Aleksandar Radisic

2.1k total citations
62 papers, 1.7k citations indexed

About

Aleksandar Radisic is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Aleksandar Radisic has authored 62 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 60 papers in Electrical and Electronic Engineering, 24 papers in Electronic, Optical and Magnetic Materials and 23 papers in Materials Chemistry. Recurrent topics in Aleksandar Radisic's work include Electrodeposition and Electroless Coatings (43 papers), Copper Interconnects and Reliability (21 papers) and Corrosion Behavior and Inhibition (16 papers). Aleksandar Radisic is often cited by papers focused on Electrodeposition and Electroless Coatings (43 papers), Copper Interconnects and Reliability (21 papers) and Corrosion Behavior and Inhibition (16 papers). Aleksandar Radisic collaborates with scholars based in Belgium, United States and Saudi Arabia. Aleksandar Radisic's co-authors include Peter C. Searson, Philippe M. Vereecken, Frances M. Ross, Peter M. Hoffmann, Lian Guo, J. B. Hannon, Gerko Oskam, Alan C. West, Johan Deconinck and Yang Liu and has published in prestigious journals such as Nano Letters, The Journal of Physical Chemistry B and Journal of The Electrochemical Society.

In The Last Decade

Aleksandar Radisic

60 papers receiving 1.7k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Aleksandar Radisic Belgium 23 1.4k 629 458 387 383 62 1.7k
Leslie A. Adamczyk United States 7 678 0.5× 441 0.7× 96 0.2× 214 0.6× 282 0.7× 10 1.1k
Norman Salmon United States 7 755 0.5× 340 0.5× 267 0.6× 75 0.2× 80 0.2× 22 1.2k
Lionel Santinacci France 26 821 0.6× 695 1.1× 81 0.2× 148 0.4× 257 0.7× 79 1.3k
Wen‐I Liang Taiwan 17 391 0.3× 615 1.0× 57 0.1× 449 1.2× 104 0.3× 22 1.0k
Dmitry Batuk Belgium 23 1.4k 1.0× 841 1.3× 50 0.1× 696 1.8× 89 0.2× 61 2.2k
Andrew R. Akbashev United States 17 1.5k 1.1× 1.9k 3.0× 292 0.6× 1.2k 3.1× 187 0.5× 29 2.8k
María Chiara Spadaro Spain 19 583 0.4× 736 1.2× 82 0.2× 145 0.4× 82 0.2× 73 1.2k
Titta Aaltonen Finland 16 1.6k 1.2× 1.1k 1.8× 32 0.1× 397 1.0× 152 0.4× 23 1.9k
Jean Horkans United States 19 1.6k 1.1× 733 1.2× 438 1.0× 538 1.4× 303 0.8× 34 1.9k
Ovidiu Cretu Japan 20 670 0.5× 1.6k 2.5× 29 0.1× 146 0.4× 250 0.7× 45 2.0k

Countries citing papers authored by Aleksandar Radisic

Since Specialization
Citations

This map shows the geographic impact of Aleksandar Radisic's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Aleksandar Radisic with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Aleksandar Radisic more than expected).

Fields of papers citing papers by Aleksandar Radisic

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Aleksandar Radisic. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Aleksandar Radisic. The network helps show where Aleksandar Radisic may publish in the future.

Co-authorship network of co-authors of Aleksandar Radisic

This figure shows the co-authorship network connecting the top 25 collaborators of Aleksandar Radisic. A scholar is included among the top collaborators of Aleksandar Radisic based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Aleksandar Radisic. Aleksandar Radisic is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hsia, Chih-Hao, Sungho Park, Soichi Watanabe, et al.. (2024). Wafer-Level Electrochemical Deposition and Processing of Nanotwinned Cu RDL. 1–3. 1 indexed citations
2.
3.
Liu, Yang, et al.. (2016). Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers. ECS Transactions. 72(4). 145–152. 2 indexed citations
4.
Liu, Yang, Aleksandar Radisic, Johan Deconinck, & Philippe M. Vereecken. (2014). Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating. Journal of The Electrochemical Society. 161(5). D269–D276. 33 indexed citations
5.
Armini, Silvia, et al.. (2014). Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below?. Journal of The Electrochemical Society. 161(10). D564–D570. 8 indexed citations
6.
Radisic, Aleksandar, et al.. (2014). Electrochemical Deposition of Platinum Interconnects on Flexible Biocompatible Substrates. MRS Proceedings. 1626. 1 indexed citations
7.
Radisic, Aleksandar, et al.. (2013). Electrochemical fabrication of platinum interconnects for implantable electronic devices. Microelectronic Engineering. 120. 251–256. 2 indexed citations
8.
Radisic, Aleksandar, et al.. (2013). The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates. Electrochimica Acta. 92. 474–483. 25 indexed citations
9.
Liu, Yang, et al.. (2012). Multi-scale modeling of direct copper plating on resistive non-copper substrates. Electrochimica Acta. 78. 524–531. 17 indexed citations
10.
Radisic, Aleksandar, Harold Philipsen, Yu-Shuen Wang, et al.. (2011). TSV Cu Plating and Implications for CMP. ECS Transactions. 33(36). 11–21. 1 indexed citations
11.
Vereecken, Philippe M., et al.. (2010). Tailoring Copper Island Density for Copper Plating on a RuTa Substrate. ECS Transactions. 28(29). 9–16. 3 indexed citations
12.
Lühn, Ole, Aleksandar Radisic, Chris Van Hoof, Wouter Ruythooren, & J.‐P. Celis. (2010). Monitoring the Superfilling of Blind Holes with Electrodeposited Copper. Journal of The Electrochemical Society. 157(4). D242–D242. 30 indexed citations
13.
Armini, Silvia, Zsolt Tökei, Aleksandar Radisic, et al.. (2010). Impact of “terminal effect” on Cu electrochemical deposition: Filling capability for different metallization options. Microelectronic Engineering. 88(5). 754–759. 20 indexed citations
14.
Radisic, Aleksandar, et al.. (2008). Electrochemical Nucleation and Growth of Copper on Resistive Substrates. ECS Transactions. 11(28). 25–33. 4 indexed citations
15.
Fischer, Pamela R., et al.. (2008). High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed. Microelectronic Engineering. 85(10). 1957–1961. 20 indexed citations
16.
Radisic, Aleksandar. (2005). Electrochemical nucleation and growth of copper. PhDT. 1 indexed citations
17.
Radisic, Aleksandar, Gerko Oskam, & Peter C. Searson. (2004). Influence of Oxide Thickness on Nucleation and Growth of Copper on Tantalum. Journal of The Electrochemical Society. 151(6). C369–C369. 40 indexed citations
18.
Radisic, Aleksandar, et al.. (2003). Direct Copper Electrodeposition on TaN Barrier Layers. Journal of The Electrochemical Society. 150(5). C362–C362. 64 indexed citations
19.
Hoffmann, Peter M., Aleksandar Radisic, & Peter C. Searson. (2000). Growth Kinetics for Copper Deposition on Si(100) from Pyrophosphate Solution. Journal of The Electrochemical Society. 147(7). 2576–2576. 37 indexed citations
20.
Radisic, Aleksandar, et al.. (1998). Effects of Additives on Thermomechanical Properties of Composites Formed from Thermoset Polymers. MRS Proceedings. 542. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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