N. Heylen
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced Memory and Neural Computing
- Ferroelectric and Negative Capacitance Devices
Papers in
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- Semiconductor materials and devices 29
- 3D IC and TSV technologies 19
- Electronic Packaging and Soldering Technologies 18
- Integrated Circuits and Semiconductor Failure Analysis 7
- Electrodeposition and Electroless Coatings 5
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- Copper Interconnects and Reliability 32
- Co-authors
- Gerald Beyer (27 shared papers)Eric Beyne (11 shared papers)Andy Miller (7 shared papers)Soon-Wook Kim (4 shared papers)Zsolt Tökei (14 shared papers)Dimitrios Velenis (6 shared papers)Karen Maex (2 shared papers)Lan Peng (3 shared papers)
- Journals
- Japanese Journal of Applied Physics (6 papers)Journal of The Electrochemical Society (3 papers)Microelectronic Engineering (3 papers)Applied Physics Letters (2 papers)IEEE Transactions on Electron Devices (2 papers)
- Partner nations
- BelgiumUnited StatesJapan
In The Last Decade
N. Heylen
56 papers receiving 883 citations
Peers
Comparison fields: 5 of 40
- Electronic, Optical and Magnetic Materials 333
- Electrical and Electronic Engineering 823
- Automotive Engineering 53
- Polymers and Plastics 53
- Atomic and Molecular Physics, and Optics 112
Countries citing papers authored by N. Heylen
This map shows the geographic impact of N. Heylen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Heylen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Heylen more than expected).
Fields of papers citing papers by N. Heylen
This network shows the impact of papers produced by N. Heylen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Heylen. The network helps show where N. Heylen may publish in the future.
Co-authors
The 25 scholars most cited alongside N. Heylen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 59 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 108 | |
| 2 | 2020 | 75 | |
| 3 | 2013 | 72 | |
| 4 | 2008 | 71 | |
| 5 | 2016 | 49 | |
| 6 | 2016 | 46 | |
| 7 | 2005 | 46 | |
| 8 | 2018 | 44 | |
| 9 | 2011 | 43 | |
| 10 | 2014 | 31 | |
| 11 | 2012 | 28 | |
| 12 | 2013 | 28 | |
| 13 | 2015 | 25 | |
| 14 | 2016 | 23 | |
| 15 | 2016 | 19 | |
| 16 | 1999 | 19 | |
| 17 | 2012 | 14 | |
| 18 | 2010 | 13 | |
| 19 | 2015 | 12 | |
| 20 | 2000 | 12 |
About N. Heylen
N. Heylen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Mechanics of Materials and Materials Chemistry, having authored 59 papers that have together received 917 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (29 papers), 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (18 papers), Advanced Surface Polishing Techniques (10 papers), Metal and Thin Film Mechanics (8 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers) and Electrodeposition and Electroless Coatings (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (333 citations), Electrical and Electronic Engineering (823 citations), Automotive Engineering (53 citations), Polymers and Plastics (53 citations) and Atomic and Molecular Physics, and Optics (112 citations). N. Heylen has collaborated with scholars based in Belgium, United States and Japan. Frequent co-authors include Gerald Beyer, Eric Beyne, Andy Miller, Soon-Wook Kim, Zsolt Tökei, Dimitrios Velenis, Karen Maex, Lan Peng, Mikhaı̈l R. Baklanov and Attilio Belmonte. Their work appears in journals such as Japanese Journal of Applied Physics, Journal of The Electrochemical Society, Microelectronic Engineering, Applied Physics Letters and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.