Gerald Beyer

4.1k total citations
274 papers, 3.1k citations indexed

About

Gerald Beyer is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Gerald Beyer has authored 274 papers receiving a total of 3.1k indexed citations (citations by other indexed papers that have themselves been cited), including 253 papers in Electrical and Electronic Engineering, 114 papers in Electronic, Optical and Magnetic Materials and 45 papers in Biomedical Engineering. Recurrent topics in Gerald Beyer's work include 3D IC and TSV technologies (151 papers), Copper Interconnects and Reliability (114 papers) and Semiconductor materials and devices (113 papers). Gerald Beyer is often cited by papers focused on 3D IC and TSV technologies (151 papers), Copper Interconnects and Reliability (114 papers) and Semiconductor materials and devices (113 papers). Gerald Beyer collaborates with scholars based in Belgium, United States and Japan. Gerald Beyer's co-authors include Eric Beyne, Andy Miller, Zsolt Tökei, Kristof Croes, Mikhaı̈l R. Baklanov, Zs. Tôkei, Alain Phommahaxay, N. Heylen, Karen Maex and Michele Stucchi and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Gerald Beyer

261 papers receiving 3.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Gerald Beyer Belgium 29 2.8k 1.1k 549 398 377 274 3.1k
Kristof Croes Belgium 26 2.3k 0.8× 1.2k 1.1× 238 0.4× 216 0.5× 281 0.7× 244 2.5k
T. Nakamura Japan 22 1.8k 0.6× 388 0.4× 326 0.6× 169 0.4× 295 0.8× 154 2.0k
Zs. Tôkei Belgium 24 1.5k 0.5× 930 0.9× 206 0.4× 240 0.6× 390 1.0× 133 1.9k
Cyprian Uzoh United States 14 1.7k 0.6× 842 0.8× 293 0.5× 190 0.5× 527 1.4× 34 1.9k
L. Di Cioccio France 32 2.8k 1.0× 316 0.3× 442 0.8× 106 0.3× 394 1.0× 165 3.1k
Zsolt Tökei Belgium 26 2.3k 0.8× 1.4k 1.2× 303 0.6× 337 0.8× 652 1.7× 246 2.7k
Takayuki Ohba Japan 17 999 0.4× 338 0.3× 290 0.5× 121 0.3× 133 0.4× 115 1.2k
J. R. Lloyd United States 26 2.7k 1.0× 2.3k 2.1× 158 0.3× 493 1.2× 313 0.8× 122 3.0k
E. G. Colgan United States 27 1.6k 0.6× 586 0.5× 369 0.7× 301 0.8× 520 1.4× 81 2.6k
Daniel J. Lichtenwalner United States 28 2.0k 0.7× 337 0.3× 321 0.6× 259 0.7× 845 2.2× 120 2.5k

Countries citing papers authored by Gerald Beyer

Since Specialization
Citations

This map shows the geographic impact of Gerald Beyer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gerald Beyer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gerald Beyer more than expected).

Fields of papers citing papers by Gerald Beyer

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Gerald Beyer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gerald Beyer. The network helps show where Gerald Beyer may publish in the future.

Co-authorship network of co-authors of Gerald Beyer

This figure shows the co-authorship network connecting the top 25 collaborators of Gerald Beyer. A scholar is included among the top collaborators of Gerald Beyer based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Gerald Beyer. Gerald Beyer is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Beyer, Gerald, et al.. (2025). Scalable production and biophysical characterization of an enzyme cocktail derived from human red blood cells. Biotechnology Progress. 42(1). e70072–e70072.
2.
Beyer, Gerald, et al.. (2025). Comprehensive biophysical and biochemical characterization of polymerized dopamine coated hemoglobin based oxygen carrier. International Journal of Biological Macromolecules. 322(Pt 1). 146658–146658.
3.
Zhao, Peng, Liesbeth Witters, Anne Jourdain, et al.. (2024). Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias. IEEE Transactions on Electron Devices. 71(12). 7963–7969. 2 indexed citations
4.
Hou, Lin, A. Leśniewska, Shuo Kang, et al.. (2023). Dielectric Breakdown of Low Temperature Deposited SiCN Layers. 1 indexed citations
5.
Kennes, Koen, Samuel Suhard, Jaber Derakhshandeh, et al.. (2023). Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers. 1584–1589. 2 indexed citations
6.
Jourdain, Anne, Michele Stucchi, Geert Van der Plas, Gerald Beyer, & Eric Beyne. (2022). Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1531–1538. 28 indexed citations
7.
Derakhshandeh, Jaber, Eric Beyne, Gerald Beyer, et al.. (2022). Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1108–1113. 7 indexed citations
8.
Iacovo, Serena, K. Devriendt, Joeri De Vos, et al.. (2022). 700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding. 334–337. 13 indexed citations
9.
Derakhshandeh, Jaber, Fumihiro Inoue, Vladimir Cherman, et al.. (2021). A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps. 1119–1124. 3 indexed citations
10.
Loo, Roger, Anne Jourdain, Clément Porret, et al.. (2021). Epitaxial Growth of Active Si on Top of SiGe Etch Stop Layer in View of 3D Device Integration. ECS Journal of Solid State Science and Technology. 10(1). 14001–14001. 4 indexed citations
11.
Iacovo, Serena, Alain Phommahaxay, Fumihiro Inoue, et al.. (2020). Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding. ECS Transactions. 98(4). 21–31. 3 indexed citations
12.
Kim, Soon-Wook, N. Heylen, Serena Iacovo, et al.. (2020). Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding. 216–222. 75 indexed citations
13.
Inoue, Fumihiro, Lan Peng, Serena Iacovo, et al.. (2019). Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding. ECS Journal of Solid State Science and Technology. 8(6). P346–P350. 54 indexed citations
14.
Vos, Joeri De, Stefaan Van Huylenbroeck, Anne Jourdain, et al.. (2018). Etch process modules development and integration in 3D-SOC applications. Microelectronic Engineering. 196. 38–48. 3 indexed citations
15.
Rassoul, Nouredine, Anne Jourdain, Joeri De Vos, et al.. (2018). RIE dynamics for extreme wafer thinning applications. Microelectronic Engineering. 192. 30–37. 12 indexed citations
16.
Messemaeker, Joke De, et al.. (2018). Electromigration Behavior of Cu/SiCN to Cu/SiCN Hybrid Bonds for 3D Integrated Circuits. 6 indexed citations
17.
Li, Yunlong, Stefaan Van Huylenbroeck, Philippe Roussel, et al.. (2016). Dielectric liner reliability in via-middle through silicon vias with 3 Micron diameter. Microelectronic Engineering. 156. 37–40. 8 indexed citations
18.
19.
Manna, Antonio, Wei Guo, Stefaan Van Huylenbroeck, et al.. (2013). Study of 3D process impact on advanced CMOS devices. European Microelectronics and Packaging Conference. 1–7. 4 indexed citations
20.
Zhao, Larry, et al.. (2011). Direct observation of the 1/E dependence of time dependent. Applied Physics Letters. 98(3). 32107. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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