Joeri De Vos

1.1k total citations
98 papers, 861 citations indexed

About

Joeri De Vos is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Joeri De Vos has authored 98 papers receiving a total of 861 indexed citations (citations by other indexed papers that have themselves been cited), including 97 papers in Electrical and Electronic Engineering, 22 papers in Biomedical Engineering and 14 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Joeri De Vos's work include 3D IC and TSV technologies (66 papers), Electronic Packaging and Soldering Technologies (45 papers) and Semiconductor materials and devices (30 papers). Joeri De Vos is often cited by papers focused on 3D IC and TSV technologies (66 papers), Electronic Packaging and Soldering Technologies (45 papers) and Semiconductor materials and devices (30 papers). Joeri De Vos collaborates with scholars based in Belgium, Austria and Netherlands. Joeri De Vos's co-authors include Eric Beyne, Gerald Beyer, Andy Miller, Geert Van der Plas, Serena Iacovo, Vladimir Cherman, Jan Van Houdt, Anne Jourdain, Soon-Wook Kim and D. Wellekens and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, Applied Surface Science and IEEE Transactions on Electron Devices.

In The Last Decade

Joeri De Vos

94 papers receiving 821 citations

Peers

Joeri De Vos

EEE

BE

EOMM

AE

ME

Sri M. Sri-Jayantha United States

Alain Phommahaxay Belgium

Serguei Stoukatch Belgium

Cheryl Selvanayagam Singapore

L.W. Schaper United States

Soon Wee Ho Singapore

T.C. Chai Singapore

Kripesh Vaidyanathan Singapore

Wai Tung Ng Canada

Scott Pozder United States

Sri M. Sri-Jayantha United States

Joeri De Vos

672 ×0.8

EEE

109 ×0.6

BE

61 ×0.6

EOMM

85 ×0.8

AE

104 ×1.4

ME

Citations per year, relative to Joeri De Vos Joeri De Vos (= 1×) peers Sri M. Sri-Jayantha

Countries citing papers authored by Joeri De Vos

Since Specialization

Citations

This map shows the geographic impact of Joeri De Vos's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Joeri De Vos with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Joeri De Vos more than expected).

Fields of papers citing papers by Joeri De Vos

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Joeri De Vos. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Joeri De Vos. The network helps show where Joeri De Vos may publish in the future.

Co-authorship network of co-authors of Joeri De Vos

This figure shows the co-authorship network connecting the top 25 collaborators of Joeri De Vos. A scholar is included among the top collaborators of Joeri De Vos based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Joeri De Vos. Joeri De Vos is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Huylenbroeck, Stefaan Van, Soon Aik Chew, Boyao Zhang, et al.. (2025). Self-formed Barrier using Cu-Mn Alloy Seed applied to a 400nm Pitch Wafer-to-Wafer Hybrid Bonding Technology. 341–346. 1 indexed citations

2.

Huylenbroeck, Stefaan Van, Soon Aik Chew, Boyao Zhang, et al.. (2025). Wafer-to-Wafer Hybrid Bonding Technology with 300nm Interconnect Pitch. 550–554. 1 indexed citations

3.

Zhao, Peng, Liesbeth Witters, Anne Jourdain, et al.. (2024). Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias. IEEE Transactions on Electron Devices. 71(12). 7963–7969. 2 indexed citations

4.

Chew, Soon Aik, Joeri De Vos, & Eric Beyne. (2024). Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch. 1(2). 71–72. 13 indexed citations

5.

Chew, Soon Aik, Boyao Zhang, Joeri De Vos, et al.. (2024). High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications. 1–6. 1 indexed citations

6.

Hou, Lin, A. Leśniewska, Shuo Kang, et al.. (2023). Dielectric Breakdown of Low Temperature Deposited SiCN Layers. 1 indexed citations

7.

Iacovo, Serena, K. Devriendt, Joeri De Vos, et al.. (2022). 700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding. 334–337. 13 indexed citations

8.

Kim, Soon-Wook, N. Heylen, Serena Iacovo, et al.. (2020). Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding. 216–222. 75 indexed citations

9.

Jourdain, Anne, Filip Schleicher, Joeri De Vos, et al.. (2020). Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration. 42–48. 40 indexed citations

10.

Vos, Joeri De, Stefaan Van Huylenbroeck, Anne Jourdain, et al.. (2018). Etch process modules development and integration in 3D-SOC applications. Microelectronic Engineering. 196. 38–48. 3 indexed citations

11.

Rassoul, Nouredine, Anne Jourdain, Joeri De Vos, et al.. (2018). RIE dynamics for extreme wafer thinning applications. Microelectronic Engineering. 192. 30–37. 12 indexed citations

12.

Stucchi, Michele, Joeri De Vos, Anne Jourdain, et al.. (2018). Anomalous ${C}$ – ${V}$ Inversion in TSVs: The Problem and Its Cure. IEEE Transactions on Electron Devices. 65(4). 1473–1479. 2 indexed citations

13.

González, Mario, Kristof Croes, Ingrid De Wolf, et al.. (2016). Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging. 13 indexed citations

14.

Vos, Joeri De, Lan Peng, Alain Phommahaxay, et al.. (2016). Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 1–5. 10 indexed citations

15.

Peng, Lan, Soon-Wook Kim, Fumihiro Inoue, et al.. (2016). Development of multi-stack dielectric wafer bonding. 22–25. 7 indexed citations

16.

Govoreanu, B., J. A. Kittl, Joeri De Vos, et al.. (2009). The Flash Memory Cell for the Nodes to Come: Material Requirements from a Device Perspective. ECS Transactions. 19(2). 649–668. 6 indexed citations

17.

Wellekens, D., Pieter Blomme, B. Govoreanu, et al.. (2006). Al2O3 Based Flash Interpoly Dielectrics: a Comparative Retention Study. 238–241. 18 indexed citations

18.

Vos, Joeri De, Herbert De Smet, & André Van Calster. (1997). High voltage EL drivers integrated on glass. Ghent University Academic Bibliography (Ghent University). 1 indexed citations

19.

Baets, Johan De, Herbert De Smet, Joeri De Vos, et al.. (1997). Technology and circuit aspects of reflective PNLC microdisplays. Ghent University Academic Bibliography (Ghent University). 2 indexed citations

20.

Vos, Joeri De. (1973). Revue générale de Droit International Public. The Military Law and the Law of War Review. 12(2). 388–389. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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