H. Rathore

694 total citations
15 papers, 367 citations indexed

About

H. Rathore is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, H. Rathore has authored 15 papers receiving a total of 367 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanical Engineering. Recurrent topics in H. Rathore's work include Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (12 papers) and 3D IC and TSV technologies (4 papers). H. Rathore is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (12 papers) and 3D IC and TSV technologies (4 papers). H. Rathore collaborates with scholars based in United States. H. Rathore's co-authors include Cyprian Uzoh, A. Simon, D. Edelstein, R. Wachnik, N. Lustig, R. Goldblatt, S. Luce, John Dukovic, P. Roper and T.L. McDevitt and has published in prestigious journals such as Journal of Applied Physics, Microelectronics Reliability and AIP conference proceedings.

In The Last Decade

H. Rathore

14 papers receiving 346 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
H. Rathore United States 7 323 244 62 46 43 15 367
Ennis T. Ogawa United States 10 303 0.9× 263 1.1× 67 1.1× 27 0.6× 49 1.1× 20 358
D. Badami United States 7 283 0.9× 206 0.8× 52 0.8× 31 0.7× 64 1.5× 11 330
S. Luce United States 6 259 0.8× 146 0.6× 43 0.7× 38 0.8× 40 0.9× 11 300
R. Schulz United States 7 296 0.9× 124 0.5× 30 0.5× 29 0.6× 29 0.7× 14 326
D. Jawarani United States 10 284 0.9× 139 0.6× 44 0.7× 56 1.2× 80 1.9× 38 336
V. Arnal France 11 245 0.8× 192 0.8× 65 1.0× 29 0.6× 59 1.4× 44 297
Jeff Gambino United States 10 310 1.0× 108 0.4× 27 0.4× 60 1.3× 62 1.4× 59 344
R. G. Filippi United States 11 413 1.3× 345 1.4× 52 0.8× 46 1.0× 45 1.0× 42 447
David De Roest Belgium 9 297 0.9× 220 0.9× 110 1.8× 24 0.5× 53 1.2× 52 332
R. Augur Netherlands 9 233 0.7× 171 0.7× 51 0.8× 28 0.6× 49 1.1× 27 269

Countries citing papers authored by H. Rathore

Since Specialization
Citations

This map shows the geographic impact of H. Rathore's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Rathore with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Rathore more than expected).

Fields of papers citing papers by H. Rathore

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Rathore. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Rathore. The network helps show where H. Rathore may publish in the future.

Co-authorship network of co-authors of H. Rathore

This figure shows the co-authorship network connecting the top 25 collaborators of H. Rathore. A scholar is included among the top collaborators of H. Rathore based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Rathore. H. Rathore is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

15 of 15 papers shown
1.
2.
Chen, F., J. Gill, D. Harmon, et al.. (2005). Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures. Microelectronics Reliability. 46(2-4). 232–243. 8 indexed citations
3.
4.
Hu, C.‐K., et al.. (2003). Scaling effect on electromigration in on-chip Cu wiring. 267–269. 32 indexed citations
5.
Rathore, H., et al.. (2002). A dual damascene hard metal capped Cu and Al-alloy for interconnect wiring of ULSI circuits. 26. 273–276. 2 indexed citations
6.
Rathore, H., et al.. (2002). The effect of metal thickness on electromigration-induced extrusion shorts in submicron technology. 90 1. 57–63. 1 indexed citations
7.
Rathore, H., et al.. (2002). Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy. 242–248. 7 indexed citations
8.
Edelstein, D., J. Heidenreich, R. Goldblatt, et al.. (2002). Full copper wiring in a sub-0.25 μm CMOS ULSI technology. 773–776. 196 indexed citations
9.
Heidenreich, J., D. Edelstein, R. Goldblatt, et al.. (2002). Copper dual damascene wiring for sub-0.25 μm CMOS technology. 11. 151–153. 3 indexed citations
10.
Kwok, Thomas, et al.. (2002). Electromigration in a two-level Al-Cu interconnection with W studs. 106–112. 5 indexed citations
11.
Edelstein, D., Cyprian Uzoh, C. Cabral, et al.. (2001). A high performance liner for copper damascene interconnects. 9–11. 62 indexed citations
12.
Rathore, H., et al.. (1994). Electromigration reliability of AlCu interconnects with W studs. AIP conference proceedings. 305. 165–178. 5 indexed citations
13.
Børgesen, Peter, et al.. (1994). Stress evolution during stress migration and electromigration in passivated interconnect lines. AIP conference proceedings. 305. 231–253. 4 indexed citations
14.
Machlin, E.S., et al.. (1992). Roles of Ti-intermetallic compound layers on the electromigration resistance of Al-Cu interconnecting stripes. Journal of Applied Physics. 71(12). 5877–5887. 19 indexed citations
15.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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