B. Peethala

1.0k total citations
31 papers, 604 citations indexed

About

B. Peethala is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, B. Peethala has authored 31 papers receiving a total of 604 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 15 papers in Electronic, Optical and Magnetic Materials and 15 papers in Biomedical Engineering. Recurrent topics in B. Peethala's work include Semiconductor materials and devices (19 papers), Copper Interconnects and Reliability (15 papers) and Advanced Surface Polishing Techniques (14 papers). B. Peethala is often cited by papers focused on Semiconductor materials and devices (19 papers), Copper Interconnects and Reliability (15 papers) and Advanced Surface Polishing Techniques (14 papers). B. Peethala collaborates with scholars based in United States, Germany and Austria. B. Peethala's co-authors include S. V. Babu, H. P. Amanapu, D. Roy, R. Patlolla, Artem Melman, H. Shobha, V. Kamineni, James J. Kelly, Huai Huang and T. Nogami and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Colloid and Interface Science and Applied Surface Science.

In The Last Decade

B. Peethala

27 papers receiving 591 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
B. Peethala United States 14 433 347 301 139 122 31 604
H. P. Amanapu United States 12 345 0.8× 239 0.7× 212 0.7× 80 0.6× 97 0.8× 14 427
Darja Jenko Slovenia 12 243 0.6× 335 1.0× 514 1.7× 164 1.2× 65 0.5× 17 577
Jeong Hwan Park South Korea 14 173 0.4× 272 0.8× 584 1.9× 126 0.9× 88 0.7× 24 649
Hong-Lim Lee South Korea 10 114 0.3× 149 0.4× 284 0.9× 63 0.5× 88 0.7× 35 407
Yongwei Zhu China 10 122 0.3× 71 0.2× 311 1.0× 48 0.3× 81 0.7× 29 403
Hare Ram Aryal Japan 13 158 0.4× 185 0.5× 351 1.2× 41 0.3× 18 0.1× 33 441
Daniel J. Skamser United States 9 120 0.3× 384 1.1× 463 1.5× 63 0.5× 60 0.5× 14 610
Guoshun Pan China 11 194 0.4× 150 0.4× 207 0.7× 20 0.1× 192 1.6× 20 434
Curtis Hill United States 9 188 0.4× 161 0.5× 113 0.4× 100 0.7× 26 0.2× 41 378
Tarek Ragab United States 16 139 0.3× 150 0.4× 516 1.7× 24 0.2× 52 0.4× 34 592

Countries citing papers authored by B. Peethala

Since Specialization
Citations

This map shows the geographic impact of B. Peethala's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Peethala with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Peethala more than expected).

Fields of papers citing papers by B. Peethala

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B. Peethala. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Peethala. The network helps show where B. Peethala may publish in the future.

Co-authorship network of co-authors of B. Peethala

This figure shows the co-authorship network connecting the top 25 collaborators of B. Peethala. A scholar is included among the top collaborators of B. Peethala based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with B. Peethala. B. Peethala is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Nogami, T., Oleg Gluschenkov, Son T. Nguyen, et al.. (2022). Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). 423–424. 6 indexed citations
2.
Peethala, B., Devika Sil, Nicholas A. Lanzillo, et al.. (2021). Metal Wet Recess Challenges and Solutions for beyond 7nm Fully Aligned Via Integration. 1–3. 1 indexed citations
3.
Nguyen, S., H. Shobha, T. Nogami, et al.. (2020). Novel low k Dielectric materials for nano device interconnect technology. 11306. 117–118. 2 indexed citations
4.
Peethala, B., et al.. (2020). Impact of Process Chambers Exhaust on Wafer Defectivity in Wet Clean tools. 1–4. 1 indexed citations
5.
Patlolla, R., K. Motoyama, B. Peethala, et al.. (2018). CMP Development for Ru Liner Structures beyond 14nm. ECS Journal of Solid State Science and Technology. 7(8). P397–P401. 12 indexed citations
6.
Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Transactions. 80(4). 297–309. 2 indexed citations
7.
Nogami, T., R. Patlolla, James J. Kelly, et al.. (2017). Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines. 1–3. 18 indexed citations
8.
Carr, Adra, B. Peethala, M. Raymond, et al.. (2017). Impact of surface preparation for n-type Si:P and p-type SiGe:B semiconductors on low resistance silicide contacts. Microelectronic Engineering. 173. 22–26. 7 indexed citations
9.
Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Meeting Abstracts. MA2017-02(26). 1122–1122.
10.
Kelly, James J., Huai Huang, C.‐K. Hu, et al.. (2016). Experimental study of nanoscale Co damascene BEOL interconnect structures. 40–42. 43 indexed citations
11.
Peethala, B., Frank W. Mont, S. Molis, et al.. (2016). Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures. Microelectronic Engineering. 161. 98–103. 4 indexed citations
12.
Washington, Joseph R., D.L. Rath, Spyridon Skordas, et al.. (2014). Copper-to-dielectric heterogeneous bonding for 3D integration. 6–6.
13.
Peethala, B., et al.. (2013). Role of hydrogen bonding on the adsorption of several amino acids on SiO2 and Si3N4 and selective polishing of these materials using ceria dispersions. Colloids and Surfaces A Physicochemical and Engineering Aspects. 429. 67–73. 37 indexed citations
14.
Peethala, B.. (2012). Chemical Mechanical Polishing of Ruthenium, Cobalt, and Black Diamond Films. PhDT. 1 indexed citations
15.
Peethala, B., et al.. (2012). Cobalt Polishing with Reduced Galvanic Corrosion at Copper/Cobalt Interface Using Hydrogen Peroxide as an Oxidizer in Colloidal Silica-Based Slurries. Journal of The Electrochemical Society. 159(6). H582–H588. 83 indexed citations
16.
Sankarapandian, M., et al.. (2012). The Risk of Pattern Collapse for Structures in Future Logic Devices. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 195. 107–109.
17.
Peethala, B. & S. V. Babu. (2011). Ruthenium Polishing Using Potassium Periodate as the Oxidizer and Silica Abrasives. Journal of The Electrochemical Society. 158(3). H271–H271. 53 indexed citations
18.
Peethala, B., et al.. (2011). Silicon Nitride Film Removal During Chemical Mechanical Polishing Using Ceria-Based Dispersions. Journal of The Electrochemical Society. 158(8). H763–H763. 19 indexed citations
19.
Peethala, B., D. Roy, & S. V. Babu. (2011). Controlling the Galvanic Corrosion of Copper during Chemical Mechanical Planarization of Ruthenium Barrier Films. Electrochemical and Solid-State Letters. 14(7). H306–H306. 67 indexed citations
20.
Peethala, B., et al.. (2010). Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films. Journal of Colloid and Interface Science. 348(1). 114–118. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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