A. Leśniewska

577 total citations
34 papers, 345 citations indexed

About

A. Leśniewska is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, A. Leśniewska has authored 34 papers receiving a total of 345 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 7 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in A. Leśniewska's work include Semiconductor materials and devices (27 papers), Copper Interconnects and Reliability (25 papers) and Semiconductor materials and interfaces (7 papers). A. Leśniewska is often cited by papers focused on Semiconductor materials and devices (27 papers), Copper Interconnects and Reliability (25 papers) and Semiconductor materials and interfaces (7 papers). A. Leśniewska collaborates with scholars based in Belgium, Netherlands and Japan. A. Leśniewska's co-authors include Kristof Croes, Zs. Tôkei, Chen Wu, Olalla Varela Pedreira, Ivan Ciofi, Christoph Adelmann, J. Bömmels, Marleen H. van der Veen, K. Vandersmissen and Herman Oprins and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and ACS Applied Materials & Interfaces.

In The Last Decade

A. Leśniewska

30 papers receiving 329 citations

Peers

A. Leśniewska

EEE

EOMM

AMPO

N. Jourdan Belgium

T. Standaert United States

Yong Kong Siew Belgium

Geraldine Jamieson Belgium

S. Luce United States

Shibesh Dutta Belgium

H. Rathore United States

Oliver Aubel Germany

R. G. Filippi United States

K. Vandersmissen Belgium

N. Jourdan Belgium

A. Leśniewska

309 ×1.0

EEE

161 ×0.8

EOMM

75 ×1.0

AMPO

51 ×0.9

37 ×1.0

Citations per year, relative to A. Leśniewska A. Leśniewska (= 1×) peers N. Jourdan

Countries citing papers authored by A. Leśniewska

Since Specialization

Citations

This map shows the geographic impact of A. Leśniewska's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Leśniewska with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Leśniewska more than expected).

Fields of papers citing papers by A. Leśniewska

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. Leśniewska. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Leśniewska. The network helps show where A. Leśniewska may publish in the future.

Co-authorship network of co-authors of A. Leśniewska

This figure shows the co-authorship network connecting the top 25 collaborators of A. Leśniewska. A scholar is included among the top collaborators of A. Leśniewska based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. Leśniewska. A. Leśniewska is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Fang, Yu, Ivan Ciofi, Philippe Roussel, et al.. (2025). Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects. IEEE Transactions on Electron Devices. 72(5). 2165–2172.

Soulié, Jean-Philippe, Kiroubanand Sankaran, Benoît Van Troeye, et al.. (2024). Selecting alternative metals for advanced interconnects. Journal of Applied Physics. 136(17). 15 indexed citations

Arreghini, A., A. Leśniewska, Marleen H. van der Veen, et al.. (2024). Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. 1–5. 1 indexed citations

Murdoch, Gayle, Anshul Gupta, Chen Wu, et al.. (2024). Airgap Integration in MP18 Two-Level Semi-damascene Interconnects with Fully Self-aligned Vias. 1–3.

Hou, Lin, A. Leśniewska, Shuo Kang, et al.. (2023). Dielectric Breakdown of Low Temperature Deposited SiCN Layers. 1 indexed citations

Fang, Yu, Ivan Ciofi, A. Leśniewska, et al.. (2023). Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects. IEEE Transactions on Electron Devices. 70(8). 4332–4337. 2 indexed citations

Lofrano, Melina, Herman Oprins, Xinyue Chang, et al.. (2023). Towards accurate temperature prediction in BEOL for reliability assessment (Invited). 1–7. 9 indexed citations

Leśniewska, A., et al.. (2022). Doped Ru to enable next generation barrier-less interconnect. Journal of Applied Physics. 132(17). 6 indexed citations

Murdoch, Gayle, Martin G. O’Toole, D. Tsvetanova, et al.. (2022). First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). 1–2. 5 indexed citations

10.

Leśniewska, A., Olalla Varela Pedreira, Melina Lofrano, et al.. (2021). Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. 1–6. 5 indexed citations

11.

Leśniewska, A., Ph. Roussel, Marleen H. van der Veen, et al.. (2020). Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. 1–6. 10 indexed citations

12.

Leśniewska, A., et al.. (2019). Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors. 1–7. 10 indexed citations

13.

Wu, Chen, Adrian Chasin, Andrea Padovani, et al.. (2019). Role of Defects in the Reliability of HfO₂/Si-Based Spacer Dielectric Stacks for Local Interconnects. IRIS UNIMORE (University of Modena and Reggio Emilia). 117. 1–6. 2 indexed citations

14.

Croes, Kristof, Christoph Adelmann, Christopher Wilson, et al.. (2018). Interconnect metals beyond copper: reliability challenges and opportunities. 5.3.1–5.3.4. 63 indexed citations

15.

Witt, C., Kong Boon Yeap, A. Leśniewska, et al.. (2018). Testing The Limits of TaN Barrier Scaling. 54–56. 31 indexed citations

16.

Pedreira, Olalla Varela, Kristof Croes, A. Leśniewska, et al.. (2017). Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects. 6B–2.1. 62 indexed citations

17.

Zhang, Liping, Jean‐François de Marneffe, A. Leśniewska, et al.. (2016). Cu passivation for integration of gap-filling ultralow-k dielectrics. Applied Physics Letters. 109(23). 3 indexed citations

18.

Veen, Marleen H. van der, K. Vandersmissen, S. Demuynck, et al.. (2015). Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies. 25–28. 42 indexed citations

19.

Wu, Chen, A. Leśniewska, Olalla Varela Pedreira, et al.. (2015). Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials. Journal of Applied Physics. 118(16). 12 indexed citations

20.

Wang, Teng, Joke De Messemaeker, Vladimir Cherman, et al.. (2015). Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill - Process and reliability. 1–5. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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