J. Demarest

1.4k total citations
35 papers, 355 citations indexed

About

J. Demarest is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, J. Demarest has authored 35 papers receiving a total of 355 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 22 papers in Electronic, Optical and Magnetic Materials and 5 papers in Biomedical Engineering. Recurrent topics in J. Demarest's work include Semiconductor materials and devices (23 papers), Copper Interconnects and Reliability (22 papers) and Electronic Packaging and Soldering Technologies (11 papers). J. Demarest is often cited by papers focused on Semiconductor materials and devices (23 papers), Copper Interconnects and Reliability (22 papers) and Electronic Packaging and Soldering Technologies (11 papers). J. Demarest collaborates with scholars based in United States, Germany and Sweden. J. Demarest's co-authors include P. McLaughlin, R. Hull, Oleg Gluschenkov, H. Shobha, Jody Fronheiser, Bala Haran, Chen Zhang, James J. Kelly, Juntao Li and Mark Raymond and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Langmuir.

In The Last Decade

J. Demarest

30 papers receiving 328 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Demarest United States 13 289 132 76 64 54 35 355
Julia Deitz United States 10 197 0.7× 55 0.4× 100 1.3× 41 0.6× 143 2.6× 38 300
M. B. Stern United States 8 201 0.7× 71 0.5× 83 1.1× 132 2.1× 62 1.1× 23 336
S. M. Lee South Korea 6 262 0.9× 84 0.6× 47 0.6× 36 0.6× 139 2.6× 14 343
C. Stanis United States 15 535 1.9× 98 0.7× 200 2.6× 72 1.1× 86 1.6× 37 587
Lung-Hsing Hsu Taiwan 9 159 0.6× 86 0.7× 54 0.7× 48 0.8× 96 1.8× 19 292
Ariela Donval Israel 10 189 0.7× 60 0.5× 94 1.2× 75 1.2× 63 1.2× 36 321
E. Achimova Moldova 11 81 0.3× 91 0.7× 139 1.8× 81 1.3× 116 2.1× 29 288
Yi-Fan Huang Taiwan 8 310 1.1× 35 0.3× 46 0.6× 76 1.2× 50 0.9× 18 409
B. Bélier France 9 127 0.4× 130 1.0× 71 0.9× 172 2.7× 107 2.0× 45 340
Tianli Duan China 9 237 0.8× 126 1.0× 38 0.5× 26 0.4× 105 1.9× 20 337

Countries citing papers authored by J. Demarest

Since Specialization
Citations

This map shows the geographic impact of J. Demarest's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Demarest with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Demarest more than expected).

Fields of papers citing papers by J. Demarest

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Demarest. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Demarest. The network helps show where J. Demarest may publish in the future.

Co-authorship network of co-authors of J. Demarest

This figure shows the co-authorship network connecting the top 25 collaborators of J. Demarest. A scholar is included among the top collaborators of J. Demarest based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Demarest. J. Demarest is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Nguyen, S., H. Shobha, Huai Huang, et al.. (2021). Selective deposition of AlOx for Fully Aligned Via in nano Cu interconnects. b35. 1–2. 3 indexed citations
2.
Sil, Devika, J. Demarest, Bala Haran, et al.. (2021). Impact of Nanosecond Laser Anneal on PVD Ru Films. 1–3. 4 indexed citations
3.
Ryan, E. Todd, K. Motoyama, Nicholas A. Lanzillo, et al.. (2019). An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines. AIP Advances. 9(2). 21 indexed citations
4.
Kong, Dexin, K. Motoyama, Huai Huang, et al.. (2019). Machine learning and hybrid metrology using scatterometry and LE-XRF to detect voids in copper lines. 9–9. 9 indexed citations
5.
Gluschenkov, Oleg, Heng Wu, Kevin Brew, et al.. (2018). External Resistance Reduction by Nanosecond Laser Anneal in Si/SiGe CMOS Technology. 35.3.1–35.3.4. 8 indexed citations
6.
Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Transactions. 80(4). 297–309. 2 indexed citations
7.
Nogami, T., R. Patlolla, James J. Kelly, et al.. (2017). Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines. 1–3. 18 indexed citations
8.
Gluschenkov, Oleg, Bei Liu, Juntao Li, et al.. (2017). Dual beam laser annealing for contact resistance reduction and its impact on VLSI integrated circuit variability. T212–T213. 7 indexed citations
9.
Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Meeting Abstracts. MA2017-02(26). 1122–1122.
10.
Gluschenkov, Oleg, Jody Fronheiser, Juntao Li, et al.. (2016). Sub- $10^{-9}~\Omega $ -cm2 n-Type Contact Resistivity for FinFET Technology. IEEE Electron Device Letters. 37(11). 1371–1374. 47 indexed citations
11.
Kelly, James J., T. Nogami, O. van der Straten, et al.. (2014). Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers. ECS Transactions. 58(17). 17–28. 2 indexed citations
12.
Washington, Joseph R., D.L. Rath, Spyridon Skordas, et al.. (2014). Copper-to-dielectric heterogeneous bonding for 3D integration. 6–6.
13.
Kelly, James J., T. Nogami, O. van der Straten, et al.. (2013). Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers. Journal of The Electrochemical Society. 160(12). D3171–D3178. 6 indexed citations
14.
Kelly, James J., T. Nogami, O. van der Straten, et al.. (2012). Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects. ECS Transactions. 41(43). 23–33. 2 indexed citations
15.
Kelly, James J., T. Nogami, O. van der Straten, et al.. (2012). Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects. Journal of The Electrochemical Society. 159(10). D563–D569. 15 indexed citations
16.
Demarest, J., et al.. (2009). Start up of a Dual Beam FIB for Automatic STEM Sample Preparation. Proceedings - International Symposium for Testing and Failure Analysis. 30088. 334–338. 1 indexed citations
17.
Hu, Chao, L. Gignac, E. Liniger, et al.. (2009). Electromigration Challenges for Nanoscale Cu Wiring. AIP conference proceedings. 3–11. 12 indexed citations
18.
McLaughlin, P., Lynne Gignac, E. Liniger, et al.. (2008). Enhanced Electromigration in Cu Interconnects Using Upper Level Dummy Vias. ECS Meeting Abstracts. MA2008-02(28). 2071–2071. 1 indexed citations
19.
Chen, F., P. McLaughlin, J. Gambino, et al.. (2007). The Effect of Metal Area and Line Spacing on TDDB Characteristics of 45nm Low-k SiCOH Dielectrics. 47. 382–389. 26 indexed citations
20.
Demarest, J., R. Hull, K. Schonenberg, & Maddy Janssens. (2000). Nanoscale characterization of stresses in semiconductor devices by quantitative electron diffraction. Applied Physics Letters. 77(3). 412–414. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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