Christopher J. Wilson

9.7k citations

109 papers · 5.3k indexed · 2 hit papers · h-index 31

Impact in

Polymers and Plastics top 2%
- Dendrimers and Hyperbranched Polymers
Organic Chemistry top 1%
- Advanced Polymer Synthesis and Characterization
- Catalytic Cross-Coupling Reactions

Papers in

Electronic, Optical and Magnetic Materials 54
- Copper Interconnects and Reliability 52
Electrical and Electronic Engineering 70
- Semiconductor materials and devices 41
- Electronic Packaging and Soldering Technologies 17
- Integrated Circuits and Semiconductor Failure Analysis 11
- 3D IC and TSV technologies 10

Co-authors: Virgil Percec Brad M. Rosen Daniela A. Wilson Mihai Peterca Mohammad R. Imam Nancy M. Hannett Elenita I. Kanin Itamar Simon
Journals: Microelectronic Engineering (7 papers)IEEE Transactions on Electron Devices (5 papers)Journal of Applied Physics (4 papers)Japanese Journal of Applied Physics (4 papers)Journal of the American Chemical Society (4 papers)
Partner nations: Belgium United States United Kingdom

In The Last Decade

Christopher J. Wilson

108 papers receiving 5.2k citations

Hit Papers

align trajectories log scale

Dendron-Mediated Self-Assembly, Disassembly, and Self-Organization of Complex Systems 2009 · 1.0k citations

Peers

Countries citing papers authored by Christopher J. Wilson

Since Specialization

Citations

This map shows the geographic impact of Christopher J. Wilson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Christopher J. Wilson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Christopher J. Wilson more than expected).

Fields of papers citing papers by Christopher J. Wilson

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Christopher J. Wilson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Christopher J. Wilson. The network helps show where Christopher J. Wilson may publish in the future.

Co-authors

The 25 scholars most cited alongside Christopher J. Wilson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Christopher J. Wilson Line = papers co-authored together Christopher J. Wilson links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Semidamascene Interconnects for 2nm node and Beyond Gayle Murdoch, Zsolt Tökei, Sara Paolillo, Olalla Varela Pedreira, Kris Vanstreels, Christopher J. Wilson	2020	19
2	Electron beam metrology for advanced technology nodes Japanese Journal of Applied Physics ·Gian F. Lorusso, Naoto Horiguchi, J. Bömmels, Christopher J. Wilson, G. Van den bosch, Gouri Sankar Kar, Takeyoshi Ohashi, Takumichi Sutani, Ryota Watanabe, Yoshikata Takemasa, Masami Ikota	2019	6
3	CMOS Area Scaling And the Need for High Aspect Ratio Vias B. Briggs, S. Guissi, Christopher J. Wilson, Julien Ryckaert, Sara Paolillo, K. Vandersmissen, Janko Versluijs, Christophe Lorant, N. Heylen, Juergen Boemmels, Zs. Tôkei, Yasser Sherazi, Pieter Weckx, Luka Ključar, M.VanDer Veen, G. Boccardi, V. DeHeyn, Anshul Gupta, Joseph Ervin, M. Kamon	2018	1
4	Sub-100 nm² Cobalt Interconnects IEEE Electron Device Letters ·Shibesh Dutta, Sofie Beyne, Anshul Gupta, Shreya Kundu, Sven Van Elshocht, H. Bender, Geraldine Jamieson, Wilfried Vandervorst, J. Bömmels, Christopher J. Wilson, Zsolt Tökei, Christoph Adelmann	2018	62
5	Feasibility study of fully self aligned vias for 5nm node BEOL Gayle Murdoch, J. Bömmels, Christopher J. Wilson, Khashayar Babaei Gavan, Quoc Toan Le, Zsolt Tökei, William F. Clark	2017	27
6	Ruthenium interconnects with 58 nm² cross-section area using a metal-spacer process Shibesh Dutta, Shreya Kundu, Lianggong Wen, Geraldine Jamieson, Kristof Croes, Anshul Gupta, J. Bömmels, Christopher J. Wilson, Christoph Adelmann, Zsolt Tökei	2017	15
7	Modeling of Via Resistance for Advanced Technology Nodes IEEE Transactions on Electron Devices ·Ivan Ciofi, Philippe Roussel, Yves Saad, Victor Moroz, Chia-Ying Hu, Rogier Baert, Kristof Croes, Antonino Contino, K. Vandersmissen, Weimin Gao, Philippe Matagne, Mustafa Badaroglu, Christopher J. Wilson, D. Mocuta, Zsolt Tökei	2017	50
8	Barrier/liner stacks for scaling the Cu interconnect metallization Marleen H. van der Veen, N. Jourdan, V. Vega Gonzalez, Christopher J. Wilson, N. Heylen, Olalla Varela Pedreira, Herbert Struyf, Kristof Croes, J. Bömmels, Zs. Tôkei	2016	19
9	Ruthenium metallization for advanced interconnects Liang Wen, Christoph Adelmann, Olalla Varela Pedreira, Shibesh Dutta, M. Popovici, Basoene Briggs, N. Heylen, Kris Vanstreels, Christopher J. Wilson, Sven Van Elshocht, Kristof Croes, J. Bömmels, Zsolt Tökei	2016	46
10	Variability of quadruple-patterning interconnect processes Rogier Baert, Ivan Ciofi, Christopher J. Wilson, Victor Vega Gonzalez, J. Bömmels, Zsolt Tökei, Julien Ryckaert, Praveen Raghavan, A. Mercha, Diederik Verkest	2015	6
11	Assessing the low frequency acoustic characteristics of Macrocystis pyrifera, Egregia menziessi, and Laminaria solidungula The Journal of the Acoustical Society of America ·Christopher J. Wilson, Preston S. Wilson, Kenneth H. Dunton	2013	6
12	Fabrication and Measurement of Test Structures to Monitor Stress in SU-8 Films IEEE Transactions on Semiconductor Manufacturing ·Stewart Smith, N. L. Brockie, J. Murray, Giuseppe Schiavone, Christopher J. Wilson, Alton B. Horsfall, Jonathan G. Terry, J.T.M. Stevenson, Andrew R. Mount, A.J. Walton	2012	11
13	Synchrotron measurement of the effect of linewidth scaling on stress in advanced Cu/Low-k interconnects Journal of Applied Physics ·Christopher J. Wilson, Kristof Croes, Chao Zhao, Till H. Metzger, Larry Zhao, Gerald Beyer, Alton B. Horsfall, A.G. O’Neill, Zsolt Tökei	2009	15
14	The disproportionation of Cu(I)X mediated by ligand and solvent into Cu(0) and Cu(II)X₂ and its implications for SET‐LRP Journal of Polymer Science Part A Polymer Chemistry ·Brad M. Rosen, Xuan Jiang, Christopher J. Wilson, Nga H. Nguyen, Michael J. Monteiro, Virgil Percec	2009	189
15	Mesogenic dipyrrins—building blocks for the fabrication of fluorescent and metal-containing materials Chemical Communications ·Christopher J. Wilson, L.C. James, Georg H. Mehl, Ross W. Boyle	2008	15
16	Fabrication of Porous Ti<sub>6</sub>Al<sub>4</sub>V with Designed Structure by Rapid Prototyping Technology Key engineering materials ·J.P. Li, Christopher J. Wilson, Joost R. de Wijn, Clemens van Blitterswijk, K. de Groot	2007	9
17	Direct Measurement of Electromigration-Induced Stress in Interconnect Structures IEEE Transactions on Device and Materials Reliability ·Christopher J. Wilson, Alton B. Horsfall, A.G. O’Neill, Nicolas G. Wright, S.J. Bull, Jonathan G. Terry, J.T.M. Stevenson, A.J. Walton	2007	9
18	Synthesis and structural characterisation of novel bimetallic dipyrromethene complexes: rotational locking of the 5-aryl group Chemical Communications ·Jonathan Sutton, E. Rogerson, Christopher J. Wilson, Amanda E. Sparke, Stephen J. Archibald, Ross W. Boyle	2004	52
19	Viscoelastic Damping Calculations Using a p-Type Finite Element Code Journal of Applied Mechanics ·Christopher J. Wilson, P. Carnevali, R. B. Morris, Yasuhidé Tsuji	1992	8
20	Kinetic deuterium isotope effects in the reactions of 4-nitrophenylnitromethane with various nitrogen bases in anisole Journal of the Chemical Society Faraday Transactions 1 Physical Chemistry in Condensed Phases ·E. F. Caldin, Dayaram M. Parboo, F. Ann Walker, Christopher J. Wilson	1976	4

About Christopher J. Wilson

Christopher J. Wilson is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Surfaces, Coatings and Films, Structural Biology and Pharmaceutical Science, having authored 109 papers that have together received 5.3k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (52 papers), Semiconductor materials and devices (41 papers), Electronic Packaging and Soldering Technologies (17 papers), Metal and Thin Film Mechanics (13 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers), 3D IC and TSV technologies (10 papers), Semiconductor materials and interfaces (8 papers) and Dendrimers and Hyperbranched Polymers (7 papers). The work is most often cited by research in Polymers and Plastics (786 citations), Organic Chemistry (1.5k citations), Biomaterials (645 citations), Electronic, Optical and Magnetic Materials (861 citations) and Surfaces, Coatings and Films (231 citations). Christopher J. Wilson has collaborated with scholars based in Belgium, United States and United Kingdom. Frequent co-authors include Virgil Percec, Brad M. Rosen, Daniela A. Wilson, Mihai Peterca, Mohammad R. Imam, Nancy M. Hannett, Elenita I. Kanin, Itamar Simon, Stephen P. Bell and Julia Zeitlinger. Their work appears in journals such as Microelectronic Engineering, IEEE Transactions on Electron Devices, Journal of Applied Physics, Japanese Journal of Applied Physics and Journal of the American Chemical Society.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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