V. Arnal

509 total citations
44 papers, 297 citations indexed

About

V. Arnal is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, V. Arnal has authored 44 papers receiving a total of 297 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 35 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanics of Materials. Recurrent topics in V. Arnal's work include Copper Interconnects and Reliability (35 papers), Semiconductor materials and devices (33 papers) and 3D IC and TSV technologies (10 papers). V. Arnal is often cited by papers focused on Copper Interconnects and Reliability (35 papers), Semiconductor materials and devices (33 papers) and 3D IC and TSV technologies (10 papers). V. Arnal collaborates with scholars based in France, Switzerland and Belgium. V. Arnal's co-authors include J. Torrès, L.G. Gosset, A. Farcy, L.L. Chapelon, M. Broekaart, C. Guedj, M. Assous, T. Chevolleau, L. Arnaud and N. Possémé and has published in prestigious journals such as Ocean Engineering, Microelectronics Reliability and Microelectronic Engineering.

In The Last Decade

V. Arnal

42 papers receiving 286 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
V. Arnal France 11 245 192 65 59 38 44 297
Ennis T. Ogawa United States 10 303 1.2× 263 1.4× 67 1.0× 49 0.8× 49 1.3× 20 358
H. Rathore United States 7 323 1.3× 244 1.3× 62 1.0× 43 0.7× 30 0.8× 15 367
B. Eyckens Belgium 6 346 1.4× 112 0.6× 47 0.7× 39 0.7× 58 1.5× 9 384
S. Luce United States 6 259 1.1× 146 0.8× 43 0.7× 40 0.7× 53 1.4× 11 300
E. Richard France 6 245 1.0× 201 1.0× 72 1.1× 83 1.4× 33 0.9× 21 296
R. Augur Netherlands 9 233 1.0× 171 0.9× 51 0.8× 49 0.8× 42 1.1× 27 269
Shoumian Chen China 8 285 1.2× 101 0.5× 55 0.8× 62 1.1× 45 1.2× 61 325
Dominique Averty France 10 152 0.6× 58 0.3× 37 0.6× 181 3.1× 127 3.3× 31 305
Jeff Gambino United States 10 310 1.3× 108 0.6× 27 0.4× 62 1.1× 48 1.3× 59 344
David De Roest Belgium 9 297 1.2× 220 1.1× 110 1.7× 53 0.9× 23 0.6× 52 332

Countries citing papers authored by V. Arnal

Since Specialization
Citations

This map shows the geographic impact of V. Arnal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Arnal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Arnal more than expected).

Fields of papers citing papers by V. Arnal

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Arnal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Arnal. The network helps show where V. Arnal may publish in the future.

Co-authorship network of co-authors of V. Arnal

This figure shows the co-authorship network connecting the top 25 collaborators of V. Arnal. A scholar is included among the top collaborators of V. Arnal based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with V. Arnal. V. Arnal is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Bonnefoy, Félicien, et al.. (2024). Multidimensional hybrid software-in-the-loop modeling approach for experimental analysis of a floating offshore wind turbine in wave tank experiments. Ocean Engineering. 309. 118390–118390. 11 indexed citations
2.
Arnal, V., Félicien Bonnefoy, Jean‐Christophe Gilloteaux, & Sandrine Aubrun. (2019). Hybrid Model Testing of Floating Wind Turbines: Test Bench for System Identification and Performance Assessment. 4 indexed citations
3.
Arnal, V., et al.. (2017). Parameter Calibration in Dynamic Simulations of Power Cables in Shallow Water to Improve Fatigue Damage Estimation. SPIRE - Sciences Po Institutional REpository. 2 indexed citations
4.
Cheynet, M.C., et al.. (2009). HAADF and EELS Study of ULK Dielectrics. 11(1). 44–46. 2 indexed citations
5.
Gall, Sylvain Le, S. Olivier, Martino Bernard, et al.. (2008). Investigation of the impact of CoWp self-aligned barrier deposition on the porous siOC properties after a direct CMP process. 71. 126–128. 1 indexed citations
6.
Farcy, A., V. Arnal, B. Blampey, et al.. (2007). Impact of process parameters on circuit performance for the 32nm technology node. Microelectronic Engineering. 84(11). 2738–2743. 4 indexed citations
7.
Arnal, V., et al.. (2007). 45 nm node back end of the line yield evaluation on ultrahigh density interconnect structures using electron beam direct write lithography. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 25(1). 124–129. 2 indexed citations
8.
Guedj, C., et al.. (2007). Modification of porous ultra-low K dielectric by electron-beam curing. Microelectronics Reliability. 47(4-5). 764–768. 6 indexed citations
9.
Arnal, V., A. Farcy, V. Jousseaume, et al.. (2007). Materials and processes for high signal propagation performance and reliable 32 nm node BEOL. 1–3. 3 indexed citations
10.
Blampey, B., B. Fléchet, A. Farcy, et al.. (2007). Impact of porous SiOCH on propagation performance measured for narrow interconnects of the 45nm node. Microelectronic Engineering. 84(11). 2744–2749. 1 indexed citations
11.
Arnal, V., L.G. Gosset, W.F.A. Besling, et al.. (2006). Challenges for Interconnect of Future CMOS Generations : Implementation of Emerging Processes and Alternative Architectures. ECS Meeting Abstracts. MA2005-01(15). 706–706. 1 indexed citations
12.
Guedj, C., V. Arnal, R. Daamen, et al.. (2006). Spectral photoresponse of advanced interconnects: a possible solution to the ITRS most difficult characterization challenges. 45. 207–209. 1 indexed citations
13.
Guedj, C., V. Arnal, L. Arnaud, et al.. (2005). Bias-stress-induced evolution of the dielectric properties of porous-ULK/ copper advanced interconnects. Microelectronic Engineering. 80. 345–348. 5 indexed citations
14.
Guedj, C., V. Arnal, L. Arnaud, et al.. (2005). Influence of the diffusion barriers on the dielectric reliability of ULK/Cu advanced interconnects. 57–59. 2 indexed citations
15.
Guedj, C., et al.. (2005). Influence of the sidewall diffusion barrier on the transport properties of advanced Cu/low-k interconnects. Microelectronic Engineering. 82(3-4). 374–379. 3 indexed citations
16.
Chapelon, L.L., et al.. (2004). Characterization and integration of a CVD porous SiOCH (k<2.5) with enhanced mechanical properties for 65 nm CMOS interconnects and below. Microelectronic Engineering. 76(1-4). 1–7. 29 indexed citations
17.
Besling, W.F.A., M. Broekaart, V. Arnal, & J. Torrès. (2004). Line resistance behaviour in narrow lines patterned by a TiN hard mask spacer for 45 nm node interconnects. Microelectronic Engineering. 76(1-4). 167–174. 8 indexed citations
18.
Gosset, L.G., N. Casanova, X. Federspiel, et al.. (2004). Influence of SiH4 process step on physical and electrical properties of advanced copper interconnects. Microelectronic Engineering. 76(1-4). 106–112. 17 indexed citations
19.
Gosset, L.G., V. Arnal, C. Prindle, et al.. (2004). General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material. 473. 65–67. 6 indexed citations
20.
Farcy, A., J. Torrès, V. Arnal, et al.. (2003). A new damascene architecture for high-performance metal–insulator–metal capacitors integration. Microelectronic Engineering. 70(2-4). 368–372. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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