J. Bömmels

1.5k citations

58 papers · 1.0k indexed · h-index 19

Electronic, Optical and Magnetic Materials top 5%
- Copper Interconnects and Reliability 40
Electrical and Electronic Engineering top 5%
- Semiconductor materials and devices 38
- Electronic Packaging and Soldering Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 10
- 3D IC and TSV technologies 8
- Advancements in Photolithography Techniques 5
Atomic and Molecular Physics, and Optics top 10%
- Semiconductor materials and interfaces 11
- Atomic and Molecular Physics 7
Surfaces, Coatings and Films top 10%
Radiation top 10%

Co-authors: Zsolt Tökei Kristof Croes Christoph Adelmann Christopher J. Wilson Zs. Tôkei H. Hotop Anshul Gupta Shibesh Dutta
Cited by: Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Atomic and Molecular Physics, and Optics
Journals: Microelectronic Engineering (5 papers)Microelectronics Reliability (4 papers)Journal of Applied Physics (3 papers)
Partner nations: Belgium Germany United States

In The Last Decade

J. Bömmels

58 papers receiving 996 citations

Peers

Countries citing papers authored by J. Bömmels

Since Specialization

Citations

This map shows the geographic impact of J. Bömmels's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Bömmels with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Bömmels more than expected).

Fields of papers citing papers by J. Bömmels

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Bömmels. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Bömmels. The network helps show where J. Bömmels may publish in the future.

Co-authorship network

The 25 scholars most cited alongside J. Bömmels, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. Bömmels Line = papers co-authored together J. Bömmels links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Double-Row CFET: Design Technology Co-Optimization for Area Efficient A7 Technology Node Halil Kükner,Gioele Mirabelli,Sheng Yang,Fahd Al-Amri,J. Bömmels,Jai-Ming Lin,Dawit Burusie Abdi,SU Li-Cheng,Mahibul Islam,Naoto Horiguchi,M. Garcia Bardon,Geert Hellings,Julien Ryckaert	2024	5
2	Electron beam metrology for advanced technology nodes Japanese Journal of Applied Physics ·Gian F. Lorusso,Naoto Horiguchi,J. Bömmels,Christopher J. Wilson,G. Van den bosch,Gouri Sankar Kar,Yuan Wan-ju,Steven Godshall,Ryota Watanabe,Resty rezquita septianti,Valentin Calisti	2019	6
3	Sub-100 nm² Cobalt Interconnects IEEE Electron Device Letters ·Shibesh Dutta,Philippe Ortoli,Anshul Gupta,Shreya Kundu,Sven Van Elshocht,H. Bender,Geraldine Jamieson,Wilfried Vandervorst,J. Bömmels,Christopher J. Wilson,Zsolt Tökei,Christoph Adelmann	2018	62
4	Feasibility study of fully self aligned vias for 5nm node BEOL Gayle Murdoch,J. Bömmels,Christopher J. Wilson,Carl Christophelsmeier,Quoc Toan Le,Zsolt Tökei,William F. Clark	2017	27
5	Ruthenium interconnects with 58 nm² cross-section area using a metal-spacer process Shibesh Dutta,Shreya Kundu,Lianggong Wen,Geraldine Jamieson,Kristof Croes,Anshul Gupta,J. Bömmels,Christopher J. Wilson,Christoph Adelmann,Zsolt Tökei	2017	15
6	Barrier/liner stacks for scaling the Cu interconnect metallization Marleen H. van der Veen,N. Jourdan,Endang Susanti,Christopher J. Wilson,N. Heylen,Olalla Varela Pedreira,Herbert Struyf,Kristof Croes,J. Bömmels,Zs. Tôkei	2016	19
7	On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control Zs. Tôkei,Ivan Ciofi,Ph. Roussel,Peter Debacker,Prasanth Raghavan,Marleen H. van der Veen,N. Jourdan,Christopher Wilson,Endang Susanti,Christoph Adelmann,Lianggong Wen,Kristof Croes,B Poppi,Mikhail Krishtab,Silvia Armini,J. Bömmels	2016	17
8	Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging Alfred Ngombo,Mario González,Kristof Croes,Ingrid De Wolf,Gayle Murdoch,Joeri De Vos,J. Bömmels,Eric Beyne,Zsolt Tökei	2016	13
9	Ruthenium metallization for advanced interconnects Liang Wen,Christoph Adelmann,Olalla Varela Pedreira,Shibesh Dutta,M. Popovici,Narjes Amiritehranizadeh,N. Heylen,Kris Vanstreels,Christopher J. Wilson,Sven Van Elshocht,Kristof Croes,J. Bömmels,Zsolt Tökei	2016	46
10	Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies Marleen H. van der Veen,K. Vandersmissen,M. Ignatiev,S. Demuynck,Zhou Hq,Bin Xue,FX Suwarta,A. Leśniewska,Lindsey Hall,Kristof Croes,Linlin Zhao,J. Bömmels,A. Kolics,Zs. Tôkei	2015	42
11	Variability of quadruple-patterning interconnect processes Rogier Baert,Ivan Ciofi,Christopher J. Wilson,Shuichi Matsunari,J. Bömmels,Zsolt Tökei,Julien Ryckaert,Praveen Raghavan,A. Mercha,Diederik Verkest	2015	6
12	DTCO at N7 and beyond: patterning and electrical compromises and opportunities Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Julien Ryckaert,Praveen Raghavan,P. Schuddinck,Trong Huynh-Bao,Arindam Mallik,Antoine Ginésy,Khotsianova Sa,Yasser Sherazi,Philippe Leray,A. Mercha,J. Bömmels,Gregory McIntyre,Kurt Ronse,Aaron Thean,Zsolt Tökei,An Steegen,Diederik Verkest	2015	26
13	Direct etched Cu characterization for advanced interconnects Lianggong Wen,T. N. Sivadas,Bao-Jun Tang,Kristof Croes,Ella A. Cooper,Jeimmy Liliana,Zehra Türk,Eiichi Nishimura,Frédéric Lazzarino,Ivan Ciofi,J. Bömmels,Zsolt Tökei	2015	6
14	Selective co growth on Cu for void-free via fill Feb Sunbury Big Walnut,Philip Chen,Elin Blideskog,Ruben Lieten,William J. Hunks,Michał Kania,Mohamed Bessat,Weimin Li,James O’Neill,Fuad Džaka,Guillermo Lasso Mendoza,J. L. Willis,Vladimir Machkaoutsan,Mustafa Badaroglu,Geoffrey Yeap,Gayle Murdoch,J. Bömmels,Zsolt Tökei	2015	9
15	Impact of process variability on BEOL TDDB lifetime model assessment Kristof Croes,Guohong Xu,Ivan Ciofi,J. Bömmels,Zs. Tôkei	2015	4
16	Contact module at dense gate pitch technology challenges S. Demuynck,Fadi Ghazi,E. Kunnen,Janko Versluijs,Kristof Croes,Chun-Yi Wu,Marc Schaekers,A. Peter,Nisha Jangra,Lieve Teugels,J. Bömmels	2014	4
17	Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes Kristof Croes,Ivan Ciofi,Guohong Xu,Zsolt Tökei,J. Bömmels	2014	4
18	Correlation between field dependent electrical conduction and dielectric breakdown in a SiCOH based low-k (k = 2.0) dielectric Applied Physics Letters ·Chen Wu,Jesús Bailo Bello,Y. Barbarin,Ivan Ciofi,Kristof Croes,J. Bömmels,Ingrid De Wolf,Zs. Tôkei	2013	12
19	Low-lying resonances in electron-argon scattering: Measurements at5−meVresolution and comparison with theory Physical Review A ·D. Shamaida,Seiya Takata,J. Bömmels,Karin Noda,Albert Willard,Wilfried Meyer,Michael Allan,M.‐W. Ruf,H. Hotop	2008	9
20	Energy broadening due to photoion space charge in a high resolution laser photoelectron source Review of Scientific Instruments ·J. Bömmels,E. Leber,Karin Noda,J. Mathias Weber,Julio Cesar Leyva Ruiz,M.‐W. Ruf,H. Hotop	2001	13

About J. Bömmels

J. Bömmels is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Structural Biology, Atomic and Molecular Physics, and Optics and Surfaces, Coatings and Films, having authored 58 papers that have together received 1.0k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (40 papers), Semiconductor materials and devices (38 papers), Semiconductor materials and interfaces (11 papers), Electronic Packaging and Soldering Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers), 3D IC and TSV technologies (8 papers), Atomic and Molecular Physics (7 papers) and Advancements in Photolithography Techniques (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (470 citations), Electrical and Electronic Engineering (804 citations), Atomic and Molecular Physics, and Optics (308 citations), Surfaces, Coatings and Films (59 citations) and Radiation (52 citations). J. Bömmels has collaborated with scholars based in Belgium, Germany and United States. Frequent co-authors include Zsolt Tökei, Kristof Croes, Christoph Adelmann, Christopher J. Wilson, Zs. Tôkei, H. Hotop, Anshul Gupta, Shibesh Dutta, Geraldine Jamieson and Shreya Kundu. Their work appears in journals such as Microelectronic Engineering, Microelectronics Reliability, Journal of Applied Physics, IEEE Electron Device Letters and The European Physical Journal D.

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