G. Katopis
- Hardware and Architecture top 5%
- VLSI and Analog Circuit Testing 8
-
- Electromagnetic Compatibility and Noise Suppression 37
- 3D IC and TSV technologies 25
- Low-power high-performance VLSI design 20
- Electrostatic Discharge in Electronics 13
- VLSI and FPGA Design Techniques 9
- Advancements in PLL and VCO Technologies 8
-
- Interconnection Networks and Systems 10
- Co-authors
- Dale BeckerA. DeutschC.W. SurovicG.V. KopcsayH.H. SmithB.J. RubinP. CoteusG.A. Sai-Halasz
- Cited by
- Hardware and ArchitectureElectrical and Electronic EngineeringComputer Networks and Communications
- Journals
- IEEE Transactions on Advanced Packaging (7 papers)IBM Journal of Research and Development (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- United StatesGermanyItaly
In The Last Decade
G. Katopis
60 papers receiving 937 citations
Peers
Comparison fields: 5 of 40
- Hardware and Architecture 158
- Electrical and Electronic Engineering 965
- Computer Networks and Communications 74
- Astronomy and Astrophysics 36
- Electronic, Optical and Magnetic Materials 33
Countries citing papers authored by G. Katopis
This map shows the geographic impact of G. Katopis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Katopis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Katopis more than expected).
Fields of papers citing papers by G. Katopis
This network shows the impact of papers produced by G. Katopis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Katopis. The network helps show where G. Katopis may publish in the future.
Co-authorship network
The 25 scholars most cited alongside G. Katopis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 10 | |
| 2 | 2008 | 2 | |
| 3 | 2008 | 7 | |
| 4 | 2006 | 1 | |
| 5 | 2005 | 2 | |
| 6 | Extraction of ε(f) and tan δ(f) for BT insulator up to 30GHz using the short pulse propagation technique | 2003 | 0 |
| 7 | 2003 | 3 | |
| 8 | 2003 | 11 | |
| 9 | 2003 | 3 | |
| 10 | 2003 | 1 | |
| 11 | 2002 | 2 | |
| 12 | 2002 | 1 | |
| 13 | 2002 | 0 | |
| 14 | 2002 | 2 | |
| 15 | 2002 | 14 | |
| 16 | 2002 | 3 | |
| 17 | High performance RBF models of digital drivers | 2001 | 4 |
| 18 | 1999 | 28 | |
| 19 | 1992 | 1 | |
| 20 | 1991 | 14 |
About G. Katopis
G. Katopis is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Computer Networks and Communications, Astronomy and Astrophysics and Computational Theory and Mathematics, having authored 63 papers that have together received 1.0k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (37 papers), 3D IC and TSV technologies (25 papers), Low-power high-performance VLSI design (20 papers), Electrostatic Discharge in Electronics (13 papers), Interconnection Networks and Systems (10 papers), VLSI and FPGA Design Techniques (9 papers), VLSI and Analog Circuit Testing (8 papers) and Advancements in PLL and VCO Technologies (8 papers). The work is most often cited by research in Hardware and Architecture (158 citations), Electrical and Electronic Engineering (965 citations), Computer Networks and Communications (74 citations), Astronomy and Astrophysics (36 citations) and Electronic, Optical and Magnetic Materials (33 citations). G. Katopis has collaborated with scholars based in United States, Germany and Italy. Frequent co-authors include Dale Becker, A. Deutsch, C.W. Surovic, G.V. Kopcsay, H.H. Smith, B.J. Rubin, P. Coteus, G.A. Sai-Halasz, P.J. Restle and D.R. Knebel. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Circuits and Systems Magazine and IEEE Transactions on Electromagnetic Compatibility.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.