Harold Philipsen

1.1k total citations
58 papers, 857 citations indexed

About

Harold Philipsen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Harold Philipsen has authored 58 papers receiving a total of 857 indexed citations (citations by other indexed papers that have themselves been cited), including 55 papers in Electrical and Electronic Engineering, 18 papers in Electronic, Optical and Magnetic Materials and 17 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Harold Philipsen's work include 3D IC and TSV technologies (21 papers), Copper Interconnects and Reliability (18 papers) and Electrodeposition and Electroless Coatings (17 papers). Harold Philipsen is often cited by papers focused on 3D IC and TSV technologies (21 papers), Copper Interconnects and Reliability (18 papers) and Electrodeposition and Electroless Coatings (17 papers). Harold Philipsen collaborates with scholars based in Belgium, Netherlands and Japan. Harold Philipsen's co-authors include Eric Beyne, Silvia Armini, John J. Kelly, Yann Civale, Aleksandar Radisic, Bart Swinnen, Fumihiro Inoue, J. J. Kelly, Kristof Croes and Ingrid De Wolf and has published in prestigious journals such as Chemistry of Materials, Advanced Functional Materials and The Journal of Physical Chemistry B.

In The Last Decade

Harold Philipsen

57 papers receiving 828 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Harold Philipsen Belgium 16 762 195 182 173 161 58 857
Sarkis A. Dagesyan Russia 15 230 0.3× 147 0.8× 248 1.4× 153 0.9× 104 0.6× 35 537
Ranganath Teki United States 11 505 0.7× 68 0.3× 54 0.3× 260 1.5× 232 1.4× 19 668
Manuel Schnabel Germany 20 1.2k 1.6× 273 1.4× 294 1.6× 480 2.8× 90 0.6× 54 1.4k
Ningyi Yuan China 15 541 0.7× 60 0.3× 81 0.4× 370 2.1× 80 0.5× 43 662
D. Della Sala Italy 15 582 0.8× 68 0.3× 177 1.0× 298 1.7× 44 0.3× 49 732
Boyu Yuan China 15 297 0.4× 85 0.4× 42 0.2× 198 1.1× 41 0.3× 44 552
Laureen Meroueh United States 9 278 0.4× 77 0.4× 190 1.0× 187 1.1× 97 0.6× 9 545
Ju-Hyeon Shin South Korea 14 406 0.5× 79 0.4× 291 1.6× 142 0.8× 78 0.5× 22 687
H. Wang China 9 587 0.8× 51 0.3× 113 0.6× 405 2.3× 195 1.2× 29 806
J. Glatz-Reichenbach Germany 10 344 0.5× 157 0.8× 345 1.9× 296 1.7× 70 0.4× 27 774

Countries citing papers authored by Harold Philipsen

Since Specialization
Citations

This map shows the geographic impact of Harold Philipsen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Harold Philipsen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Harold Philipsen more than expected).

Fields of papers citing papers by Harold Philipsen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Harold Philipsen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Harold Philipsen. The network helps show where Harold Philipsen may publish in the future.

Co-authorship network of co-authors of Harold Philipsen

This figure shows the co-authorship network connecting the top 25 collaborators of Harold Philipsen. A scholar is included among the top collaborators of Harold Philipsen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Harold Philipsen. Harold Philipsen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Philipsen, Harold, et al.. (2024). Wet-chemical deposition of metals for advanced semiconductor technology nodes: Rh3+ solution stability and Rh electrodeposition. Electrochimica Acta. 494. 144331–144331. 1 indexed citations
3.
Deng, Kerong, Ivan Erofeev, Angshuman Ray Chowdhuri, et al.. (2024). Nanoscale Wet Etching of Molybdenum Interconnects with Organic Solutions. Small. 20(51). e2406713–e2406713. 2 indexed citations
4.
Erofeev, Ivan, Zainul Aabdin, Antoine Pacco, et al.. (2024). Solving the Annealing of Mo Interconnects for Next‐Gen Integrated Circuits. Advanced Electronic Materials. 10(9). 5 indexed citations
5.
Erofeev, Ivan, Kerong Deng, Zainul Aabdin, et al.. (2024). Digital Etching of Molybdenum Interconnects Using Plasma Oxidation. Advanced Materials Interfaces. 12(1). 1 indexed citations
6.
Erofeev, Ivan, Zainul Aabdin, Antoine Pacco, et al.. (2023). Controlled Stepwise Wet Etching of Polycrystalline Mo Nanowires. Advanced Functional Materials. 34(12). 10 indexed citations
7.
Rosmeulen, M., Kherim Willems, Devin Verreck, et al.. (2022). Liquid Memory and the Future of Data Storage. Lirias (KU Leuven). 1–4. 1 indexed citations
8.
Pacco, Antoine, Zheng Tao, Jens Rip, et al.. (2019). Scaled-Down c-Si and c-SiGe Wagon-Wheels for the Visualization of the Anisotropy and Selectivity of Wet-Chemical Etchants. Nanoscale Research Letters. 14(1). 285–285. 3 indexed citations
9.
Philipsen, Harold, Fumihiro Inoue, K. Vandersmissen, et al.. (2017). Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces. Electrochimica Acta. 230. 407–417. 8 indexed citations
10.
Philipsen, Harold, François Ozanam, P. Allongue, J. J. Kelly, & J.‐N. Chazalviel. (2016). Oxide Formation and Dissolution on Silicon in KOH Electrolyte: An In-Situ Infrared Study. Journal of The Electrochemical Society. 163(5). H327–H338. 8 indexed citations
11.
Inoue, Fumihiro, Harold Philipsen, Stefaan Van Huylenbroeck, et al.. (2015). Glyoxylic Acid as Reducing Agent for Electroless Copper Deposition on Cobalt Liner. ECS Transactions. 64(40). 63–75. 8 indexed citations
12.
Inoue, Fumihiro, Harold Philipsen, Marleen H. van der Veen, et al.. (2014). Role of Bath Composition in Electroless Cu Seeding on Co Liner for through-Si Vias. ECS Journal of Solid State Science and Technology. 4(1). N3108–N3112. 9 indexed citations
13.
Messemaeker, Joke De, Olalla Varela Pedreira, Bart Vandevelde, et al.. (2013). Impact of post-plating anneal and through-silicon via dimensions on Cu pumping. 586–591. 48 indexed citations
14.
Russell, Richard, Loïc Tous, Harold Philipsen, et al.. (2012). A Simple Copper Metallisation Process for High Cell Efficiencies and Reliable Modules. EU PVSEC. 35 indexed citations
15.
Radisic, Aleksandar, Harold Philipsen, Yu-Shuen Wang, et al.. (2011). TSV Cu Plating and Implications for CMP. ECS Transactions. 33(36). 11–21. 1 indexed citations
16.
Civale, Yann, Deniz Sabuncuoglu Tezcan, Harold Philipsen, et al.. (2009). Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 1–4. 20 indexed citations
17.
Philipsen, Harold & John J. Kelly. (2009). Influence of chemical additives on the surface reactivity of Si in KOH solution. Electrochimica Acta. 54(13). 3526–3531. 15 indexed citations
18.
Tezcan, Deniz Sabuncuoglu, et al.. (2009). Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging. 1159–1164. 41 indexed citations
19.
Philipsen, Harold, et al.. (2006). Exploiting Anisotropy for In Situ Measurement of Silicon Etch Rates in KOH Solution. Electrochemical and Solid-State Letters. 9(7). C118–C118. 5 indexed citations
20.
Kelly, John J. & Harold Philipsen. (2005). Anisotropy in the wet-etching of semiconductors. Current Opinion in Solid State and Materials Science. 9(1-2). 84–90. 37 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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