J. Bömmels

1.5k total citations
58 papers, 1.0k citations indexed

About

J. Bömmels is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, J. Bömmels has authored 58 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 50 papers in Electrical and Electronic Engineering, 40 papers in Electronic, Optical and Magnetic Materials and 20 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in J. Bömmels's work include Copper Interconnects and Reliability (40 papers), Semiconductor materials and devices (38 papers) and Semiconductor materials and interfaces (11 papers). J. Bömmels is often cited by papers focused on Copper Interconnects and Reliability (40 papers), Semiconductor materials and devices (38 papers) and Semiconductor materials and interfaces (11 papers). J. Bömmels collaborates with scholars based in Belgium, Germany and United States. J. Bömmels's co-authors include Zsolt Tökei, Kristof Croes, Christoph Adelmann, Christopher J. Wilson, Zs. Tôkei, H. Hotop, Anshul Gupta, Shibesh Dutta, Geraldine Jamieson and Shreya Kundu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical Review A.

In The Last Decade

J. Bömmels

58 papers receiving 996 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Bömmels Belgium 19 804 470 308 151 95 58 1.0k
S. Demuynck Belgium 18 985 1.2× 307 0.7× 360 1.2× 151 1.0× 115 1.2× 101 1.2k
Kentaro Shibahara Japan 18 964 1.2× 150 0.3× 213 0.7× 225 1.5× 99 1.0× 80 1.0k
Clarence J. Tracy United States 18 747 0.9× 147 0.3× 325 1.1× 287 1.9× 170 1.8× 52 957
Jeff Bielefeld United States 18 532 0.7× 349 0.7× 133 0.4× 320 2.1× 71 0.7× 35 758
James L. Speidell United States 11 321 0.4× 326 0.7× 200 0.6× 152 1.0× 144 1.5× 21 669
Nicholas A. Lanzillo United States 18 574 0.7× 348 0.7× 241 0.8× 401 2.7× 105 1.1× 66 899
Г. М. Михайлов Russia 12 241 0.3× 153 0.3× 384 1.2× 181 1.2× 40 0.4× 78 680
D. Johnstone United States 20 602 0.7× 337 0.7× 235 0.8× 486 3.2× 118 1.2× 52 938
H. Gokan Japan 13 368 0.5× 117 0.2× 90 0.3× 132 0.9× 177 1.9× 31 517
Bastien Douhard Belgium 19 790 1.0× 50 0.1× 310 1.0× 370 2.5× 194 2.0× 67 1.0k

Countries citing papers authored by J. Bömmels

Since Specialization
Citations

This map shows the geographic impact of J. Bömmels's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Bömmels with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Bömmels more than expected).

Fields of papers citing papers by J. Bömmels

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Bömmels. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Bömmels. The network helps show where J. Bömmels may publish in the future.

Co-authorship network of co-authors of J. Bömmels

This figure shows the co-authorship network connecting the top 25 collaborators of J. Bömmels. A scholar is included among the top collaborators of J. Bömmels based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Bömmels. J. Bömmels is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kükner, Halil, Gioele Mirabelli, Sheng Yang, et al.. (2024). Double-Row CFET: Design Technology Co-Optimization for Area Efficient A7 Technology Node. 1–4. 5 indexed citations
2.
Lorusso, Gian F., Naoto Horiguchi, J. Bömmels, et al.. (2019). Electron beam metrology for advanced technology nodes. Japanese Journal of Applied Physics. 58(SD). SD0801–SD0801. 6 indexed citations
3.
Dutta, Shibesh, Anshul Gupta, Shreya Kundu, et al.. (2018). Sub-100 nm2 Cobalt Interconnects. IEEE Electron Device Letters. 39(5). 731–734. 62 indexed citations
4.
Murdoch, Gayle, J. Bömmels, Christopher J. Wilson, et al.. (2017). Feasibility study of fully self aligned vias for 5nm node BEOL. 1–4. 27 indexed citations
5.
Dutta, Shibesh, Shreya Kundu, Lianggong Wen, et al.. (2017). Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process. 1–3. 15 indexed citations
6.
Veen, Marleen H. van der, N. Jourdan, Christopher J. Wilson, et al.. (2016). Barrier/liner stacks for scaling the Cu interconnect metallization. 28–30. 19 indexed citations
7.
Tôkei, Zs., Ivan Ciofi, Ph. Roussel, et al.. (2016). On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control. 1–2. 17 indexed citations
8.
González, Mario, Kristof Croes, Ingrid De Wolf, et al.. (2016). Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging. 13 indexed citations
9.
Wen, Liang, Christoph Adelmann, Olalla Varela Pedreira, et al.. (2016). Ruthenium metallization for advanced interconnects. 34–36. 46 indexed citations
10.
Veen, Marleen H. van der, K. Vandersmissen, S. Demuynck, et al.. (2015). Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies. 25–28. 42 indexed citations
11.
Baert, Rogier, Ivan Ciofi, Christopher J. Wilson, et al.. (2015). Variability of quadruple-patterning interconnect processes. 7274. 135–138. 6 indexed citations
12.
Ryckaert, Julien, Praveen Raghavan, P. Schuddinck, et al.. (2015). DTCO at N7 and beyond: patterning and electrical compromises and opportunities. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9427. 94270C–94270C. 26 indexed citations
13.
Wen, Lianggong, Bao-Jun Tang, Kristof Croes, et al.. (2015). Direct etched Cu characterization for advanced interconnects. 173–176. 6 indexed citations
14.
Chen, Philip, Ruben Lieten, William J. Hunks, et al.. (2015). Selective co growth on Cu for void-free via fill. 265–268. 9 indexed citations
15.
Croes, Kristof, et al.. (2015). Impact of process variability on BEOL TDDB lifetime model assessment. BD.5.1–BD.5.5. 4 indexed citations
16.
Demuynck, S., E. Kunnen, Janko Versluijs, et al.. (2014). Contact module at dense gate pitch technology challenges. 307–310. 4 indexed citations
17.
Croes, Kristof, et al.. (2014). Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes. BD.5.1–BD.5.4. 4 indexed citations
18.
Wu, Chen, Y. Barbarin, Ivan Ciofi, et al.. (2013). Correlation between field dependent electrical conduction and dielectric breakdown in a SiCOH based low-k (k = 2.0) dielectric. Applied Physics Letters. 103(3). 12 indexed citations
19.
Bömmels, J., et al.. (2008). Low-lying resonances in electron-argon scattering: Measurements at5−meVresolution and comparison with theory. Physical Review A. 78(1). 9 indexed citations
20.
Bömmels, J., et al.. (2001). Energy broadening due to photoion space charge in a high resolution laser photoelectron source. Review of Scientific Instruments. 72(11). 4098–4105. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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