Zs. Tôkei

2.7k total citations
133 papers, 1.9k citations indexed

About

Zs. Tôkei is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Zs. Tôkei has authored 133 papers receiving a total of 1.9k indexed citations (citations by other indexed papers that have themselves been cited), including 118 papers in Electrical and Electronic Engineering, 105 papers in Electronic, Optical and Magnetic Materials and 31 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Zs. Tôkei's work include Copper Interconnects and Reliability (105 papers), Semiconductor materials and devices (93 papers) and Electronic Packaging and Soldering Technologies (28 papers). Zs. Tôkei is often cited by papers focused on Copper Interconnects and Reliability (105 papers), Semiconductor materials and devices (93 papers) and Electronic Packaging and Soldering Technologies (28 papers). Zs. Tôkei collaborates with scholars based in Belgium, United States and France. Zs. Tôkei's co-authors include Kristof Croes, Gerald Beyer, Karen Maex, Dezső L. Beke, Ivan Ciofi, Chen Wu, H. Viefhaus, J. Bömmels, Mikhaı̈l R. Baklanov and J. Bernardini and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Zs. Tôkei

129 papers receiving 1.8k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Zs. Tôkei Belgium	24	1.5k	930	390	291	240	133	1.9k
Sean Hearne United States	20	1.1k 0.8×	768 0.8×	1.0k 2.6×	385 1.3×	935 3.9×	45	2.3k
J. R. Lloyd United States	26	2.7k 1.8×	2.3k 2.5×	313 0.8×	462 1.6×	493 2.1×	122	3.0k
D. Edelstein United States	21	1.9k 1.3×	1.0k 1.1×	291 0.7×	260 0.9×	271 1.1×	86	2.2k
John E. Sanchez United States	19	826 0.6×	846 0.9×	396 1.0×	208 0.7×	373 1.6×	70	1.4k
Fritz J. Kub United States	24	1.2k 0.8×	647 0.7×	1.0k 2.6×	278 1.0×	195 0.8×	112	2.1k
J. A. Floro United States	17	953 0.6×	548 0.6×	789 2.0×	535 1.8×	776 3.2×	27	2.0k
Wouter Ruythooren Belgium	23	1.4k 0.9×	349 0.4×	247 0.6×	263 0.9×	112 0.5×	66	1.6k
Zsolt Tökei Belgium	26	2.3k 1.6×	1.4k 1.5×	652 1.7×	510 1.8×	337 1.4×	246	2.7k
D. B. Knorr United States	19	783 0.5×	684 0.7×	472 1.2×	165 0.6×	490 2.0×	67	1.3k
L. T. Romankiw United States	23	1.2k 0.8×	390 0.4×	553 1.4×	515 1.8×	158 0.7×	65	1.7k

Countries citing papers authored by Zs. Tôkei

Since Specialization

Citations

This map shows the geographic impact of Zs. Tôkei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zs. Tôkei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zs. Tôkei more than expected).

Fields of papers citing papers by Zs. Tôkei

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zs. Tôkei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zs. Tôkei. The network helps show where Zs. Tôkei may publish in the future.

Co-authorship network of co-authors of Zs. Tôkei

This figure shows the co-authorship network connecting the top 25 collaborators of Zs. Tôkei. A scholar is included among the top collaborators of Zs. Tôkei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zs. Tôkei. Zs. Tôkei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Kundu, Souvik, Jean-Philippe Soulié, Laurent Souriau, et al.. (2024). Directional Etching of Barrierless NiAl Lines on 300mm Wafers for Interconnects Applications. IEEE Electron Device Letters. 1–1. 1 indexed citations

Murdoch, Gayle, Martin G. O’Toole, D. Tsvetanova, et al.. (2022). First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). 1–2. 5 indexed citations

Leśniewska, A., Olalla Varela Pedreira, Melina Lofrano, et al.. (2021). Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. 1–6. 5 indexed citations

Pedreira, Olalla Varela, et al.. (2020). Metal reliability mechanisms in Ruthenium interconnects. 1–7. 13 indexed citations

Fleetwood, Daniel M., Rong Jiang, Pan Wang, et al.. (2019). Low-frequency noise and defects in copper and ruthenium resistors. Applied Physics Letters. 114(20). 9 indexed citations

Witt, C., Kong Boon Yeap, A. Leśniewska, et al.. (2018). Testing The Limits of TaN Barrier Scaling. 54–56. 31 indexed citations

Baert, Rogier, et al.. (2018). System-Level Impact of Interconnect Line-Edge Roughness. 64. 67–69. 2 indexed citations

Croes, Kristof, Christoph Adelmann, Christopher Wilson, et al.. (2018). Interconnect metals beyond copper: reliability challenges and opportunities. 5.3.1–5.3.4. 63 indexed citations

Veen, Marleen H. van der, K. Vandersmissen, S. Demuynck, et al.. (2015). Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies. 25–28. 42 indexed citations

10.

Thean, A. V-Y., Dmitry Yakimets, Trong Huynh-Bao, et al.. (2015). Vertical device architecture for 5nm and beyond: Device & circuit implications. T26–T27. 40 indexed citations

11.

Wu, Chen, Y. Barbarin, Ivan Ciofi, et al.. (2013). Correlation between field dependent electrical conduction and dielectric breakdown in a SiCOH based low-k (k = 2.0) dielectric. Applied Physics Letters. 103(3). 12 indexed citations

12.

Croes, Kristof, Ph. Roussel, Y. Barbarin, et al.. (2013). Low field TDDB of BEOL interconnects using >40 months of data. 2F.4.1–2F.4.8. 31 indexed citations

13.

Wilson, Christopher J., Kristof Croes, Zs. Tôkei, et al.. (2009). A NEMS-based sensor to monitor stress in deep sub-micron Cu/Low-kinterconnects. Semiconductor Science and Technology. 24(11). 115018–115018. 2 indexed citations

14.

Travaly, Youssef, L. Carbonell, Zs. Tôkei, et al.. (2007). On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance. IEEE Transactions on Semiconductor Manufacturing. 20(3). 333–340. 10 indexed citations

15.

Tôkei, Zs., et al.. (2007). Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications. Microelectronic Engineering. 84(11). 2669–2674. 27 indexed citations

16.

Swinnen, Bart, Wouter Ruythooren, Piet De Moor, et al.. (2006). 3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 &#x003BC;m pitch through-Si vias. 1–4. 161 indexed citations

17.

Bruynseraede, C., et al.. (2005). The impact of scaling on interconnect reliability. 612. 7–17. 8 indexed citations

18.

Iacopi, Francesca, Zs. Tôkei, Quoc Toan Le, et al.. (2002). Dependence of the minimal PVD TA(N) sealing thickness on the porosity of Zirkon™ LK dielectric films. Microelectronic Engineering. 64(1-4). 351–360. 13 indexed citations

19.

Baklanov, Mikhaı̈l R., Denis Shamiryan, Zs. Tôkei, et al.. (2001). Characterization of Cu surface cleaning by hydrogen plasma. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 19(4). 1201–1211. 81 indexed citations

20.

Tôkei, Zs., J. Bernardini, & Dezső L. Beke. (1999). Grain-boundary diffusion in B2 intermetallic compounds: effect of ordering on diffusion in the Fe3Al and FeCo compounds. Acta Materialia. 47(4). 1371–1378. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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