N. Heylen

1.7k total citations
59 papers, 917 citations indexed

About

N. Heylen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, N. Heylen has authored 59 papers receiving a total of 917 indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 33 papers in Electronic, Optical and Magnetic Materials and 10 papers in Biomedical Engineering. Recurrent topics in N. Heylen's work include Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (29 papers) and 3D IC and TSV technologies (19 papers). N. Heylen is often cited by papers focused on Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (29 papers) and 3D IC and TSV technologies (19 papers). N. Heylen collaborates with scholars based in Belgium, United States and Japan. N. Heylen's co-authors include Gerald Beyer, Eric Beyne, Andy Miller, Soon-Wook Kim, Zsolt Tökei, Dimitrios Velenis, Karen Maex, Lan Peng, Mikhaı̈l R. Baklanov and Michel Houssa and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

N. Heylen

56 papers receiving 883 citations

Peers

N. Heylen

EEE

EOMM

AMPO

Hsuan‐Ling Kao Taiwan

Bingfeng Fan China

Takayuki Ohba Japan

Xuewei Zhao China

L.P. Buchwalter United States

Jikai Xu China

Jae‐Hoon Lee South Korea

Guangyang Lin China

Yufeng Tao China

Tai‐Hong Chen Taiwan

Hsuan‐Ling Kao Taiwan

N. Heylen

1.1k ×1.3

EEE

260 ×0.8

EOMM

217 ×1.4

245 ×2.0

116 ×1.0

AMPO

Citations per year, relative to N. Heylen N. Heylen (= 1×) peers Hsuan‐Ling Kao

Countries citing papers authored by N. Heylen

Since Specialization

Citations

This map shows the geographic impact of N. Heylen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Heylen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Heylen more than expected).

Fields of papers citing papers by N. Heylen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Heylen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Heylen. The network helps show where N. Heylen may publish in the future.

Co-authorship network of co-authors of N. Heylen

This figure shows the co-authorship network connecting the top 25 collaborators of N. Heylen. A scholar is included among the top collaborators of N. Heylen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Heylen. N. Heylen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Zhao, Peng, Liesbeth Witters, Anne Jourdain, et al.. (2024). Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias. IEEE Transactions on Electron Devices. 71(12). 7963–7969. 2 indexed citations

Ceulemans, K., et al.. (2024). Chemical mechanical polishing for indium bond pad damascene processing. Japanese Journal of Applied Physics. 63(3). 03SP39–03SP39.

Veen, Marleen H. van der, Jan Delabie, N. Heylen, et al.. (2022). (Invited) Metallizations for Advanced Interconnects and Challenges for Future Nodes. ECS Meeting Abstracts. MA2022-02(15). 809–809.

Kim, Soon-Wook, N. Heylen, Serena Iacovo, et al.. (2020). Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding. 216–222. 75 indexed citations

Briggs, B., Christopher J. Wilson, Julien Ryckaert, et al.. (2018). CMOS Area Scaling And the Need for High Aspect Ratio Vias. 1 indexed citations

Zhang, Liping, Jean‐François de Marneffe, A. Leśniewska, et al.. (2016). Cu passivation for integration of gap-filling ultralow-k dielectrics. Applied Physics Letters. 109(23). 3 indexed citations

Veen, Marleen H. van der, N. Jourdan, Christopher J. Wilson, et al.. (2016). Barrier/liner stacks for scaling the Cu interconnect metallization. 28–30. 19 indexed citations

Wen, Liang, Christoph Adelmann, Olalla Varela Pedreira, et al.. (2016). Ruthenium metallization for advanced interconnects. 34–36. 46 indexed citations

Derakhshandeh, Jaber, Lin Hou, N. Heylen, et al.. (2016). 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects. 128–133. 23 indexed citations

10.

Marneffe, Jean‐François de, N. Heylen, Gayle Murdoch, et al.. (2015). Damage free integration of ultralow-k dielectrics by template replacement approach. Applied Physics Letters. 107(9). 25 indexed citations

11.

Li, Yunlong, et al.. (2012). Electrochemical, Physical, and Electrical Characterization of Two Clean Solutions for Cu PCMP Clean. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 187. 235–239. 1 indexed citations

12.

Civale, Yann, A. Redolfi, Dimitrios Velenis, et al.. (2012). Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections. 1–4. 14 indexed citations

13.

Civale, Yann, Silvia Armini, Harold Philipsen, et al.. (2012). Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-silicon via interconnects. 822–826. 28 indexed citations

14.

Armini, Silvia, S. Demuynck, Johan Swerts, et al.. (2011). Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and 1/2 Pitch Lines: From Coupon to Full-Wafer Experiments. ECS Transactions. 35(2). 117–123. 7 indexed citations

15.

Radisic, Aleksandar, Harold Philipsen, Yu-Shuen Wang, et al.. (2011). TSV Cu Plating and Implications for CMP. ECS Transactions. 33(36). 11–21. 1 indexed citations

16.

Carbonell, L., N. Heylen, Chao Zhao, et al.. (2010). Barrier and seed repair performance of thin RuTa films for Cu interconnects. Microelectronic Engineering. 88(5). 690–693. 6 indexed citations

17.

Demuynck, S., C. Huffman, Maxime Darnon, et al.. (2008). Dielectric Reliability of 50 nm 1/2 Pitch Structures in Aurora<sup>®</sup> LK. 1 indexed citations

18.

Demuynck, S., Zs. Tôkei, Chao Zhao, et al.. (2007). Novel patterning shrink technique enabling sub-50 nm trench and contact integration. 43. 1–4. 1 indexed citations

19.

Heylen, N., et al.. (2005). Geometry Effect on Impurity Incorporation and Grain Growth in Narrow Copper Lines. Journal of The Electrochemical Society. 152(12). C832–C832. 46 indexed citations

20.

Meuris, Marc, Evi Vrancken, N. Heylen, et al.. (1999). Modelling the influence of pad bending on the planarization performance during CMP. MRS Proceedings. 566. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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