). Chunhua Hu collaborates with scholars based in United States, China and Switzerland. Chunhua Hu's co-authors include Paul S. Ho, M. B. Small, R. Rosenberg, L. Gignac, H. B. Huntington, B. M. Luther, Lynne Gignac, E. Liniger, S. Kaldor and G. R. Gruzalski and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and PLoS ONE.

In The Last Decade

Chunhua Hu

38 papers receiving 785 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chunhua Hu United States 15 708 569 166 96 87 42 847
K. Mukai Japan 13 548 0.8× 197 0.3× 93 0.6× 94 1.0× 21 0.2× 29 654
J.H. Zhao United States 25 1.5k 2.1× 227 0.4× 484 2.9× 28 0.3× 133 1.5× 112 1.6k
Yasuhiro Oda Japan 13 368 0.5× 116 0.2× 146 0.9× 36 0.4× 129 1.5× 46 589
Pierre Brosselard France 16 886 1.3× 115 0.2× 209 1.3× 74 0.8× 90 1.0× 76 965
В. И. Сахаров Russia 12 277 0.4× 235 0.4× 82 0.5× 34 0.4× 62 0.7× 122 717
Yasuo Ohno Japan 17 832 1.2× 240 0.4× 262 1.6× 57 0.6× 706 8.1× 90 1.0k
K. G. Irvine United States 15 966 1.4× 175 0.3× 363 2.2× 73 0.8× 338 3.9× 35 1.1k
M. Dammann Germany 14 561 0.8× 117 0.2× 218 1.3× 29 0.3× 431 5.0× 72 709
R.S. Beech United States 10 337 0.5× 167 0.3× 427 2.6× 21 0.2× 99 1.1× 26 567
Adolf Schöner Sweden 23 2.2k 3.1× 389 0.7× 700 4.2× 41 0.4× 79 0.9× 150 2.4k

Countries citing papers authored by Chunhua Hu

Since Specialization
Citations

This map shows the geographic impact of Chunhua Hu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chunhua Hu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chunhua Hu more than expected).

Fields of papers citing papers by Chunhua Hu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chunhua Hu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chunhua Hu. The network helps show where Chunhua Hu may publish in the future.

Co-authorship network of co-authors of Chunhua Hu

This figure shows the co-authorship network connecting the top 25 collaborators of Chunhua Hu. A scholar is included among the top collaborators of Chunhua Hu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chunhua Hu. Chunhua Hu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wen, Tian & Chunhua Hu. (2025). Arrhenius model-based analysis of high-temperature properties and temperature sensitivity of SBS/CR modified asphalt. Construction and Building Materials. 476. 141298–141298. 3 indexed citations
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Wang, Jun, et al.. (2024). Study on high-efficiency vanadium removement using sulfate radical-based AOPs and its oxidation mechanism of landfilled metallurgical residues. Chemical Engineering Journal. 504. 158849–158849. 2 indexed citations
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Hu, Chunhua, et al.. (2024). Rheology and Aging Resistance of Asphalt Modified with Calcined Kaolin. Journal of Materials in Civil Engineering. 37(3).
7.
Yang, C.-C., T. Spooner, P. McLaughlin, et al.. (2016). Pre-liner dielectric nitridation for resistance reduction in copper interconnects. 89–91. 4 indexed citations
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Kelly, James J., T. Nogami, O. van der Straten, et al.. (2012). Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects. Journal of The Electrochemical Society. 159(10). D563–D569. 15 indexed citations
11.
Hu, Chunhua, Lynne Gignac, Chris Breslin, et al.. (2012). Electromigration in Cu(Al) and Cu(Mn) damascene lines. Journal of Applied Physics. 111(9). 40 indexed citations
12.
Hu, Chunhua & J. M. E. Harper. (2005). Copper Interconnect: Fabrication And Reliability. 96 2. 18–22. 3 indexed citations
13.
Hu, Chunhua, L. Gignac, & R. Rosenberg. (2005). Electromigration of Cu/low dielectric constant interconnects. Microelectronics Reliability. 46(2-4). 213–231. 109 indexed citations
14.
Hu, Chunhua, D. Canaperi, Lynne Gignac, et al.. (2004). Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects. 222–228. 37 indexed citations
15.
Kawasaki, H. & Chunhua Hu. (2002). An electromigration failure model of tungsten plug contacts/vias for realistic lifetime prediction. 192–193. 6 indexed citations
16.
Liniger, E., Lynne Gignac, Chunhua Hu, & S. Kaldor. (2002). In situ study of void growth kinetics in electroplated Cu lines. Journal of Applied Physics. 92(4). 1803–1810. 55 indexed citations
17.
Hu, Chunhua. (1995). Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnections. Thin Solid Films. 260(1). 124–134. 50 indexed citations
18.
Hu, Chunhua, et al.. (1993). Electromigration in two-level bamboo grain structure Al(Cu)/W interconnections. Materials Chemistry and Physics. 35(1). 95–98. 7 indexed citations
19.
Moy, D., David E. Seeger, J. P. Silverman, et al.. (1990). A 0.5 μm fully scaled two-level metal fully planarized interconnect structure fabricated with X-ray lithography. 9–10. 2 indexed citations
20.
Huntington, H. B., et al.. (1987). Experimental measurement of chemical diffusivity of Tin in Lead. Scripta Metallurgica. 21(2). 153–156. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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