D. Edelstein

3.6k total citations
86 papers, 2.2k citations indexed

About

D. Edelstein is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, D. Edelstein has authored 86 papers receiving a total of 2.2k indexed citations (citations by other indexed papers that have themselves been cited), including 80 papers in Electrical and Electronic Engineering, 57 papers in Electronic, Optical and Magnetic Materials and 10 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in D. Edelstein's work include Copper Interconnects and Reliability (57 papers), Semiconductor materials and devices (52 papers) and Electronic Packaging and Soldering Technologies (32 papers). D. Edelstein is often cited by papers focused on Copper Interconnects and Reliability (57 papers), Semiconductor materials and devices (52 papers) and Electronic Packaging and Soldering Technologies (32 papers). D. Edelstein collaborates with scholars based in United States, Israel and France. D. Edelstein's co-authors include R. Rosenberg, C.‐K. Hu, K. P. Rodbell, Joachim N. Burghartz, C.-C. Yang, K.A. Jenkins, M. Soyuer, Y. J. Mii, G.A. Sai-Halasz and H. Ainspan and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Proceedings of the IEEE.

In The Last Decade

D. Edelstein

80 papers receiving 2.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
D. Edelstein United States	21	1.9k	1.0k	291	271	260	86	2.2k
Zs. Tôkei Belgium	24	1.5k 0.8×	930 0.9×	390 1.3×	240 0.9×	291 1.1×	133	1.9k
Jean‐Luc Autran France	27	2.7k 1.4×	290 0.3×	700 2.4×	116 0.4×	284 1.1×	174	3.0k
N. Nakayama Japan	19	867 0.5×	822 0.8×	881 3.0×	90 0.3×	228 0.9×	86	1.9k
C. Jahnes United States	28	1.2k 0.6×	463 0.4×	944 3.2×	548 2.0×	783 3.0×	90	2.5k
C.‐K. Hu United States	20	2.2k 1.1×	2.0k 1.9×	358 1.2×	526 1.9×	344 1.3×	49	2.5k
Maxime Darnon France	18	951 0.5×	351 0.3×	234 0.8×	368 1.4×	129 0.5×	98	1.1k
T.S. Cale United States	18	706 0.4×	223 0.2×	322 1.1×	247 0.9×	77 0.3×	83	1.2k
Ulrike Großner Switzerland	24	1.8k 1.0×	434 0.4×	842 2.9×	110 0.4×	356 1.4×	190	2.3k
Xingji Li China	26	1.6k 0.8×	499 0.5×	921 3.2×	51 0.2×	265 1.0×	245	2.5k
Daniel J. Lichtenwalner United States	28	2.0k 1.1×	337 0.3×	845 2.9×	259 1.0×	360 1.4×	120	2.5k

Countries citing papers authored by D. Edelstein

Since Specialization

Citations

This map shows the geographic impact of D. Edelstein's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Edelstein with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Edelstein more than expected).

Fields of papers citing papers by D. Edelstein

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Edelstein. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Edelstein. The network helps show where D. Edelstein may publish in the future.

Co-authorship network of co-authors of D. Edelstein

This figure shows the co-authorship network connecting the top 25 collaborators of D. Edelstein. A scholar is included among the top collaborators of D. Edelstein based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Edelstein. D. Edelstein is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Edelstein, D., S. Nguyen, Huai Huang, et al.. (2024). The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology. 1–4.

Lanzillo, Nicholas A. & D. Edelstein. (2022). Reliability and resistance projections for rhodium and iridium interconnects from first-principles. Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena. 40(5). 7 indexed citations

Schmidt, Daniel, et al.. (2022). Scatterometry-based methodologies for characterization of MRAM technology. 41–41. 1 indexed citations

Nogami, T., R. Patlolla, James J. Kelly, et al.. (2017). Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines. 1–3. 18 indexed citations

Kelly, James J., Huai Huang, C.‐K. Hu, et al.. (2016). Experimental study of nanoscale Co damascene BEOL interconnect structures. 40–42. 43 indexed citations

Yang, C.-C., T. Spooner, P. McLaughlin, et al.. (2016). Pre-liner dielectric nitridation for resistance reduction in copper interconnects. 89–91. 4 indexed citations

Yang, C.-C., et al.. (2015). Enhanced electromigration resistance through grain size modulation in copper interconnects. 1–5. 2 indexed citations

Carta, Fabio, S. M. Gates, Htay Hlaing, et al.. (2014). Sequential lateral solidification of silicon thin films on low-k dielectrics for low temperature integration. Applied Physics Letters. 105(24). 6 indexed citations

Kelly, James J., T. Nogami, O. van der Straten, et al.. (2014). Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers. ECS Transactions. 58(17). 17–28. 2 indexed citations

10.

Washington, Joseph R., D.L. Rath, Spyridon Skordas, et al.. (2014). Copper-to-dielectric heterogeneous bonding for 3D integration. 6–6.

11.

Yang, C.-C., et al.. (2010). Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects. IEEE Electron Device Letters. 31(7). 722–724. 69 indexed citations

12.

Edelstein, D., Kaushik Chanda, E. Liniger, et al.. (2009). Integration and reliability of CVD Ru cap for Cu/Low-k development. 255–257. 3 indexed citations

13.

Nitta, S., D. Edelstein, S. Ponoth, et al.. (2008). Performance and reliability of airgaps for advanced BEOL Interconnects. 191–192. 14 indexed citations

14.

Edelstein, D., A. Cowley, J. Gill, et al.. (2005). Extendibility of PVD barrier/seed for BEOL Cu metallization. 135–137. 2 indexed citations

15.

Deutsch, A., H. Smith, G.V. Kopcsay, D. Edelstein, & P. Coteus. (2003). On-chip wiring design challenges for GHz operation. 45–48. 4 indexed citations

16.

Burghartz, Joachim N., D. Edelstein, M. Soyuer, H. Ainspan, & K.A. Jenkins. (1998). Spiral Inductors on Silicon.

17.

Eyal, Aharon M., et al.. (1992). Premembranes for porogen‐derived membranes and thermal decomposition of porogens. Journal of Applied Polymer Science. 45(6). 1065–1074. 8 indexed citations

18.

Heinrich, H., et al.. (1992). Optical detection of multibit logic signals at internal nodes in a flip-chip mounted silicon static random-access memory integrated circuit. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 10(6). 3109–3111. 2 indexed citations

19.

Edelstein, D.. (1990). New Sources and Techniques for Ultrafast Laser Spectroscopy. PhDT. 3 indexed citations

20.

Bell, Wendell, et al.. (1984). American spinal injury association (ASIA). Spinal Cord. 22(1). 45–54. 19 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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