Patrick Verdonck

2.0k citations

107 papers · 1.6k indexed · h-index 22

Impact in

Electronic, Optical and Magnetic Materials top 5%
- Copper Interconnects and Reliability
Mechanics of Materials top 2%
- Metal and Thin Film Mechanics

Papers in ⓘ

Electrical and Electronic Engineering 89
- Semiconductor materials and devices 67
- Plasma Diagnostics and Applications 15
- 3D IC and TSV technologies 8
- Thin-Film Transistor Technologies 7
Electronic, Optical and Magnetic Materials 54
- Copper Interconnects and Reliability 53

Co-authors: Mikhaı̈l R. Baklanov (35 shared papers)Ronaldo Domingues Mansano (29 shared papers)Kris Vanstreels (15 shared papers)Stefan De Gendt (8 shared papers)Johan Meersschaut (12 shared papers)Homero Santiago Maciel (8 shared papers)Adam Urbanowicz (7 shared papers)Denis Shamiryan (7 shared papers)
Journals: Thin Solid Films (14 papers)Microelectronic Engineering (9 papers)Japanese Journal of Applied Physics (8 papers)Applied Physics Letters (5 papers)Journal of Applied Physics (4 papers)
Partner nations: Belgium Brazil United States

In The Last Decade

Patrick Verdonck

102 papers receiving 1.5k citations

Peers

Countries citing papers authored by Patrick Verdonck

Since Specialization

Citations

This map shows the geographic impact of Patrick Verdonck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Verdonck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Verdonck more than expected).

Fields of papers citing papers by Patrick Verdonck

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Patrick Verdonck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Verdonck. The network helps show where Patrick Verdonck may publish in the future.

Co-authors

The 25 scholars most cited alongside Patrick Verdonck, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Patrick Verdonck Line = papers co-authored together Patrick Verdonck links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 107 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Improving mechanical robustness of ultralow-k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening Journal of Applied Physics ·Adam Urbanowicz, Kris Vanstreels, Patrick Verdonck, Denis Shamiryan, Stefan De Gendt, Mikhaı̈l R. Baklanov	2010	75
2	Plasma-Enhanced Atomic Layer Deposition of Two-Dimensional WS₂ from WF₆, H₂ Plasma, and H₂S Chemistry of Materials ·Benjamin Groven, Markus Heyne, Ankit Nalin Mehta, H. Bender, Thomas Nuytten, Johan Meersschaut, Thierry Conard, Patrick Verdonck, Sven Van Elshocht, Wilfried Vandervorst, Stefan De Gendt, Marc Heyns, Iuliana Radu, Matty Caymax, Annelies Delabie	2017	74
3	Low temperature deposition of 2D WS₂ layers from WF₆ and H₂S precursors: impact of reducing agents Chemical Communications ·Annelies Delabie, Matty Caymax, Benjamin Groven, Markus Heyne, Karel Haesevoets, Johan Meersschaut, Thomas Nuytten, H. Bender, Thierry Conard, Patrick Verdonck, Sven Van Elshocht, Stefan De Gendt, Marc Heyns, K. Barla, Iuliana Radu, Aaron Thean	2015	73
4	Two-Dimensional Crystal Grain Size Tuning in WS₂ Atomic Layer Deposition: An Insight in the Nucleation Mechanism Chemistry of Materials ·Benjamin Groven, Ankit Nalin Mehta, H. Bender, Johan Meersschaut, Thomas Nuytten, Patrick Verdonck, Thierry Conard, Quentin Smets, T. Schram, Ben Schoenaers, A. Stesmans, Valeri Afanas’ev, Wilfried Vandervorst, Marc Heyns, Matty Caymax, Iuliana Radu, Annelies Delabie	2018	63
5	Effect of pressure on efficiency of UV curing of CVD-derived low-k material at different wavelengths Microelectronic Engineering ·Lutz Prager, P. Maršík, Luise Wennrich, Mikhaı̈l R. Baklanov, S. Naumov, L. Pistol, Dieter Schneider, Jürgen W. Gerlach, Patrick Verdonck, Michael R. Buchmeiser	2008	58
6	Nanoscale Noncontact Subsurface Investigations of Mechanical and Optical Properties of Nanoporous Low-k Material Thin Film ACS Nano ·Alexey M. Lomonosov, Adil Ayouch, P. Ruello, G. Vaudel, Mikhaı̈l R. Baklanov, Patrick Verdonck, Larry Zhao, Vitalyi Gusev	2012	55
7	Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding ECS Journal of Solid State Science and Technology ·Fumihiro Inoue, Lan Peng, Serena Iacovo, Alain Phommahaxay, Patrick Verdonck, Johan Meersschaut, Praveen Dara, Erik Sleeckx, Andy Miller, Gerald Beyer, Eric Beyne	2019	54
8	Depth-profiling of elastic inhomogeneities in transparent nanoporous low-k materials by picosecond ultrasonic interferometry Applied Physics Letters ·Charfeddine Mechri, P. Ruello, J. M. Breteau, Mikhaı̈l R. Baklanov, Patrick Verdonck, Vitalyi Gusev	2009	54
9	Sterilization by oxygen plasma Applied Surface Science ·Adir José Moreira, Ronaldo Domingues Mansano, Terezinha de Jesus Andreoli Pinto, Ronaldo Ruas, Luis da Silva Zambon, Mônica Valero da Silva, Patrick Verdonck	2004	53
10	Effect of Pore Structure of Nanometer Scale Porous Films on the Measured Elastic Modulus Langmuir ·Kris Vanstreels, Chen Wu, Mario González, Dieter Schneider, David Gidley, Patrick Verdonck, Mikhaı̈l R. Baklanov	2013	48
11	Characterization and optimization of porogen-based PECVD deposited extreme low-k materials as a function of UV-cure time Surface and Coatings Technology ·Patrick Verdonck, David De Roest, Shinya Kaneko, Rudy Caluwaerts, Naoto Tsuji, Kiyohiro Matsushita, Nathan Kemeling, Youssef Travaly, Hessel Sprey, Marc Schaekers, Gerald Beyer	2007	47
12	Porogen residues detection in optical properties of low-k dielectrics cured by ultraviolet radiation Thin Solid Films ·P. Maršík, Patrick Verdonck, David De Roest, Mikhaı̈l R. Baklanov	2010	43
13	Nucleation mechanism during WS2 plasma enhanced atomic layer deposition on amorphous Al2O3 and sapphire substrates Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ·Benjamin Groven, Ankit Nalin Mehta, H. Bender, Quentin Smets, Johan Meersschaut, Alexis Franquet, Thierry Conard, Thomas Nuytten, Patrick Verdonck, Wilfried Vandervorst, Marc Heyns, Iuliana Radu, Matty Caymax, Annelies Delabie	2017	36
14	Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultralow-k plasma-enhanced chemical vapor deposition dielectrics Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena ·Adam Urbanowicz, Kris Vanstreels, Patrick Verdonck, Els Van Besien, Christos Trompoukis, Denis Shamiryan, Stefan De Gendt, Mikhaı̈l R. Baklanov	2011	35
15	Effects of the methane content on the characteristics of diamond-like carbon films produced by sputtering Thin Solid Films ·Ronaldo Domingues Mansano, M. Massi, L.S. Zambom, Patrick Verdonck, P.M. Nogueira, Homero Santiago Maciel, C. Otani	2000	31
16	Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers Langmuir ·Yiting Sun, Mikhail Krishtab, Herbert Struyf, Patrick Verdonck, Steven De Feyter, Mikhaı̈l R. Baklanov, Silvia Armini	2014	30
17	Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow-k dielectrics Applied Physics Letters ·Kris Vanstreels, Chunqiang Wu, Patrick Verdonck, Mikhaı̈l R. Baklanov	2012	27
18	Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH[sub 3] Plasma Journal of The Electrochemical Society ·Adam Urbanowicz, Denis Shamiryan, A. Zaka, Patrick Verdonck, Stefan De Gendt, Mikhaı̈l R. Baklanov	2010	25
19	Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance Thin Solid Films ·P. Maršík, Adam Urbanowicz, Patrick Verdonck, David De Roest, Hessel Sprey, Mikhaı̈l R. Baklanov	2011	24
20	Effects of plasma etching on DLC films Thin Solid Films ·M. Massi, Ronaldo Domingues Mansano, Homero Santiago Maciel, C. Otani, Patrick Verdonck, L.N.B.M. Nishioka	1999	24

About Patrick Verdonck

Patrick Verdonck is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Materials Chemistry and Biomedical Engineering, having authored 107 papers that have together received 1.6k indexed citations. Recurring topics across this work include Semiconductor materials and devices (67 papers), Copper Interconnects and Reliability (53 papers), Metal and Thin Film Mechanics (39 papers), Plasma Diagnostics and Applications (15 papers), Diamond and Carbon-based Materials Research (10 papers), 3D IC and TSV technologies (8 papers), Thin-Film Transistor Technologies (7 papers) and Advanced Surface Polishing Techniques (6 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (646 citations), Mechanics of Materials (483 citations), Electrical and Electronic Engineering (1.1k citations), Ceramics and Composites (92 citations) and Materials Chemistry (584 citations). Patrick Verdonck has collaborated with scholars based in Belgium, Brazil and United States. Frequent co-authors include Mikhaı̈l R. Baklanov, Ronaldo Domingues Mansano, Kris Vanstreels, Stefan De Gendt, Johan Meersschaut, Homero Santiago Maciel, Adam Urbanowicz, Denis Shamiryan, P. Maršík and David De Roest. Their work appears in journals such as Thin Solid Films, Microelectronic Engineering, Japanese Journal of Applied Physics, Applied Physics Letters and Journal of Applied Physics.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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