Wei‐Tsu Tseng

1.2k total citations
63 papers, 923 citations indexed

About

Wei‐Tsu Tseng is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Wei‐Tsu Tseng has authored 63 papers receiving a total of 923 indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 47 papers in Biomedical Engineering and 23 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Wei‐Tsu Tseng's work include Advanced Surface Polishing Techniques (47 papers), Semiconductor materials and devices (25 papers) and Copper Interconnects and Reliability (23 papers). Wei‐Tsu Tseng is often cited by papers focused on Advanced Surface Polishing Techniques (47 papers), Semiconductor materials and devices (25 papers) and Copper Interconnects and Reliability (23 papers). Wei‐Tsu Tseng collaborates with scholars based in United States, Taiwan and Germany. Wei‐Tsu Tseng's co-authors include Bau‐Tong Dai, Ching‐Fa Yeh, Ming Feng, A. Simon, E. Liniger, D.L. Rath, S. Kaldor, Shih-Chin Lee, Ying-Lang Wang and L. Gignac and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Wei‐Tsu Tseng

62 papers receiving 866 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wei‐Tsu Tseng United States 16 595 505 342 308 230 63 923
Rassin Grantab United States 9 271 0.5× 294 0.6× 203 0.6× 836 2.7× 71 0.3× 12 1.1k
Hua Gong China 15 795 1.3× 329 0.7× 296 0.9× 600 1.9× 36 0.2× 35 958
Yan Peng China 15 172 0.3× 308 0.6× 90 0.3× 354 1.1× 159 0.7× 77 647
Arvind R. Kalidindi United States 12 105 0.2× 428 0.8× 298 0.9× 391 1.3× 96 0.4× 15 838
Trevor Clark United States 13 206 0.3× 246 0.5× 151 0.4× 290 0.9× 83 0.4× 34 571
Shuai Yuan China 17 233 0.4× 540 1.1× 65 0.2× 340 1.1× 48 0.2× 75 793
Qiming Wang China 17 186 0.3× 186 0.4× 188 0.5× 645 2.1× 64 0.3× 56 863
Nagraj Kulkarni United States 16 72 0.1× 196 0.4× 471 1.4× 357 1.2× 121 0.5× 24 834
Chunhua Xu China 9 88 0.1× 203 0.4× 242 0.7× 302 1.0× 59 0.3× 23 655
Scott C. Moulzolf United States 17 287 0.5× 449 0.9× 95 0.3× 299 1.0× 38 0.2× 20 719

Countries citing papers authored by Wei‐Tsu Tseng

Since Specialization
Citations

This map shows the geographic impact of Wei‐Tsu Tseng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei‐Tsu Tseng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei‐Tsu Tseng more than expected).

Fields of papers citing papers by Wei‐Tsu Tseng

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wei‐Tsu Tseng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei‐Tsu Tseng. The network helps show where Wei‐Tsu Tseng may publish in the future.

Co-authorship network of co-authors of Wei‐Tsu Tseng

This figure shows the co-authorship network connecting the top 25 collaborators of Wei‐Tsu Tseng. A scholar is included among the top collaborators of Wei‐Tsu Tseng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wei‐Tsu Tseng. Wei‐Tsu Tseng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tseng, Wei‐Tsu, et al.. (2024). Post Tungsten CMP Cleaning: Optimization for Cleaning Efficiency and Corrosion Reduction. ECS Journal of Solid State Science and Technology. 13(11). 114004–114004. 2 indexed citations
2.
Chan, V., Wei‐Tsu Tseng, Kang Min Ok, et al.. (2023). Yield Methodology and Heater Process Variation in Phase Change Memory (PCM) Technology for Analog Computing. IEEE Transactions on Semiconductor Manufacturing. 36(3). 327–331. 1 indexed citations
3.
Sampurno, Yasa, et al.. (2021). Understanding the Reasons Behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes. ECS Journal of Solid State Science and Technology. 10(6). 64011–64011. 3 indexed citations
4.
Tseng, Wei‐Tsu, et al.. (2021). CMP Defect Reduction and Mitigation: Practices and Future Trends. 1–6. 4 indexed citations
5.
Pancharatnam, S., Wei‐Tsu Tseng, S. Choi, & Richard Johnson. (2020). Process Co-Optimization of CVD and CMP for Tungsten Metallization. ECS Journal of Solid State Science and Technology. 9(10). 104004–104004. 1 indexed citations
6.
Tseng, Wei‐Tsu, et al.. (2015). Post cleaning and defect reduction for tungsten chemical mechanical planarization. 1–5. 3 indexed citations
7.
Tseng, Wei‐Tsu, et al.. (2015). Microreplicated Conditioners for Cu Barrier Chemical-Mechanical Planarization (CMP). ECS Journal of Solid State Science and Technology. 4(11). P5001–P5007. 9 indexed citations
8.
Zhang, John H., et al.. (2013). Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes. MRS Proceedings. 1560. 1 indexed citations
9.
Tseng, Wei‐Tsu, et al.. (2013). Hybrid clean approach for post-copper CMP defect reduction. ma2012 2. 346–351. 1 indexed citations
10.
Tseng, Wei‐Tsu, et al.. (2012). Understanding, modeling, and detecting pooling hotspots in copper CMP. 208–215. 2 indexed citations
11.
Lustig, N., J. Gill, R. G. Filippi, et al.. (2010). A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4). 1–3. 1 indexed citations
12.
Tseng, Wei‐Tsu, D. Kioussis, Hyunki Kim, et al.. (2008). Evaluation of Barrier CMP Slurries and Characterization of ULK Material Properties Shifts Due to CMP. ECS Transactions. 13(2). 293–306. 3 indexed citations
13.
Tseng, Wei‐Tsu, Akihisa Sakamoto, S. Ponoth, et al.. (2006). Chemical-Mechanical Polishing of SiCOH-Based Low-k Dielectrics. ECS Meeting Abstracts. MA2006-01(9). 397–397. 1 indexed citations
14.
Canaperi, D., L. Gignac, S. Kaldor, et al.. (2005). Electromigration Cu mass flow in Cu interconnections. Thin Solid Films. 504(1-2). 274–278. 27 indexed citations
15.
Hu, Chunhua, D. Canaperi, Lynne Gignac, et al.. (2004). Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects. 222–228. 37 indexed citations
16.
Wang, Ying-Lang, Wei‐Tsu Tseng, & Shih-Chieh Chang. (2004). Chemical–mechanical polish of aluminum alloy thin films: slurry chemistries and polish mechanisms. Thin Solid Films. 474(1-2). 36–43. 13 indexed citations
17.
18.
Tseng, Wei‐Tsu & Ying-Lang Wang. (1999). The Intercorrelation Between Microstructure and Chemicalmechanical Polish of Metal Thin Films. MRS Proceedings. 564. 1 indexed citations
19.
Tseng, Wei‐Tsu, et al.. (1998). The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection. Materials Chemistry and Physics. 52(1). 17–22. 20 indexed citations
20.
Wang, Mingtao, et al.. (1997). Chemical mechanical polishing for selective CVD-W. Materials Chemistry and Physics. 51(1). 75–79. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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