S. Molis

485 total citations
29 papers, 325 citations indexed

About

S. Molis is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, S. Molis has authored 29 papers receiving a total of 325 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 14 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanics of Materials. Recurrent topics in S. Molis's work include Copper Interconnects and Reliability (14 papers), Semiconductor materials and devices (12 papers) and Synthesis and properties of polymers (6 papers). S. Molis is often cited by papers focused on Copper Interconnects and Reliability (14 papers), Semiconductor materials and devices (12 papers) and Synthesis and properties of polymers (6 papers). S. Molis collaborates with scholars based in United States, South Korea and France. S. Molis's co-authors include David R. Clarke, Shaw Ling Hsu, William J. MacKnight, A. Grill, Defeng Shen, Christos Dimitrakopoulos, C. Feger, E. Todd Ryan, D. Edelstein and S. A. Cohen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

S. Molis

28 papers receiving 307 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
S. Molis United States	10	171	107	105	77	71	29	325
F. Redmann Germany	12	218 1.3×	154 1.4×	34 0.3×	27 0.4×	92 1.3×	25	372
Hong-Lim Lee South Korea	10	149 0.9×	33 0.3×	63 0.6×	114 1.5×	284 4.0×	35	407
Xiangang Xu China	10	215 1.3×	32 0.3×	56 0.5×	42 0.5×	224 3.2×	29	356
Jonathan Moghal United Kingdom	10	164 1.0×	54 0.5×	31 0.3×	58 0.8×	212 3.0×	14	384
Ji Shi Japan	12	164 1.0×	72 0.7×	78 0.7×	85 1.1×	301 4.2×	41	387
John Persic Canada	13	277 1.6×	121 1.1×	37 0.4×	45 0.6×	150 2.1×	33	460
L. Ouellet Canada	11	219 1.3×	79 0.7×	70 0.7×	35 0.5×	183 2.6×	19	342
Tatsuo Fukami Japan	12	256 1.5×	50 0.5×	56 0.5×	131 1.7×	312 4.4×	52	426
Sandeep Dalal India	8	178 1.0×	53 0.5×	54 0.5×	79 1.0×	179 2.5×	26	356

Countries citing papers authored by S. Molis

Since Specialization

Citations

This map shows the geographic impact of S. Molis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Molis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Molis more than expected).

Fields of papers citing papers by S. Molis

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Molis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Molis. The network helps show where S. Molis may publish in the future.

Co-authorship network of co-authors of S. Molis

This figure shows the co-authorship network connecting the top 25 collaborators of S. Molis. A scholar is included among the top collaborators of S. Molis based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Molis. S. Molis is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Ryan, E. Todd & S. Molis. (2017). A plasmaless, photochemical etch process for porous organosilicate glass films. Journal of Applied Physics. 122(24). 2 indexed citations

Peethala, B., Frank W. Mont, S. Molis, et al.. (2016). Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures. Microelectronic Engineering. 161. 98–103. 4 indexed citations

Tseng, Wei‐Tsu, et al.. (2015). Post cleaning and defect reduction for tungsten chemical mechanical planarization. 1–5. 3 indexed citations

Priyadarshini, Deepika, S. Nguyen, H. Shobha, et al.. (2015). Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects. ECS Meeting Abstracts. MA2015-02(18). 824–824. 1 indexed citations

Tseng, Wei‐Tsu, et al.. (2013). Hybrid clean approach for post-copper CMP defect reduction. ma2012 2. 346–351. 1 indexed citations

Nguyen, S., A. Grill, S. A. Cohen, et al.. (2012). Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices. ECS Transactions. 41(43). 3–9. 4 indexed citations

Hopstaken, Marinus, Douglas R. Pfeiffer, M. Copel, et al.. (2012). Physical characterization of sub‐32‐nm semiconductor materials and processes using advanced ion beam–based analytical techniques. Surface and Interface Analysis. 45(1). 338–344. 2 indexed citations

Shobha, H., Anita Madan, Richard J. Murphy, et al.. (2011). Improvement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner. 8 5. 1–3. 2 indexed citations

Ryan, E. Todd, S. Molis, & A. Grill. (2009). Silane Decomposition on Cu Interconnects Inhibited by Ammonia. Journal of The Electrochemical Society. 157(1). H78–H78. 2 indexed citations

10.

Belyansky, Michael, M. A. Chace, Oleg Gluschenkov, et al.. (2008). Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 26(3). 517–521. 26 indexed citations

11.

Fuller, Nicholas, et al.. (2006). Post Implant Strip Optimization for 90nm and Beyond Technologies. 289–291.

12.

Aboelfotoh, M. O., et al.. (1993). Dielectric loss in thin films of an aromatic polyimide. Applied Physics Letters. 62(18). 2286–2288. 10 indexed citations

13.

Molis, S., et al.. (1991). Characterization of rapid thermal curing of polyimides. 1700–1702. 1 indexed citations

14.

Molis, S., et al.. (1991). Hydrothermal stability of Cr/polyimide interfaces. Journal of Adhesion Science and Technology. 5(7). 509–521. 9 indexed citations

15.

Kowalczyk, Steven P., Christos Dimitrakopoulos, & S. Molis. (1991). Growth Of Polyimide Films By Chemical Vapor Deposition And Their Characterization. MRS Proceedings. 227. 9 indexed citations

16.

Oh, Tae Sung, et al.. (1990). Effect of RF Sputtering on T/H Susceptibility of Cr/Polyimide Adhesion. MRS Proceedings. 203. 1 indexed citations

17.

Thomas, Ο., S. Molis, F. M. d’Heurle, et al.. (1989). Some properties of CrxV1−xSi2 and CrxMo1−xSi2 thin films. Applied Surface Science. 38(1-4). 94–105. 3 indexed citations

18.

Feger, C., S. Molis, Shaw Ling Hsu, & William J. MacKnight. (1984). Properties of partially cured networks. 1. Curing kinetics of a model network. Macromolecules. 17(9). 1830–1834. 20 indexed citations

19.

Molis, S., William J. MacKnight, & Shaw Ling Hsu. (1984). Deformation Studies of Polymers by Time-Resolved Infrared Spectroscopy IV: A Modified Approach. Applied Spectroscopy. 38(4). 529–537. 20 indexed citations

20.

Shen, Defeng, S. Molis, & Shaw Ling Hsu. (1983). Vibrational spectroscopic characterization of rigid rod polymers: IV. Crystalline modifications of poly(p‐phenylene terephthalamide). Polymer Engineering and Science. 23(10). 543–547. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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