N. Jourdan

619 citations

26 papers · 342 indexed · h-index 11

Co-authors: Zs. Tôkei Kristof Croes Marleen H. van der Veen Olalla Varela Pedreira J. Bömmels Ivan Ciofi Christopher J. Wilson Herbert Struyf
Topics: Copper Interconnects and Reliability (17 papers)Semiconductor materials and devices (17 papers)Electronic Packaging and Soldering Technologies (8 papers)
Cited by: Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Atomic and Molecular Physics, and Optics
Journals: IEEE Transactions on Electron Devices Journal of Crystal Growth Microelectronics Reliability
Partner nations: Belgium United States France

In The Last Decade

N. Jourdan

24 papers receiving 325 citations

Peers

Countries citing papers authored by N. Jourdan

Since Specialization

Citations

This map shows the geographic impact of N. Jourdan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Jourdan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Jourdan more than expected).

Fields of papers citing papers by N. Jourdan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Jourdan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Jourdan. The network helps show where N. Jourdan may publish in the future.

Co-authorship network of co-authors of N. Jourdan

This figure shows the co-authorship network connecting the top 25 collaborators of N. Jourdan. A scholar is included among the top collaborators of N. Jourdan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Jourdan. N. Jourdan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias 2024 ·IEEE Transactions on Electron Devices ·Peng Zhao,Liesbeth Witters,Anne Jourdain,Michele Stucchi,N. Jourdan,Jan Willem Maes,(unknown),(unknown),(unknown),Farid Sebaai,K. Vandersmissen,N. Heylen,(unknown),(unknown),(unknown),Filip Schleicher,Joeri De Vos,Gerald Beyer,Andy Miller,Eric Beyne	2
2	Selective ALD Mo Deposition in 10nm Contacts 2023 ·Marleen H. van der Veen,Jan Willem Maes,Olalla Varela Pedreira,(unknown),(unknown),(unknown),N. Jourdan,Stefan Decoster,Chen Wu,(unknown),Youngchul Byun,Herbert Struyf,(unknown),Zsolt Tökei	2
3	Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track Standard Cell Architecture as Scaling Booster 2023 ·(unknown),Vernadette Vicuña Gonzalez,(unknown),D. Radisic,Stefan Decoster,Souvik Kundu,Yannick Hermans,Bart Kenens,(unknown),(unknown),A. Peter,(unknown),N. Jourdan,(unknown),Julien Ryckaert,Gayle Murdoch,(unknown),Zsolt Tökei	0
4	Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below 2022 ·(unknown),(unknown),(unknown),Olalla Varela Pedreira,(unknown),Gerardo Martínez,Dmitry Batuk,Harinarayanan Puliyalil,Janko Versluijs,(unknown),(unknown),N. Jourdan,(unknown),Frédéric Lazzarino,Gayle Murdoch,(unknown),Zsolt Tökei	1
5	Low Resistance Cu Vias for 24nm Pitch and Beyond 2022 ·Marleen H. van der Veen,Olalla Varela Pedreira,N. Jourdan,(unknown),Herbert Struyf,Zs. Tôkei,(unknown),(unknown),(unknown),(unknown),(unknown),(unknown),Andrew Cockburn	5
6	Exploring W-Cu hybrid dual damascene metallization for future nodes 2021 ·Marleen H. van der Veen,Olalla Varela Pedreira,N. Heylen,N. Jourdan,(unknown),(unknown),Herbert Struyf,Zs. Tôkei,(unknown),(unknown),(unknown),(unknown),(unknown),(unknown),Andrew Cockburn,(unknown)	1
7	Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill 2020 ·A. Leśniewska,Ph. Roussel,(unknown),(unknown),Marleen H. van der Veen,Patrick Verdonck,N. Jourdan,Christopher Wilson,Zs. Tôkei,Kristof Croes	10
8	Cobalt and Ruthenium drift in ultra-thin oxides 2019 ·Microelectronics Reliability ·(unknown),Olalla Varela Pedreira,Chen Wu,N. Jourdan,(unknown),Zs. Tôkei,Kristof Croes	9
9	DTCO and TCAD for a 12 Layer-EUV Ultra-Scaled Surrounding Gate Transistor 6T-SRAM 2018 ·Philippe Matagne,Hiroaki Nakamura,(unknown),Yoshiaki Kikuchi,Trong Huynh-Bao,Zheng Tao,(unknown),K. Devriendt,Lars‐Åke Ragnarsson,Juergen Boemmels,A. Mallik,(unknown),Farid Sebaai,(unknown),N. Jourdan,Clément Porret,D. Mocuta,(unknown),F. Masuoka	3
10	Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects 2017 ·Olalla Varela Pedreira,Kristof Croes,A. Leśniewska,Chen Wu,Marleen H. van der Veen,Joke De Messemaeker,K. Vandersmissen,N. Jourdan,(unknown),Christoph Adelmann,B. Briggs,(unknown),J. Bömmels,Zs. Tôkei	62
11	Barrier/liner stacks for scaling the Cu interconnect metallization 2016 ·Marleen H. van der Veen,N. Jourdan,(unknown),Christopher J. Wilson,N. Heylen,Olalla Varela Pedreira,Herbert Struyf,Kristof Croes,J. Bömmels,Zs. Tôkei	19
12	On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control 2016 ·Zs. Tôkei,Ivan Ciofi,Ph. Roussel,Peter Debacker,Prasanth Raghavan,Marleen H. van der Veen,N. Jourdan,Christopher Wilson,(unknown),Christoph Adelmann,Lianggong Wen,Kristof Croes,(unknown),Mikhail Krishtab,Silvia Armini,J. Bömmels	17
13	Constant voltage electromigration for advanced BEOL copper interconnects 2015 ·Lirias (KU Leuven) ·Bao-Jun Tang,Kristof Croes,N. Jourdan,J. Bömmels,Zs. Tôkei,Ingrid De Wolf,(unknown),(unknown)	1
14	CVD Mn-based self-formed barrier for advanced interconnect technology 2013 ·Yong Kong Siew,N. Jourdan,(unknown),(unknown),S. Demuynck,Kristof Croes,Jennifer F. Tseng,Hui‐wang Ai,(unknown),(unknown),(unknown),(unknown),Michaël Abraham,Andrew Cockburn,J. Bömmels,Zs. Tôkei	8
15	Plasma Enhanced Chemical Vapor Deposition of Manganese on Low-k Dielectrics for Copper Diffusion Barrier Application 2012 ·ECS Solid State Letters ·N. Jourdan,Y. Barbarin,Kristof Croes,Yong Kong Siew,Sven Van Elshocht,Zs. Tôkei,E. Vancoille	10
16	Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers 2011 ·A. Redolfi,Dimitrios Velenis,(unknown),(unknown),Patrick Jaenen,(unknown),(unknown),Els Van Besien,Harold Dekkers,T. Witters,N. Jourdan,(unknown),K. Vandersmissen,(unknown),Harold Philipsen,Aleksandar Radisic,N. Heylen,Youssef Travaly,Bart Swinnen,Eric Beyne	43
17	XPS studies of the ALD-growth of TaN diffusion barriers: Impact of the dielectric surface chemistry on the growth mechanism 2008 ·Microelectronic Engineering ·(unknown),(unknown),G. Berthomé,E. Blanquet,N. Jourdan,J. Torrès	23
18	Materials and processes for high signal propagation performance and reliable 32 nm node BEOL 2007 ·V. Arnal,A. Farcy,(unknown),V. Jousseaume,L.G. Gosset,(unknown),M. Assous,L. Favennec,A. Zenasni,David Tormey,(unknown),(unknown),N. Jourdan,(unknown),Thierry Mourier,(unknown),S. Maı̂trejean,C. Guedj,J. Torrès	3
19	LDMOS modeling for analog and RF circuit design 2005 ·(unknown),G. Bertrand,Alexandre Giry,M. Minondo,(unknown),H. Jaouen,(unknown),N. Jourdan,J.P. Chante	13
20	Heavily doped GaAs(Be)/GaAlAs HBTs grown by MBE with high device performances and high thermal stability 1992 ·IEEE Transactions on Electron Devices ·N. Jourdan,F. Alexandre,C. Dubon‐Chevallier,(unknown),Yuqing Gao	24

About N. Jourdan

N. Jourdan is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Atomic and Molecular Physics, and Optics, having authored 26 papers that have together received 342 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (17 papers), Semiconductor materials and devices (17 papers) and Electronic Packaging and Soldering Technologies (8 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (161 citations), Electrical and Electronic Engineering (309 citations) and Atomic and Molecular Physics, and Optics (75 citations). N. Jourdan has collaborated with scholars based in Belgium, United States and France. Frequent co-authors include Zs. Tôkei, Kristof Croes, Marleen H. van der Veen, Olalla Varela Pedreira, J. Bömmels, Ivan Ciofi, Christopher J. Wilson, Herbert Struyf, K. Vandersmissen and Chen Wu. Their work appears in journals such as IEEE Transactions on Electron Devices, Journal of Crystal Growth and Microelectronics Reliability.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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