Youssef Travaly

1.9k total citations
69 papers, 1.1k citations indexed

About

Youssef Travaly is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Youssef Travaly has authored 69 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 60 papers in Electrical and Electronic Engineering, 33 papers in Electronic, Optical and Magnetic Materials and 18 papers in Mechanics of Materials. Recurrent topics in Youssef Travaly's work include Semiconductor materials and devices (38 papers), Copper Interconnects and Reliability (33 papers) and 3D IC and TSV technologies (24 papers). Youssef Travaly is often cited by papers focused on Semiconductor materials and devices (38 papers), Copper Interconnects and Reliability (33 papers) and 3D IC and TSV technologies (24 papers). Youssef Travaly collaborates with scholars based in Belgium, United States and Netherlands. Youssef Travaly's co-authors include Eric Beyne, Francesca Iacopi, P. Bertrand, Bart Swinnen, Gerald Beyer, Mikhaı̈l R. Baklanov, Anne Jourdain, J. Van Olmen, Guruprasad Katti and Karen Maex and has published in prestigious journals such as Physical review. B, Condensed matter, Journal of Applied Physics and Advanced Functional Materials.

In The Last Decade

Youssef Travaly

68 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Youssef Travaly Belgium 19 957 460 205 183 179 69 1.1k
G. Passemard France 17 613 0.6× 484 1.1× 191 0.9× 191 1.0× 122 0.7× 67 764
Erik Sleeckx Belgium 19 967 1.0× 165 0.4× 55 0.3× 422 2.3× 230 1.3× 74 1.1k
Shin-Puu Jeng Taiwan 17 649 0.7× 161 0.3× 73 0.4× 418 2.3× 101 0.6× 58 1.0k
Peng Zuo China 16 404 0.4× 242 0.5× 67 0.3× 321 1.8× 140 0.8× 33 755
Sunil Wickramanayaka Japan 14 509 0.5× 157 0.3× 137 0.7× 241 1.3× 62 0.3× 52 640
Yi-Sa Huang Taiwan 8 670 0.7× 366 0.8× 145 0.7× 282 1.5× 42 0.2× 8 848
Kwon-Sang Ryu South Korea 13 368 0.4× 253 0.6× 38 0.2× 274 1.5× 76 0.4× 75 771
Zhiwen Chen China 16 482 0.5× 199 0.4× 71 0.3× 250 1.4× 114 0.6× 67 828
Luhua Xu Singapore 19 953 1.0× 191 0.4× 139 0.7× 349 1.9× 79 0.4× 44 1.3k

Countries citing papers authored by Youssef Travaly

Since Specialization
Citations

This map shows the geographic impact of Youssef Travaly's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Youssef Travaly with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Youssef Travaly more than expected).

Fields of papers citing papers by Youssef Travaly

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Youssef Travaly. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Youssef Travaly. The network helps show where Youssef Travaly may publish in the future.

Co-authorship network of co-authors of Youssef Travaly

This figure shows the co-authorship network connecting the top 25 collaborators of Youssef Travaly. A scholar is included among the top collaborators of Youssef Travaly based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Youssef Travaly. Youssef Travaly is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Suhard, Samuel, et al.. (2012). ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 187. 223–226. 1 indexed citations
2.
Wostyn, Kurt, Ming Zhao, Anne Jourdain, et al.. (2012). Cleaning Requirement in the Thinning Module for 3D-Stacked IC (3D-SIC) Integration. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 187. 265–268. 1 indexed citations
3.
Jourdain, Anne, Alain Phommahaxay, A. Redolfi, et al.. (2011). Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications. 1122–1125. 52 indexed citations
4.
Potoms, Goedele, Alain Phommahaxay, Patrick Jaenen, et al.. (2011). Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging. 25–28. 4 indexed citations
5.
Halder, Sandip, Anne Jourdain, Martine Claes, et al.. (2011). Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's. 999–1002. 10 indexed citations
6.
Katti, Guruprasad, A. Mercha, Michele Stucchi, et al.. (2010). Temperature dependent electrical characteristics of through-si-via (TSV) interconnections. 1–3. 26 indexed citations
7.
Plas, Geert Van der, S. Thijs, Dimitri Linten, et al.. (2010). Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. 1–4. 12 indexed citations
8.
Travaly, Youssef, et al.. (2009). TSV metrology and inspection challenges. 1–4. 8 indexed citations
9.
Civale, Yann, Deniz Sabuncuoglu Tezcan, Harold Philipsen, et al.. (2009). Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 1–4. 20 indexed citations
10.
Olmen, J. Van, Wim Dehaene, K. De Meyer, et al.. (2009). 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 1–5. 36 indexed citations
11.
Pantouvaki, Marianna, A. Humbert, Youssef Travaly, et al.. (2008). Air gap formation by UV-assisted decomposition of CVD material. Microelectronic Engineering. 85(10). 2071–2074. 10 indexed citations
12.
Travaly, Youssef, L. Carbonell, Zs. Tôkei, et al.. (2007). On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance. IEEE Transactions on Semiconductor Manufacturing. 20(3). 333–340. 10 indexed citations
13.
Iacopi, Francesca, Youssef Travaly, B. Eyckens, et al.. (2006). Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation. Journal of Applied Physics. 99(5). 108 indexed citations
14.
Struyf, Herbert, J. Van Olmen, Francesca Iacopi, et al.. (2005). Low-damage damascene patterning of SiOC(H) low-k dielectrics. 30–32. 4 indexed citations
15.
Hove, M. Van, Youssef Travaly, Timo Sajavaara, et al.. (2005). Study of thermal stability of nickel silicide by X-ray reflectivity. Microelectronic Engineering. 82(3-4). 492–496. 5 indexed citations
16.
Olmen, J. Van, Wen‐Wei Wu, M. Van Hove, et al.. (2004). Integration of Single Damascene 85/85 nm L/S copper trenches in Black Diamond using 193 nm optical lithography with dipole illumination. 612. 171–173. 1 indexed citations
17.
Travaly, Youssef, B. Eyckens, A. Rothschild, et al.. (2002). Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film. Microelectronic Engineering. 64(1-4). 367–374. 2 indexed citations
18.
Travaly, Youssef, Yonggang Zhao, Robert Pfeffer, et al.. (1999). Nucleation, growth, and aggregation of gold on polyimide surfaces. Journal of materials research/Pratt's guide to venture capital sources. 14(9). 3673–3683. 11 indexed citations
19.
Bertrand, P., Philippe Lambert, & Youssef Travaly. (1997). Polymer metallization: Low energy ion beam surface modification to improve adhesion. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms. 131(1-4). 71–78. 29 indexed citations
20.
Bertrand, Patrick, Youssef Travaly, & Yves De Puydt. (1993). Etude "in situ" de la formation de l'interface métal-polymère par spectrométries ioniques ISS et SIMS statique. 268. 87–89. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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