K. Vandersmissen

956 total citations
27 papers, 417 citations indexed

About

K. Vandersmissen is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, K. Vandersmissen has authored 27 papers receiving a total of 417 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 7 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in K. Vandersmissen's work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (7 papers). K. Vandersmissen is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (7 papers). K. Vandersmissen collaborates with scholars based in Belgium, United States and Austria. K. Vandersmissen's co-authors include Kristof Croes, Eric Beyne, Harold Philipsen, Marleen H. van der Veen, Zs. Tôkei, A. Leśniewska, Yann Civale, N. Jourdan, J. Bömmels and Silvia Armini and has published in prestigious journals such as Journal of The Electrochemical Society, Electrochimica Acta and IEEE Transactions on Electron Devices.

In The Last Decade

K. Vandersmissen

27 papers receiving 407 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
K. Vandersmissen Belgium 12 391 159 78 75 52 27 417
Geraldine Jamieson Belgium 11 319 0.8× 125 0.8× 49 0.6× 81 1.1× 51 1.0× 26 345
Yann Civale Belgium 15 533 1.4× 96 0.6× 107 1.4× 95 1.3× 67 1.3× 42 556
M. Assous France 14 401 1.0× 146 0.9× 68 0.9× 21 0.3× 31 0.6× 45 433
F. Chen United States 12 429 1.1× 264 1.7× 34 0.4× 35 0.5× 32 0.6× 21 446
Rozalia Beica United States 8 305 0.8× 47 0.3× 60 0.8× 27 0.4× 21 0.4× 25 321
Jang‐Hi Im United States 9 419 1.1× 74 0.5× 106 1.4× 40 0.5× 25 0.5× 16 448
B. Eyckens Belgium 6 346 0.9× 112 0.7× 58 0.7× 22 0.3× 39 0.8× 9 384
D. Bouchu France 11 267 0.7× 105 0.7× 39 0.5× 18 0.2× 33 0.6× 33 294
L.L. Chapelon France 11 257 0.7× 128 0.8× 41 0.5× 19 0.3× 43 0.8× 25 291
Patrick Justison United States 13 439 1.1× 305 1.9× 21 0.3× 24 0.3× 27 0.5× 45 454

Countries citing papers authored by K. Vandersmissen

Since Specialization
Citations

This map shows the geographic impact of K. Vandersmissen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Vandersmissen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Vandersmissen more than expected).

Fields of papers citing papers by K. Vandersmissen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. Vandersmissen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Vandersmissen. The network helps show where K. Vandersmissen may publish in the future.

Co-authorship network of co-authors of K. Vandersmissen

This figure shows the co-authorship network connecting the top 25 collaborators of K. Vandersmissen. A scholar is included among the top collaborators of K. Vandersmissen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. Vandersmissen. K. Vandersmissen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhao, Peng, Liesbeth Witters, Anne Jourdain, et al.. (2024). Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias. IEEE Transactions on Electron Devices. 71(12). 7963–7969. 2 indexed citations
2.
Brems, Steven, Didit Yudistira, Daire Cott, et al.. (2023). Wafer‐Scale Integration of Single Layer Graphene Electro‐Absorption Modulators in a 300 mm CMOS Pilot Line. Laser & Photonics Review. 17(6). 14 indexed citations
3.
Subhechha, Subhali, Nouredine Rassoul, Hubert Hody, et al.. (2022). Device engineering guidelines for performance boost in IGZO front gated TFTs based on defect control. 88–88. 1 indexed citations
4.
Schram, T., Quentin Smets, D. Radisic, et al.. (2021). High yield and process uniformity for 300 mm integrated WS 2 FETs. Symposium on VLSI Technology. 1–2. 9 indexed citations
5.
Briggs, B., Christopher J. Wilson, Julien Ryckaert, et al.. (2018). CMOS Area Scaling And the Need for High Aspect Ratio Vias. 1 indexed citations
6.
Pedreira, Olalla Varela, Kristof Croes, Houman Zahedmanesh, et al.. (2018). Electromigration and Thermal Storage Study of Barrierless Co Vias. 48–50. 22 indexed citations
7.
Ciofi, Ivan, Philippe Roussel, Victor Moroz, et al.. (2017). Modeling of Via Resistance for Advanced Technology Nodes. IEEE Transactions on Electron Devices. 64(5). 2306–2313. 50 indexed citations
8.
Philipsen, Harold, Fumihiro Inoue, K. Vandersmissen, et al.. (2017). Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces. Electrochimica Acta. 230. 407–417. 8 indexed citations
9.
Pedreira, Olalla Varela, Kristof Croes, A. Leśniewska, et al.. (2017). Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects. 6B–2.1. 62 indexed citations
10.
Derakhshandeh, Jaber, Lin Hou, Eric Beyne, et al.. (2016). 3D stacking using bump-less process for sub 10 µm pitches. 128–133. 1 indexed citations
11.
Derakhshandeh, Jaber, Lin Hou, N. Heylen, et al.. (2016). 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects. 128–133. 23 indexed citations
12.
Veen, Marleen H. van der, K. Vandersmissen, S. Demuynck, et al.. (2015). Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies. 25–28. 42 indexed citations
13.
Vandersmissen, K., Fumihiro Inoue, Dimitrios Velenis, et al.. (2015). Demonstration of a cost effective Cu electroless TSV metallization scheme. 197–200. 5 indexed citations
14.
Inoue, Fumihiro, Harold Philipsen, Marleen H. van der Veen, et al.. (2014). Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 768. 1–4. 4 indexed citations
15.
Phommahaxay, Alain, Ingrid De Wolf, Sebastian Brand, et al.. (2013). High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 227–231. 14 indexed citations
16.
Suhard, Samuel, K. Vandersmissen, Patrick Jaenen, et al.. (2012). 3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers. 1–5. 1 indexed citations
17.
Civale, Yann, Silvia Armini, Harold Philipsen, et al.. (2012). Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-silicon via interconnects. 822–826. 28 indexed citations
18.
Radisic, Aleksandar, Harold Philipsen, Yu-Shuen Wang, et al.. (2011). TSV Cu Plating and Implications for CMP. ECS Transactions. 33(36). 11–21. 1 indexed citations
19.
Redolfi, A., Dimitrios Velenis, Patrick Jaenen, et al.. (2011). Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers. 1384–1388. 43 indexed citations
20.
Armini, Silvia, K. Vandersmissen, Harold Philipsen, et al.. (2010). Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed. Journal of The Electrochemical Society. 158(2). H160–H160. 38 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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