Anne Jourdain

2.3k total citations
114 papers, 1.5k citations indexed

About

Anne Jourdain is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Anne Jourdain has authored 114 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 111 papers in Electrical and Electronic Engineering, 35 papers in Biomedical Engineering and 13 papers in Automotive Engineering. Recurrent topics in Anne Jourdain's work include 3D IC and TSV technologies (85 papers), Electronic Packaging and Soldering Technologies (38 papers) and Advanced MEMS and NEMS Technologies (26 papers). Anne Jourdain is often cited by papers focused on 3D IC and TSV technologies (85 papers), Electronic Packaging and Soldering Technologies (38 papers) and Advanced MEMS and NEMS Technologies (26 papers). Anne Jourdain collaborates with scholars based in Belgium, United States and Netherlands. Anne Jourdain's co-authors include H.A.C. Tilmans, Eric Beyne, Piet De Moor, Bart Swinnen, Gerald Beyer, Alain Phommahaxay, Ingrid De Wolf, Andy Miller, G. Carchon and Kris Baert and has published in prestigious journals such as Applied Surface Science, IEEE Transactions on Microwave Theory and Techniques and IEEE Transactions on Electron Devices.

In The Last Decade

Anne Jourdain

111 papers receiving 1.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Anne Jourdain Belgium 24 1.4k 451 179 126 86 114 1.5k
R. Horton United States 17 1.5k 1.0× 228 0.5× 225 1.3× 161 1.3× 128 1.5× 31 1.6k
Wai Tung Ng Canada 24 1.7k 1.2× 354 0.8× 84 0.5× 85 0.7× 94 1.1× 172 1.8k
B. Dang United States 17 1.4k 1.0× 230 0.5× 250 1.4× 112 0.9× 114 1.3× 29 1.5k
Katsuyuki Sakuma Japan 20 1.8k 1.2× 383 0.8× 386 2.2× 103 0.8× 153 1.8× 82 1.9k
Cornelia Tsang United States 26 2.2k 1.6× 360 0.8× 377 2.1× 167 1.3× 166 1.9× 51 2.4k
E. Sprogis United States 18 1.7k 1.2× 246 0.5× 267 1.5× 153 1.2× 152 1.8× 31 1.7k
Serguei Stoukatch Belgium 13 645 0.4× 234 0.5× 92 0.5× 76 0.6× 54 0.6× 54 787
Venky Sundaram United States 23 2.1k 1.5× 438 1.0× 216 1.2× 43 0.3× 236 2.7× 184 2.3k
Andreas Ostmann Germany 22 1.1k 0.8× 276 0.6× 80 0.4× 58 0.5× 98 1.1× 134 1.4k
V. Kripesh Singapore 23 1.6k 1.1× 272 0.6× 234 1.3× 74 0.6× 178 2.1× 104 1.7k

Countries citing papers authored by Anne Jourdain

Since Specialization
Citations

This map shows the geographic impact of Anne Jourdain's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Anne Jourdain with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Anne Jourdain more than expected).

Fields of papers citing papers by Anne Jourdain

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Anne Jourdain. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Anne Jourdain. The network helps show where Anne Jourdain may publish in the future.

Co-authorship network of co-authors of Anne Jourdain

This figure shows the co-authorship network connecting the top 25 collaborators of Anne Jourdain. A scholar is included among the top collaborators of Anne Jourdain based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Anne Jourdain. Anne Jourdain is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chen, Shih‐Hung, Geert Hellings, A. Veloso, et al.. (2024). Impact of Sub-μm Wafer Thinning on Latch-Up Risk in DTCO/STCO Scaling Era. IEEE Transactions on Electron Devices. 71(4). 2278–2283. 1 indexed citations
2.
Zhao, Peng, Liesbeth Witters, Anne Jourdain, et al.. (2024). Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias. IEEE Transactions on Electron Devices. 71(12). 7963–7969. 2 indexed citations
3.
Hou, Lin, A. Leśniewska, Shuo Kang, et al.. (2023). Dielectric Breakdown of Low Temperature Deposited SiCN Layers. 1 indexed citations
4.
Veloso, A., Geert Eneman, Bjorn Vermeersch, et al.. (2022). Insights into Scaled Logic Devices Connected from Both Wafer Sides. 2022 International Electron Devices Meeting (IEDM). 23.3.1–23.3.4. 4 indexed citations
5.
Lofrano, Melina, Gioele Mirabelli, Sheng Yang, et al.. (2022). Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network. 2022 International Electron Devices Meeting (IEDM). 23.4.1–23.4.4. 18 indexed citations
6.
Jourdain, Anne, Michele Stucchi, Geert Van der Plas, Gerald Beyer, & Eric Beyne. (2022). Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1531–1538. 28 indexed citations
7.
Loo, Roger, Anne Jourdain, Clément Porret, et al.. (2021). Epitaxial Growth of Active Si on Top of SiGe Etch Stop Layer in View of 3D Device Integration. ECS Journal of Solid State Science and Technology. 10(1). 14001–14001. 4 indexed citations
8.
Ryckaert, Julien, Anshul Gupta, Anne Jourdain, et al.. (2019). Extending the roadmap beyond 3nm through system scaling boosters: A case study on Buried Power Rail and Backside Power Delivery. 50–52. 40 indexed citations
9.
Rassoul, Nouredine, Anne Jourdain, Joeri De Vos, et al.. (2018). RIE dynamics for extreme wafer thinning applications. Microelectronic Engineering. 192. 30–37. 12 indexed citations
10.
Vos, Joeri De, Stefaan Van Huylenbroeck, Anne Jourdain, et al.. (2018). Etch process modules development and integration in 3D-SOC applications. Microelectronic Engineering. 196. 38–48. 3 indexed citations
11.
Derakhshandeh, Jaber, Lin Hou, Eric Beyne, et al.. (2016). 3D stacking using bump-less process for sub 10 µm pitches. 128–133. 1 indexed citations
12.
Inoue, Fumihiro, Anne Jourdain, Lan Peng, et al.. (2016). Edge trimming for surface activated dielectric bonded wafers. Microelectronic Engineering. 167. 10–16. 12 indexed citations
13.
Inoue, Fumihiro, Anne Jourdain, Lan Peng, et al.. (2016). Edge trimming for wafer-to-wafer 3D integration. 83–84. 2 indexed citations
14.
15.
Manna, Antonio, Wei Guo, Stefaan Van Huylenbroeck, et al.. (2013). Study of 3D process impact on advanced CMOS devices. European Microelectronics and Packaging Conference. 1–7. 4 indexed citations
16.
Wostyn, Kurt, Ming Zhao, Anne Jourdain, et al.. (2012). Cleaning Requirement in the Thinning Module for 3D-Stacked IC (3D-SIC) Integration. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 187. 265–268. 1 indexed citations
17.
Phommahaxay, Alain, Anne Jourdain, W. Spieß, et al.. (2012). Process characterization of thin wafer debonding with thermoplastic materials. 1–4. 9 indexed citations
18.
Halder, Sandip, Anne Jourdain, Martine Claes, et al.. (2011). Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's. 999–1002. 10 indexed citations
19.
González, Mario, et al.. (2006). A Study on the 0-Level Package Design of a High Accuracy Silicon MEMS Resonator. 1. 1082–1087. 1 indexed citations
20.
Czarnecki, P., et al.. (2005). The influence of the package environment on the functioning and reliability of capacitive RF-MEMS switches. Microwave journal. 48(12). 102–116. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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