Youssef Travaly
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Semiconductor materials and devices 38
- 3D IC and TSV technologies 24
- Electronic Packaging and Soldering Technologies 17
- Advancements in Photolithography Techniques 7
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- Copper Interconnects and Reliability 33
- Co-authors
- Eric Beyne (19 shared papers)Francesca Iacopi (15 shared papers)P. Bertrand (3 shared papers)Bart Swinnen (11 shared papers)Gerald Beyer (12 shared papers)Mikhaı̈l R. Baklanov (7 shared papers)Guruprasad Katti (8 shared papers)J. Van Olmen (9 shared papers)
- Journals
- Microelectronic Engineering (14 papers)Journal of Applied Physics (3 papers)Journal of materials research/Pratt's guide to venture capital sources (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Surface and Interface Analysis (1 paper)
- Partner nations
- BelgiumUnited StatesNetherlands
In The Last Decade
Youssef Travaly
68 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 41
- Electronic, Optical and Magnetic Materials 460
- Electrical and Electronic Engineering 957
- Ceramics and Composites 59
- Mechanics of Materials 205
- Automotive Engineering 74
Countries citing papers authored by Youssef Travaly
This map shows the geographic impact of Youssef Travaly's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Youssef Travaly with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Youssef Travaly more than expected).
Fields of papers citing papers by Youssef Travaly
This network shows the impact of papers produced by Youssef Travaly. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Youssef Travaly. The network helps show where Youssef Travaly may publish in the future.
Co-authors
The 25 scholars most cited alongside Youssef Travaly, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 69 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 108 | |
| 2 | 2005 | 84 | |
| 3 | 2010 | 57 | |
| 4 | 2009 | 56 | |
| 5 | 2011 | 52 | |
| 6 | 2010 | 52 | |
| 7 | 2007 | 47 | |
| 8 | 2011 | 43 | |
| 9 | 2011 | 42 | |
| 10 | 2004 | 42 | |
| 11 | 2009 | 36 | |
| 12 | 2007 | 33 | |
| 13 | 1995 | 31 | |
| 14 | 2006 | 30 | |
| 15 | 1997 | 29 | |
| 16 | 2010 | 26 | |
| 17 | 2005 | 21 | |
| 18 | 2009 | 20 | |
| 19 | 2005 | 18 | |
| 20 | 2000 | 18 |
About Youssef Travaly
Youssef Travaly is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Biomedical Engineering and Automotive Engineering, having authored 69 papers that have together received 1.1k indexed citations. Recurring topics across this work include Semiconductor materials and devices (38 papers), Copper Interconnects and Reliability (33 papers), 3D IC and TSV technologies (24 papers), Metal and Thin Film Mechanics (17 papers), Electronic Packaging and Soldering Technologies (17 papers), Advanced Surface Polishing Techniques (9 papers), Additive Manufacturing and 3D Printing Technologies (9 papers) and Advancements in Photolithography Techniques (7 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (460 citations), Electrical and Electronic Engineering (957 citations), Ceramics and Composites (59 citations), Mechanics of Materials (205 citations) and Automotive Engineering (74 citations). Youssef Travaly has collaborated with scholars based in Belgium, United States and Netherlands. Frequent co-authors include Eric Beyne, Francesca Iacopi, P. Bertrand, Bart Swinnen, Gerald Beyer, Mikhaı̈l R. Baklanov, Guruprasad Katti, J. Van Olmen, Anne Jourdain and Zs. Tôkei. Their work appears in journals such as Microelectronic Engineering, Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources, IEEE Transactions on Components Packaging and Manufacturing Technology and Surface and Interface Analysis.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.