Eric Beyne

11.5k total citations
685 papers, 8.3k citations indexed

About

Eric Beyne is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Eric Beyne has authored 685 papers receiving a total of 8.3k indexed citations (citations by other indexed papers that have themselves been cited), including 638 papers in Electrical and Electronic Engineering, 121 papers in Biomedical Engineering and 85 papers in Automotive Engineering. Recurrent topics in Eric Beyne's work include 3D IC and TSV technologies (491 papers), Electronic Packaging and Soldering Technologies (336 papers) and Semiconductor materials and devices (120 papers). Eric Beyne is often cited by papers focused on 3D IC and TSV technologies (491 papers), Electronic Packaging and Soldering Technologies (336 papers) and Semiconductor materials and devices (120 papers). Eric Beyne collaborates with scholars based in Belgium, United States and Netherlands. Eric Beyne's co-authors include Bart Vandevelde, Gerald Beyer, W. De Raedt, Ingrid De Wolf, Bart Swinnen, Geert Van der Plas, Vladimir Cherman, Herman Oprins, S. Brebels and Andy Miller and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Proceedings of the IEEE.

In The Last Decade

Eric Beyne

647 papers receiving 8.0k citations

Peers

Countries citing papers authored by Eric Beyne

Since Specialization

Citations

This map shows the geographic impact of Eric Beyne's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Beyne with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Beyne more than expected).

Fields of papers citing papers by Eric Beyne

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Eric Beyne. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Beyne. The network helps show where Eric Beyne may publish in the future.

Co-authorship network of co-authors of Eric Beyne

This figure shows the co-authorship network connecting the top 25 collaborators of Eric Beyne. A scholar is included among the top collaborators of Eric Beyne based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Eric Beyne. Eric Beyne is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work	Indexed citations
1	No Flux Thermocompression Bonding: Adapting to the Future 2025 ·(unknown), (unknown), (unknown), (unknown), Jaber Derakhshandeh, (unknown), Eric Beyne	0
2	Extreme silicon thinning for back side power delivery network: Si thinning stopping on scaled SiGe etch stop layer 2024 ·Microelectronic Engineering ·Farid Sebaai, Roger Loo, (unknown), Eric Beyne, (unknown), (unknown), Efrain Altamirano Sánchez	0
3	Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking 2024 ·Jens Rip, Jaber Derakhshandeh, (unknown), Itsuro Tomatsu, (unknown), Eric Beyne	0
4	Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement 2024 ·Fluids ·(unknown), Herman Oprins, Vladimir Cherman, Geert Van der Plas, Eric Beyne, Ingrid De Wolf	1
5	Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers 2024 ·(unknown), Ritwik Bhatia, Ganesh Sundaram, (unknown), Eric Beyne	0
6	Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability 2023 ·JOM ·(unknown), A. P. Brady, Ritwik Bhatia, (unknown), John Slabbekoorn, Silvia Armini, Ganesh Sundaram, Eric Beyne	2
7	Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies 2023 ·IEEE Transactions on Microwave Theory and Techniques ·(unknown), (unknown), D. De Zutter, Xiao Sun, (unknown), Geert Van der Plas, Eric Beyne, Dries Vande Ginste	1
8	Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network 2022 ·2022 International Electron Devices Meeting (IEDM) ·(unknown), Melina Lofrano, Gioele Mirabelli, (unknown), Sheng Yang, Anne Jourdain, Filip Schleicher, A. Veloso, Odysseas Zografos, Pieter Weckx, Gaspard Hiblot, Geert Van der Plas, Geert Hellings, Julien Ryckaert, Eric Beyne	18
9	Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration 2022 ·2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·Anne Jourdain, Michele Stucchi, Geert Van der Plas, Gerald Beyer, Eric Beyne	28
10	Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging 2022 ·The International Journal of Advanced Manufacturing Technology ·Fumihiro Inoue, Alain Phommahaxay, (unknown), (unknown), Eric Beyne	1
11	Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy 2021 ·IEEE Transactions on Instrumentation and Measurement ·(unknown), Michele Stucchi, Eric Beyne	1
12	Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications 2021 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·(unknown), (unknown), Michele Stucchi, John Slabbekoorn, Kristof Croes, Eric Beyne	17
13	Area-Selective Electroless Deposition of Cu for Hybrid Bonding 2021 ·IEEE Electron Device Letters ·Fumihiro Inoue, Serena Iacovo, (unknown), Soon-Wook Kim, Herbert Struyf, Eric Beyne	19
14	Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding 2020 ·ECS Transactions ·(unknown), Serena Iacovo, Alain Phommahaxay, Fumihiro Inoue, Erik Sleeckx, Stefan De Gendt, Gerald Beyer, Eric Beyne	3
15	Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects 2020 ·IEEE Transactions on Microwave Theory and Techniques ·(unknown), Kamil Yavuz Kapusuz, Xiao Sun, Geert Van der Plas, Eric Beyne, D. De Zutter, Dries Vande Ginste	13
16	Etch process modules development and integration in 3D-SOC applications 2018 ·Microelectronic Engineering ·(unknown), (unknown), Joeri De Vos, Stefaan Van Huylenbroeck, Anne Jourdain, Lan Peng, Fumihiro Inoue, Nouredine Rassoul, Gerald Beyer, Eric Beyne, Andy Miller, (unknown)	3
17	RIE dynamics for extreme wafer thinning applications 2018 ·Microelectronic Engineering ·Nouredine Rassoul, Anne Jourdain, (unknown), Joeri De Vos, (unknown), Fumihiro Inoue, (unknown), Gerald Beyer, Andy Miller, Eric Beyne, (unknown), (unknown), (unknown), Huma Ashraf, (unknown), Dave Thomas	12
18	Influence of Composition of SiCN Film for Surface Activated Bonding 2018 ·ECS Transactions ·Fumihiro Inoue, Lan Peng, Serena Iacovo, Alain Phommahaxay, (unknown), Patrick Verdonck, Johan Meersschaut, (unknown), Erik Sleeckx, Andy Miller, Eric Beyne	3
19	Edge trimming for surface activated dielectric bonded wafers 2016 ·Microelectronic Engineering ·Fumihiro Inoue, Anne Jourdain, (unknown), Lan Peng, (unknown), (unknown), Alain Phommahaxay, Kenneth June Rebibis, Andy Miller, Eric Beyne, Erik Sleeckx	12
20	3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 &#x003BC;m pitch through-Si vias 2006 ·Bart Swinnen, Wouter Ruythooren, Piet De Moor, Lieve Bogaerts, L. Carbonell, Koen De Munck, B. Eyckens, Serguei Stoukatch, Deniz Sabuncuoglu Tezcan, Zs. Tôkei, Jan Vaes, J. Van Aelst, Eric Beyne	161

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact