Ivan Ciofi

1.6k total citations
88 papers, 1.0k citations indexed

About

Ivan Ciofi is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Ivan Ciofi has authored 88 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 88 papers in Electrical and Electronic Engineering, 74 papers in Electronic, Optical and Magnetic Materials and 11 papers in Mechanics of Materials. Recurrent topics in Ivan Ciofi's work include Copper Interconnects and Reliability (74 papers), Semiconductor materials and devices (67 papers) and Electronic Packaging and Soldering Technologies (17 papers). Ivan Ciofi is often cited by papers focused on Copper Interconnects and Reliability (74 papers), Semiconductor materials and devices (67 papers) and Electronic Packaging and Soldering Technologies (17 papers). Ivan Ciofi collaborates with scholars based in Belgium, United States and Switzerland. Ivan Ciofi's co-authors include Zsolt Tökei, Kristof Croes, Mikhaı̈l R. Baklanov, Zs. Tôkei, Christopher J. Wilson, Olalla Varela Pedreira, Rogier Baert, G. Groeseneken, Philippe Roussel and J. Bömmels and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemical Communications.

In The Last Decade

Ivan Ciofi

83 papers receiving 989 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ivan Ciofi Belgium 17 885 553 193 131 118 88 1.0k
Valeriy Sukharev United States 18 1.2k 1.4× 887 1.6× 126 0.7× 103 0.8× 206 1.7× 104 1.4k
Yuzuru Ohji Japan 19 1.0k 1.1× 144 0.3× 251 1.3× 121 0.9× 119 1.0× 117 1.1k
Joo Tae Moon South Korea 15 683 0.8× 125 0.2× 371 1.9× 71 0.5× 57 0.5× 61 806
Wei-Cheng Lien Taiwan 10 398 0.4× 248 0.4× 335 1.7× 60 0.5× 38 0.3× 37 677
Sunil Wickramanayaka Japan 14 509 0.6× 157 0.3× 241 1.2× 45 0.3× 137 1.2× 52 640
M. Engelhardt Germany 13 980 1.1× 544 1.0× 435 2.3× 271 2.1× 132 1.1× 37 1.2k
R. Moazzami United States 12 646 0.7× 209 0.4× 626 3.2× 92 0.7× 37 0.3× 29 938
Michel Depas Belgium 13 1.6k 1.8× 128 0.2× 399 2.1× 261 2.0× 27 0.2× 27 1.6k
Ho-Kyu Kang South Korea 12 639 0.7× 95 0.2× 421 2.2× 64 0.5× 33 0.3× 35 722
P. Fazan United States 17 1.2k 1.4× 123 0.2× 282 1.5× 188 1.4× 25 0.2× 115 1.3k

Countries citing papers authored by Ivan Ciofi

Since Specialization
Citations

This map shows the geographic impact of Ivan Ciofi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ivan Ciofi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ivan Ciofi more than expected).

Fields of papers citing papers by Ivan Ciofi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ivan Ciofi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ivan Ciofi. The network helps show where Ivan Ciofi may publish in the future.

Co-authorship network of co-authors of Ivan Ciofi

This figure shows the co-authorship network connecting the top 25 collaborators of Ivan Ciofi. A scholar is included among the top collaborators of Ivan Ciofi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ivan Ciofi. Ivan Ciofi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Pedreira, Olalla Varela, et al.. (2025). Cu interconnect lifetime estimation in the presence of thermal gradients. Journal of Applied Physics. 137(7).
2.
Fang, Yu, Ivan Ciofi, Philippe Roussel, et al.. (2025). Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects. IEEE Transactions on Electron Devices. 72(5). 2165–2172.
3.
Pedreira, Olalla Varela, Ph. Roussel, Adli A. Saleh, et al.. (2024). De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. 1–5. 1 indexed citations
4.
Ciofi, Ivan, et al.. (2023). Resistance modeling of short-range connections: impact of current spreading. Japanese Journal of Applied Physics. 62(SC). SC1034–SC1034.
5.
Fang, Yu, Ivan Ciofi, A. Leśniewska, et al.. (2023). Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects. IEEE Transactions on Electron Devices. 70(8). 4332–4337. 2 indexed citations
6.
Baert, Rogier, Ivan Ciofi, Odysseas Zografos, et al.. (2020). Interconnect Design-Technology Co-Optimization for Sub-3nm Technology Nodes. 28–30. 3 indexed citations
7.
Pedreira, Olalla Varela, Houman Zahedmanesh, Ivan Ciofi, Zsolt Tökei, & Kristof Croes. (2019). Electromigration scaling limits of copper interconnects. 4 indexed citations
8.
Ciofi, Ivan, Philippe Roussel, Victor Moroz, et al.. (2017). Modeling of Via Resistance for Advanced Technology Nodes. IEEE Transactions on Electron Devices. 64(5). 2306–2313. 50 indexed citations
9.
Gao, Weimin, Víctor Blanco, Vicky Philipsen, et al.. (2017). Modeling EUVL patterning variability for metal layers in 5nm technology node and its effect on electrical resistance. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 10143. 101430I–101430I. 5 indexed citations
10.
Tôkei, Zs., Ivan Ciofi, Ph. Roussel, et al.. (2016). On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control. 1–2. 17 indexed citations
11.
Gao, Weimin, Ivan Ciofi, Philippe Matagne, et al.. (2016). Rigorous assessment of patterning solution of metal layer in 7 nm technology node. Journal of Micro/Nanolithography MEMS and MOEMS. 15(1). 13505–13505. 5 indexed citations
12.
Pan, Chenyun, Rogier Baert, Ivan Ciofi, Zsolt Tökei, & Azad Naeemi. (2015). System-Level Variation Analysis for Interconnection Networks at Sub-10-nm Technology Nodes Using Multiple Patterning Techniques. IEEE Transactions on Electron Devices. 62(7). 2071–2077. 7 indexed citations
13.
Baert, Rogier, Ivan Ciofi, Christopher J. Wilson, et al.. (2015). Variability of quadruple-patterning interconnect processes. 7274. 135–138. 6 indexed citations
14.
Thean, A. V-Y., Dmitry Yakimets, Trong Huynh-Bao, et al.. (2015). Vertical device architecture for 5nm and beyond: Device & circuit implications. T26–T27. 40 indexed citations
15.
Gao, Weimin, Ivan Ciofi, Philippe Matagne, et al.. (2015). Patterning process exploration of metal 1 layer in 7nm node with 3D patterning flow simulations. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9426. 942606–942606. 3 indexed citations
16.
Baklanov, Mikhaı̈l R., Jean‐François de Marneffe, Liping Zhang, Ivan Ciofi, & Zsolt Tökei. (2014). Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics. Solid State Technology. 57(5). 2 indexed citations
17.
Croes, Kristof, et al.. (2014). Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes. BD.5.1–BD.5.4. 4 indexed citations
18.
Goethals, Frederik, Mikhaı̈l R. Baklanov, Ivan Ciofi, et al.. (2012). A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers. Chemical Communications. 48(22). 2797–2797. 21 indexed citations
19.
Li, Yunlong, Ivan Ciofi, L. Carbonell, et al.. (2007). Moisture Related Low-K Dielectric Reliability Before and After Thermal Annealing. 405–409. 8 indexed citations
20.
Olmen, J. Van, Wen‐Wei Wu, M. Van Hove, et al.. (2004). Integration of Single Damascene 85/85 nm L/S copper trenches in Black Diamond using 193 nm optical lithography with dipole illumination. 612. 171–173. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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