N. Jourdan

619 total citations
26 papers, 342 citations indexed

About

N. Jourdan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, N. Jourdan has authored 26 papers receiving a total of 342 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 8 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in N. Jourdan's work include Copper Interconnects and Reliability (17 papers), Semiconductor materials and devices (17 papers) and Electronic Packaging and Soldering Technologies (8 papers). N. Jourdan is often cited by papers focused on Copper Interconnects and Reliability (17 papers), Semiconductor materials and devices (17 papers) and Electronic Packaging and Soldering Technologies (8 papers). N. Jourdan collaborates with scholars based in Belgium, United States and France. N. Jourdan's co-authors include Zs. Tôkei, Kristof Croes, Marleen H. van der Veen, Olalla Varela Pedreira, J. Bömmels, Ivan Ciofi, Christopher J. Wilson, Herbert Struyf, K. Vandersmissen and Chen Wu and has published in prestigious journals such as IEEE Transactions on Electron Devices, Journal of Crystal Growth and Microelectronics Reliability.

In The Last Decade

N. Jourdan

24 papers receiving 325 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
N. Jourdan Belgium 11 309 161 75 51 37 26 342
Gayle Murdoch Belgium 11 296 1.0× 131 0.8× 64 0.9× 69 1.4× 34 0.9× 39 346
Yong Kong Siew Belgium 9 204 0.7× 125 0.8× 44 0.6× 50 1.0× 30 0.8× 25 246
Dong Kyun Sohn Singapore 12 351 1.1× 64 0.4× 114 1.5× 68 1.3× 21 0.6× 46 386
S. Luce United States 6 259 0.8× 146 0.9× 38 0.5× 40 0.8× 43 1.2× 11 300
Shibesh Dutta Belgium 10 278 0.9× 171 1.1× 100 1.3× 99 1.9× 27 0.7× 18 324
Sergey Lopatin United States 8 272 0.9× 124 0.8× 70 0.9× 67 1.3× 16 0.4× 16 300
R. Schulz United States 7 296 1.0× 124 0.8× 29 0.4× 29 0.6× 30 0.8× 14 326
Chen Wu Belgium 11 391 1.3× 290 1.8× 79 1.1× 93 1.8× 73 2.0× 37 460
R. Goldblatt United States 8 278 0.9× 135 0.8× 28 0.4× 65 1.3× 53 1.4× 15 359
T. Conard Belgium 6 346 1.1× 84 0.5× 44 0.6× 192 3.8× 32 0.9× 19 390

Countries citing papers authored by N. Jourdan

Since Specialization
Citations

This map shows the geographic impact of N. Jourdan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Jourdan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Jourdan more than expected).

Fields of papers citing papers by N. Jourdan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Jourdan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Jourdan. The network helps show where N. Jourdan may publish in the future.

Co-authorship network of co-authors of N. Jourdan

This figure shows the co-authorship network connecting the top 25 collaborators of N. Jourdan. A scholar is included among the top collaborators of N. Jourdan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Jourdan. N. Jourdan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhao, Peng, Liesbeth Witters, Anne Jourdain, et al.. (2024). Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias. IEEE Transactions on Electron Devices. 71(12). 7963–7969. 2 indexed citations
2.
Veen, Marleen H. van der, Jan Willem Maes, Olalla Varela Pedreira, et al.. (2023). Selective ALD Mo Deposition in 10nm Contacts. 1–3. 2 indexed citations
3.
Gonzalez, Vernadette Vicuña, D. Radisic, Stefan Decoster, et al.. (2023). Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track Standard Cell Architecture as Scaling Booster. 1–3.
4.
Pedreira, Olalla Varela, Gerardo Martínez, Dmitry Batuk, et al.. (2022). Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below. 48–50. 1 indexed citations
5.
Veen, Marleen H. van der, Olalla Varela Pedreira, N. Jourdan, et al.. (2022). Low Resistance Cu Vias for 24nm Pitch and Beyond. 129–131. 5 indexed citations
6.
Veen, Marleen H. van der, Olalla Varela Pedreira, N. Heylen, et al.. (2021). Exploring W-Cu hybrid dual damascene metallization for future nodes. 64. 1–3. 1 indexed citations
7.
Leśniewska, A., Ph. Roussel, Marleen H. van der Veen, et al.. (2020). Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. 1–6. 10 indexed citations
8.
Pedreira, Olalla Varela, et al.. (2019). Cobalt and Ruthenium drift in ultra-thin oxides. Microelectronics Reliability. 100-101. 113407–113407. 9 indexed citations
9.
Matagne, Philippe, Hiroaki Nakamura, Yoshiaki Kikuchi, et al.. (2018). DTCO and TCAD for a 12 Layer-EUV Ultra-Scaled Surrounding Gate Transistor 6T-SRAM. 45–48. 3 indexed citations
10.
Pedreira, Olalla Varela, Kristof Croes, A. Leśniewska, et al.. (2017). Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects. 6B–2.1. 62 indexed citations
11.
Veen, Marleen H. van der, N. Jourdan, Christopher J. Wilson, et al.. (2016). Barrier/liner stacks for scaling the Cu interconnect metallization. 28–30. 19 indexed citations
12.
Tôkei, Zs., Ivan Ciofi, Ph. Roussel, et al.. (2016). On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control. 1–2. 17 indexed citations
13.
Tang, Bao-Jun, Kristof Croes, N. Jourdan, et al.. (2015). Constant voltage electromigration for advanced BEOL copper interconnects. Lirias (KU Leuven). 2D.6.1–2D.6.5. 1 indexed citations
14.
Siew, Yong Kong, N. Jourdan, S. Demuynck, et al.. (2013). CVD Mn-based self-formed barrier for advanced interconnect technology. 1–3. 8 indexed citations
15.
Jourdan, N., Y. Barbarin, Kristof Croes, et al.. (2012). Plasma Enhanced Chemical Vapor Deposition of Manganese on Low-k Dielectrics for Copper Diffusion Barrier Application. ECS Solid State Letters. 2(3). P25–P27. 10 indexed citations
16.
Redolfi, A., Dimitrios Velenis, Patrick Jaenen, et al.. (2011). Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers. 1384–1388. 43 indexed citations
17.
Berthomé, G., et al.. (2008). XPS studies of the ALD-growth of TaN diffusion barriers: Impact of the dielectric surface chemistry on the growth mechanism. Microelectronic Engineering. 85(10). 2068–2070. 23 indexed citations
18.
Arnal, V., A. Farcy, V. Jousseaume, et al.. (2007). Materials and processes for high signal propagation performance and reliable 32 nm node BEOL. 1–3. 3 indexed citations
19.
Bertrand, G., Alexandre Giry, M. Minondo, et al.. (2005). LDMOS modeling for analog and RF circuit design. 469–472. 13 indexed citations
20.
Jourdan, N., et al.. (1992). Heavily doped GaAs(Be)/GaAlAs HBTs grown by MBE with high device performances and high thermal stability. IEEE Transactions on Electron Devices. 39(4). 767–770. 24 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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