K. Motoyama

548 total citations
36 papers, 246 citations indexed

About

K. Motoyama is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, K. Motoyama has authored 36 papers receiving a total of 246 indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 31 papers in Electronic, Optical and Magnetic Materials and 5 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in K. Motoyama's work include Copper Interconnects and Reliability (31 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (14 papers). K. Motoyama is often cited by papers focused on Copper Interconnects and Reliability (31 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (14 papers). K. Motoyama collaborates with scholars based in United States, Japan and Germany. K. Motoyama's co-authors include Nicholas A. Lanzillo, O. van der Straten, Huai Huang, T. Standaert, C. Penny, C.-C. Yang, Kiyoshi Fujii, K. Cheng, J. Demarest and Meng‐Dong He and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices.

In The Last Decade

K. Motoyama

29 papers receiving 218 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
K. Motoyama United States 10 203 156 45 37 27 36 246
D. Badami United States 7 283 1.4× 206 1.3× 64 1.4× 31 0.8× 52 1.9× 11 330
R. Augur Netherlands 9 233 1.1× 171 1.1× 49 1.1× 28 0.8× 51 1.9× 27 269
T. Standaert United States 14 426 2.1× 134 0.9× 56 1.2× 58 1.6× 23 0.9× 27 458
D. Restaino United States 6 153 0.8× 134 0.9× 26 0.6× 26 0.7× 34 1.3× 11 175
R. G. Filippi United States 11 413 2.0× 345 2.2× 45 1.0× 46 1.2× 52 1.9× 42 447
Pinhe Wang Denmark 11 221 1.1× 109 0.7× 48 1.1× 39 1.1× 38 1.4× 31 274
N. Jourdan Belgium 11 309 1.5× 161 1.0× 51 1.1× 75 2.0× 37 1.4× 26 342
Meike Hauschildt Germany 11 284 1.4× 249 1.6× 26 0.6× 30 0.8× 38 1.4× 31 298
Soon‐Cheon Seo United States 9 211 1.0× 142 0.9× 81 1.8× 41 1.1× 91 3.4× 17 269
Ennis T. Ogawa United States 10 303 1.5× 263 1.7× 49 1.1× 27 0.7× 67 2.5× 20 358

Countries citing papers authored by K. Motoyama

Since Specialization
Citations

This map shows the geographic impact of K. Motoyama's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Motoyama with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Motoyama more than expected).

Fields of papers citing papers by K. Motoyama

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. Motoyama. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Motoyama. The network helps show where K. Motoyama may publish in the future.

Co-authorship network of co-authors of K. Motoyama

This figure shows the co-authorship network connecting the top 25 collaborators of K. Motoyama. A scholar is included among the top collaborators of K. Motoyama based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. Motoyama. K. Motoyama is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Motoyama, K. & O. van der Straten. (2024). Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects. ECS Journal of Solid State Science and Technology. 13(9). 94001–94001.
3.
4.
Lanzillo, Nicholas A., K. Motoyama, Huai Huang, Robert R. Robison, & T. Spooner. (2020). Via resistance and reliability trends in copper interconnects with ultra-scaled barrier layers. Applied Physics Letters. 116(16). 12 indexed citations
5.
Ryan, E. Todd, K. Motoyama, Nicholas A. Lanzillo, et al.. (2019). An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines. AIP Advances. 9(2). 21 indexed citations
6.
Kong, Dexin, K. Motoyama, Huai Huang, et al.. (2019). Machine learning and hybrid metrology using scatterometry and LE-XRF to detect voids in copper lines. 9–9. 9 indexed citations
7.
Patlolla, R., K. Motoyama, B. Peethala, et al.. (2018). CMP Development for Ru Liner Structures beyond 14nm. ECS Journal of Solid State Science and Technology. 7(8). P397–P401. 12 indexed citations
8.
Hu, Chunhua, L. Gignac, G. Lian, et al.. (2018). Mechanisms of Electromigration Damage in Cu Interconnects. 5.2.1–5.2.4. 19 indexed citations
9.
Huang, Huai, Nicholas A. Lanzillo, T. Standaert, et al.. (2018). Impact of Liner Metals on Copper Resistivity at Beyond 7nm Dimensions. 13–15. 8 indexed citations
10.
Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Transactions. 80(4). 297–309. 2 indexed citations
11.
Kim, Kwang-Hoon, et al.. (2015). Hybridization of XRF/XPS and scatterometry for Cu CMP process control. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9424. 94241M–94241M. 4 indexed citations
12.
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Straten, O. van der, et al.. (2014). ALD and PVD Tantalum Nitride Barrier Resistivity and Their Significance in via Resistance Trends. ECS Transactions. 64(9). 117–122. 11 indexed citations
14.
Motoyama, K. & Kiyoshi Fujii. (2012). Highly Reliable and Low Resistive Cu/Low-k Dual Damascene Interconnects by Using TaTi Barrier Metal. ECS Journal of Solid State Science and Technology. 1(6). P279–P284. 1 indexed citations
15.
Tada, Munehiro, H. Ohtake, N. Furutake, et al.. (2006). A metallurgical prescription for electromigration (EM) reliability improvment in scaled-down, Cu dual damascene interconnects. 89–91. 3 indexed citations
16.
17.
Tonegawa, Takashi, et al.. (2004). Suppression of bimodal stress-induced voiding using high-diffusive dopant from Cu-alloy seed layer. 216–218. 6 indexed citations
18.
19.
Ueno, Kazuyoshi, M. Suzuki, Akira Matsumoto, et al.. (2002). A high reliability copper dual-damascene interconnection with direct-contact via structure. 265–268. 8 indexed citations
20.
Motoyama, K., et al.. (1993). A Study on Friction Characteristics and Durability of LSD Oils. SAE technical papers on CD-ROM/SAE technical paper series. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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