H. Rathore

694 total citations
15 papers, 367 citations indexed

About

H. Rathore is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, H. Rathore has authored 15 papers receiving a total of 367 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanical Engineering. Recurrent topics in H. Rathore's work include Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (12 papers) and 3D IC and TSV technologies (4 papers). H. Rathore is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (12 papers) and 3D IC and TSV technologies (4 papers). H. Rathore collaborates with scholars based in United States. H. Rathore's co-authors include Cyprian Uzoh, A. Simon, D. Edelstein, R. Wachnik, N. Lustig, R. Goldblatt, S. Luce, John Dukovic, P. Roper and T.L. McDevitt and has published in prestigious journals such as Journal of Applied Physics, Microelectronics Reliability and AIP conference proceedings.

In The Last Decade

H. Rathore

14 papers receiving 346 citations

Peers

Countries citing papers authored by H. Rathore

Since Specialization

Citations

This map shows the geographic impact of H. Rathore's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Rathore with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Rathore more than expected).

Fields of papers citing papers by H. Rathore

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Rathore. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Rathore. The network helps show where H. Rathore may publish in the future.

Co-authorship network of co-authors of H. Rathore

This figure shows the co-authorship network connecting the top 25 collaborators of H. Rathore. A scholar is included among the top collaborators of H. Rathore based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Rathore. H. Rathore is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

15 of 15 papers shown

#	Work	Indexed citations
1	Building-In Reliability During Product Development in IBM Microelectronics 2005 ·H. Rathore, (unknown), R. G. Filippi, (unknown)	0
2	Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures 2005 ·Microelectronics Reliability ·F. Chen, J. Gill, D. Harmon, T. Sullivan, A. Strong, (unknown), H. Rathore, D. C. Edelstein	8
3	Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics 2004 ·F. Chen, J. Gill, D. Harmon, T. Sullivan, (unknown), A. Strong, H. Rathore, D. C. Edelstein, (unknown), A. Cowley, L. A. Clevenger	18
4	Scaling effect on electromigration in on-chip Cu wiring 2003 ·C.‐K. Hu, R. Rosenberg, H. Rathore, (unknown), B. Agarwala	32
5	A dual damascene hard metal capped Cu and Al-alloy for interconnect wiring of ULSI circuits 2002 ·(unknown), (unknown), H. Rathore, (unknown)	2
6	The effect of metal thickness on electromigration-induced extrusion shorts in submicron technology 2002 ·(unknown), H. Rathore, (unknown)	1
7	Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy 2002 ·(unknown), H. Rathore, (unknown)	7
8	Full copper wiring in a sub-0.25 μm CMOS ULSI technology 2002 ·D. Edelstein, J. Heidenreich, R. Goldblatt, W. Cote, Cyprian Uzoh, N. Lustig, P. Roper, T.L. McDevitt, (unknown), A. Simon, John Dukovic, R. Wachnik, H. Rathore, R. Schulz, L.T. Su, S. Luce, John M. Slattery	196
9	Copper dual damascene wiring for sub-0.25 μm CMOS technology 2002 ·J. Heidenreich, D. Edelstein, R. Goldblatt, W. Cote, Cyprian Uzoh, N. Lustig, T.L. McDevitt, (unknown), A. Simon, John Dukovic, P. C. Andricacos, R. Wachnik, H. Rathore, (unknown), P. McLaughlin, S. Luce, John M. Slattery	3
10	Electromigration in a two-level Al-Cu interconnection with W studs 2002 ·Thomas Kwok, Cher Ming Tan, D. Moy, (unknown), H. Rathore, S. Basavaiah	5
11	A high performance liner for copper damascene interconnects 2001 ·D. Edelstein, Cyprian Uzoh, C. Cabral, (unknown), (unknown), A. Simon, (unknown), S. G. Malhotra, D. Klaus, H. Rathore, B. Agarwala, (unknown)	62
12	Electromigration reliability of AlCu interconnects with W studs 1994 ·AIP conference proceedings ·H. Rathore, R. G. Filippi, R. Wachnik, (unknown), Thomas Kwok	5
13	Stress evolution during stress migration and electromigration in passivated interconnect lines 1994 ·AIP conference proceedings ·Peter Børgesen, M. A. Korhonen, D. D. Brown, (unknown), H. Rathore, P. A. Totta	4
14	Roles of Ti-intermetallic compound layers on the electromigration resistance of Al-Cu interconnecting stripes 1992 ·Journal of Applied Physics ·(unknown), E.S. Machlin, H. Rathore	19
15	The Effect of Metal Thickness on Electromigration-Induced Extrusion Shorts in Submicron Technology 1991 ·(unknown), H. Rathore, (unknown)	5

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact