Patrick Verdonck

2.0k total citations
107 papers, 1.6k citations indexed

About

Patrick Verdonck is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Patrick Verdonck has authored 107 papers receiving a total of 1.6k indexed citations (citations by other indexed papers that have themselves been cited), including 89 papers in Electrical and Electronic Engineering, 54 papers in Electronic, Optical and Magnetic Materials and 40 papers in Mechanics of Materials. Recurrent topics in Patrick Verdonck's work include Semiconductor materials and devices (67 papers), Copper Interconnects and Reliability (53 papers) and Metal and Thin Film Mechanics (39 papers). Patrick Verdonck is often cited by papers focused on Semiconductor materials and devices (67 papers), Copper Interconnects and Reliability (53 papers) and Metal and Thin Film Mechanics (39 papers). Patrick Verdonck collaborates with scholars based in Belgium, Brazil and United States. Patrick Verdonck's co-authors include Mikhaı̈l R. Baklanov, Ronaldo Domingues Mansano, Kris Vanstreels, Stefan De Gendt, Johan Meersschaut, Homero Santiago Maciel, Adam Urbanowicz, Denis Shamiryan, Thierry Conard and P. Maršík and has published in prestigious journals such as ACS Nano, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Patrick Verdonck

102 papers receiving 1.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Patrick Verdonck Belgium 22 1.1k 646 584 483 253 107 1.6k
E. Blanquet France 24 1.1k 1.0× 317 0.5× 742 1.3× 415 0.9× 254 1.0× 142 1.8k
Sean Hearne United States 20 1.1k 1.0× 768 1.2× 1.0k 1.7× 935 1.9× 322 1.3× 45 2.3k
Douglas L. Irving United States 27 816 0.7× 747 1.2× 1.3k 2.2× 401 0.8× 526 2.1× 72 3.6k
S. Mohan India 24 1.1k 1.0× 294 0.5× 1.1k 1.9× 436 0.9× 236 0.9× 129 1.9k
C.S. Sandu Switzerland 28 906 0.8× 363 0.6× 1.4k 2.3× 765 1.6× 768 3.0× 83 2.1k
J. A. Floro United States 17 953 0.9× 548 0.8× 789 1.4× 776 1.6× 347 1.4× 27 2.0k
Dae‐Hong Ko South Korea 25 1.9k 1.7× 287 0.4× 1.4k 2.3× 311 0.6× 243 1.0× 172 2.4k
Zs. Tôkei Belgium 24 1.5k 1.3× 930 1.4× 390 0.7× 240 0.5× 206 0.8× 133 1.9k
G. Ecke Germany 20 754 0.7× 310 0.5× 556 1.0× 202 0.4× 169 0.7× 86 1.3k
N. David Theodore United States 23 1.2k 1.1× 212 0.3× 677 1.2× 138 0.3× 261 1.0× 106 1.6k

Countries citing papers authored by Patrick Verdonck

Since Specialization
Citations

This map shows the geographic impact of Patrick Verdonck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Verdonck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Verdonck more than expected).

Fields of papers citing papers by Patrick Verdonck

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Patrick Verdonck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Verdonck. The network helps show where Patrick Verdonck may publish in the future.

Co-authorship network of co-authors of Patrick Verdonck

This figure shows the co-authorship network connecting the top 25 collaborators of Patrick Verdonck. A scholar is included among the top collaborators of Patrick Verdonck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Patrick Verdonck. Patrick Verdonck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Inoue, Fumihiro, Lan Peng, Serena Iacovo, et al.. (2019). Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding. ECS Journal of Solid State Science and Technology. 8(6). P346–P350. 54 indexed citations
2.
Inoue, Fumihiro, Lan Peng, Serena Iacovo, et al.. (2018). Influence of Composition of SiCN Film for Surface Activated Bonding. ECS Transactions. 86(5). 159–168. 3 indexed citations
3.
Groven, Benjamin, Markus Heyne, Ankit Nalin Mehta, et al.. (2017). Plasma-Enhanced Atomic Layer Deposition of Two-Dimensional WS2 from WF6, H2 Plasma, and H2S. Chemistry of Materials. 29(7). 2927–2938. 74 indexed citations
4.
Zhang, Liping, Jean‐François de Marneffe, A. Leśniewska, et al.. (2016). Cu passivation for integration of gap-filling ultralow-k dielectrics. Applied Physics Letters. 109(23). 3 indexed citations
5.
Peng, Lan, Soon-Wook Kim, Fumihiro Inoue, et al.. (2016). Development of multi-stack dielectric wafer bonding. 22–25. 7 indexed citations
6.
Marneffe, Jean‐François de, Markus Heyne, Mikołaj Łukaszewicz, et al.. (2015). Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics. Journal of Applied Physics. 118(13). 22 indexed citations
7.
Vanstreels, Kris, et al.. (2012). Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow-k dielectrics. Applied Physics Letters. 101(12). 123109–123109. 27 indexed citations
8.
Verdonck, Patrick, Els Van Besien, Kris Vanstreels, et al.. (2011). Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low-k Materials. Japanese Journal of Applied Physics. 50(5S1). 05EB05–05EB05. 7 indexed citations
9.
Verdonck, Patrick, Annelies Delabie, Johan Swerts, et al.. (2011). Fundamental study of atomic layer deposition in and on porous low-k films. 88. 1–3. 2 indexed citations
10.
Maršík, P., et al.. (2011). Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance. Thin Solid Films. 519(11). 3619–3626. 24 indexed citations
11.
Mansano, Ronaldo Domingues, et al.. (2010). Diffraction gratings fabricated in DLC thin films. Surface and Coatings Technology. 204(18-19). 2966–2970. 10 indexed citations
12.
Urbanowicz, Adam, et al.. (2010). Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH[sub 3] Plasma. Journal of The Electrochemical Society. 157(5). H565–H565. 25 indexed citations
13.
Huffman, C., Maxime Darnon, Herbert Struyf, et al.. (2009). Dielectric Reliability of 50 nm Half Pitch Structures in Aurora® LK. Japanese Journal of Applied Physics. 48(4S). 04C018–04C018. 6 indexed citations
14.
Verdonck, Patrick, et al.. (2006). Deposition of silicon oxynitride at room temperature by Inductively Coupled Plasma-CVD. Thin Solid Films. 515(2). 596–598. 8 indexed citations
15.
Salvadori, M. C., et al.. (2005). Diamond microstructures fabricated using silicon molds. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 23(6). 1575–1578. 3 indexed citations
16.
Verdonck, Patrick, et al.. (2004). Non-stoichiometric silicon oxide deposited at low gaseous N2O/SiH4 ratios. Thin Solid Films. 459(1-2). 220–223. 6 indexed citations
17.
Morimoto, Nilton Itiro, Renato P. Ribas, & Patrick Verdonck. (2002). Microelectronics technology and devices : SBMICRO 2002 : proceedings of the seventeenth international symposium. Electrochemical Society eBooks. 1 indexed citations
18.
Mansano, Ronaldo Domingues, et al.. (1999). LPCVD deposition of silicon nitride assisted by high density plasmas. Thin Solid Films. 343-344. 299–301. 9 indexed citations
19.
Mammana, Victor P., et al.. (1997). Diamond membranes with controlled porosity. Diamond and Related Materials. 6(12). 1824–1829. 12 indexed citations
20.
Verdonck, Patrick, et al.. (1993). Reactive ion etching and plasma etching of tungsten. Microelectronic Engineering. 21(1-4). 329–332. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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