E. Kunnen

867 citations

50 papers · 463 indexed · h-index 12

Impact in

Electrical and Electronic Engineering top 10%
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon and Solar Cell Technologies
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability

Papers in

Electronic, Optical and Magnetic Materials 17
- Copper Interconnects and Reliability 13
Electrical and Electronic Engineering 40
- Semiconductor materials and devices 28
- Advancements in Semiconductor Devices and Circuit Design 16
- Advancements in Photolithography Techniques 9
- Radio Frequency Integrated Circuit Design 6
- Integrated Circuits and Semiconductor Failure Analysis 4

Co-authors: B. Degroote Mikhaı̈l R. Baklanov Bartek Pawlak Ray Duffy R.G.R. Weemaes Denis Shamiryan M.J.H. van Dal M. Kaiser
Journals: Microelectronic Engineering (7 papers)Thin Solid Films (3 papers)Japanese Journal of Applied Physics (2 papers)IEEE Electron Device Letters (2 papers)Physica B Condensed Matter (2 papers)
Partner nations: Belgium Netherlands Germany

In The Last Decade

E. Kunnen

46 papers receiving 446 citations

Peers

Countries citing papers authored by E. Kunnen

Since Specialization

Citations

This map shows the geographic impact of E. Kunnen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Kunnen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Kunnen more than expected).

Fields of papers citing papers by E. Kunnen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Kunnen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Kunnen. The network helps show where E. Kunnen may publish in the future.

Co-authorship network

The 25 scholars most cited alongside E. Kunnen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with E. Kunnen Line = papers co-authored together E. Kunnen links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal S. G., Hao Yu, Marc Schaekers, S. Demuynck, G. Mannaert, E. Kunnen, Erik Rosseel, Andriy Hikavyy, Aayushi Dangol, K. De Meyer, D. Mocuta, Naoto Horiguchi, G. J. Leusink, Cory S. Wajda, 秀夫戸田, Setyo Pertiwi, Kandabara Tapily, Robert D. Clark	2017	24
2	Contact module at dense gate pitch technology challenges S. Demuynck, Fadi Ghazi, E. Kunnen, Janko Versluijs, Kristof Croes, Chun-Yi Wu, Marc Schaekers, A. Peter, Nisha Jangra, Lieve Teugels, J. Bömmels	2014	4
3	Enabling interconnect scaling with Spacer-Defined Double Patterning (SDDP) Microelectronic Engineering ·Yong Kong Siew, Michele Stucchi, Janko Versluijs, Philippe Roussel, E. Kunnen, Marianna Pantouvaki, Gerald Beyer, Zsolt Tökei	2013	3
4	Metal hard-Mask Based Double Patterning for 22nm and Beyond Lirias (KU Leuven) ·Herbert Struyf, Jean‐François de Marneffe, LM Hansson, Adresse Address, C. Huffman, E. Kunnen, Frédéric Lazzarino, Alexey Milenin, Denis Shamiryan, Adam Urbanowicz, Giordanny Wilkerson Cardoso Rios, Werner Boullart	2010	1
5	Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM) Yong Kong Siew, Janko Versluijs, E. Kunnen, Ivan Ciofi, Marcelo silva de Souza Ribeiro, Harold Dekkers, Han Liu, Samuel Suhard, Andrew Cockburn, Erik Sleeckx, Els Van Besien, Herbert Struyf, Mireille Maenhoudt, K.E. Zacha, Anggi Angela, Paul Grimm, Richard P. Warfield, Gerald Beyer	2010	9
6	A 35nm diameter vertical silicon nanowire short-gate tunnelFET Open Repository and Bibliography (University of Liège) ·A. Vandooren, R. Rooyackers, Daniele Leonelli, Francesca Iacopi, Stefan De Gendt, Anja Verhulst, Marc Heyns, E. Kunnen, Ngoc Duy Nguyen, M. Demand, Patrick Ong, Amini A.A.H., Hazar Alharbi, Olivier Richard, William G. Vandenberghe, G. Groeseneken	2009	1
7	Effect of top power on a low-k film during oxygen strip in a TCP etch chamber Microelectronic Engineering ·E. Kunnen, Т. В. Рахимова, Denis Shamiryan, Herbert Struyf, Werner Boullart, Mikhaı̈l R. Baklanov	2009	1
8	Independent double-gate FinFETs with asymmetric gate stacks Microelectronic Engineering ·Meishoku Masahara, R. Surdeanu, Van Der Sand, G. Doornbos, Việt Hùng Nguyễn, G. Van den bosch, C. Vrancken, K. Devriendt, Laura Komala, E. Kunnen, E. Suzuki, M. Jurczak, S. Biesemans	2007	6
9	Spacer defined FinFET: Active area patterning of sub-20nm fins with high density Microelectronic Engineering ·B. Degroote, R. Rooyackers, T. Vandeweyer, Nadine Collaert, Werner Boullart, E. Kunnen, Denis Shamiryan, Johan Wouters, Onur Barca, Abhisek Dixit, M. Jurczak	2006	26
10	Doubling or quadrupling MuGFET fin integration scheme with higher pattern fidelity, lower CD variation and higher layout efficiency R. Rooyackers, E. Augendre, B. Degroote, Nadine Collaert, A. Nackaerts, Abhisek Dixit, T. Vandeweyer, Bartek Pawlak, Monique Ercken, E. Kunnen, С.А. Орехов, K.H.D. HALEY, Roger Loo, M. Jurczak, S. Biesemans	2006	17
11	A 205/275GHz fT/fmax Airgap Isolated 0.13 m BiCMOS Technology featuring on-chip High Quality Passives Stefaan Van Huylenbroeck, Eleonora D'Arnese, A. Sibaja-Hernandez, Josué Antunes de Macêdo, D. Linten, M. Dehan, Leonhard Dobusch, G. Carchon, Karishma Khoja, E. Kunnen, Philippe Leray, K. Devriendt, Kemin Wang, Roger Loo, Teixoira Vp, Stefaan Decoutere	2006	5
12	Requirements on CD and overlay for 200 GHz QSA SiGe:C HBTs Remigiusz Denda, Liesbeth Witters, Stefaan Van Huylenbroeck, Philippe Leray, 胡小岩, E. Kunnen, Stefaan Decoutere	2004	1
13	Lateral and vertical scaling of a QSA HBT for a 0.13μm 200GHz SiGe:C BiCMOS technology Stefaan Van Huylenbroeck, A. Sibaja-Hernandez, Josué Antunes de Macêdo, T. Somers, Joseph Billioud, Ricky Luppino, Karishma Khoja, Remigiusz Denda, Van Der Sand, E. Kunnen, Philippe Leray, K. Devriendt, Xiaodong Shi, Roger Loo, Stefaan Decoutere	2004	9
14	Implementation of a Si-rich SiON nucleation layer for an improved selective SiGe HBT architecture Stefaan Van Huylenbroeck, Roger Loo, Stefaan Decoutere, Karishma Khoja, E. Kunnen, Marc Schaekers, Matty Caymax	2003	1
15	Influence of strain on the anti-ferromagnetic ordering in epitaxial Cr(001) films on MgO Thin Solid Films ·E. Kunnen, S. Mangin, V. V. Moshchalkov, Y. Bruynseraede, A. Vantomme, A. Hoser, K. Temst	2002	11
16	Observation of the bulk spin-flop in an Fe/Cr superlattice Journal of Magnetism and Magnetic Materials ·L. Bottyán, L. Deák, J. Dekoster, E. Kunnen, G. Langouche, Johan Meersschaut, M. Major, D. L. Nagy, H. D. Rüter, E. Szilágyi, K. Temst	2002	9
17	Magnetic order and the spin-flop transition in Fe/Cr superlattices Physica B Condensed Matter ·K. Temst, E. Kunnen, V. V. Moshchalkov, H. Maletta, H. Fritzsche, Y. Bruynseraede	2000	11
18	Characterization of granular Ag films grown by low-energy cluster beam deposition Thin Solid Films ·W. Bouwen, E. Kunnen, K. Temst, P. Thoen, M. J. Van Bael, F. Vanhoutte, H. Weidele, Peter Lievens, R. E. Silverans	1999	22
19	Periodic enhancement of the electron-electron interactions and the magnetoresistance in magnetic Co/(Cr/Ag)/Co multilayers APS ·Y. Bruynseraede, F. G. Aliev, E. Kunnen, K. Temst, G. Verbanck, V. V. Moshchalkov	1997	0
20	Epitaxially grown superlattices Thin Solid Films ·G. Gładyszewski, K. Temst, R. Schad, P. Beliën, E. Kunnen, G. Verbanck, Melanie Caban	1996	2

About E. Kunnen

E. Kunnen is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Condensed Matter Physics, General Materials Science and Atomic and Molecular Physics, and Optics, having authored 50 papers that have together received 463 indexed citations. Recurring topics across this work include Semiconductor materials and devices (28 papers), Advancements in Semiconductor Devices and Circuit Design (16 papers), Copper Interconnects and Reliability (13 papers), Advancements in Photolithography Techniques (9 papers), Magnetic properties of thin films (7 papers), Radio Frequency Integrated Circuit Design (6 papers), Metal and Thin Film Mechanics (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (371 citations), Electronic, Optical and Magnetic Materials (87 citations), Condensed Matter Physics (40 citations), Atomic and Molecular Physics, and Optics (95 citations) and Materials Chemistry (108 citations). E. Kunnen has collaborated with scholars based in Belgium, Netherlands and Germany. Frequent co-authors include B. Degroote, Mikhaı̈l R. Baklanov, Bartek Pawlak, Ray Duffy, R.G.R. Weemaes, Denis Shamiryan, M.J.H. van Dal, M. Kaiser, M. Jurczak and Werner Boullart. Their work appears in journals such as Microelectronic Engineering, Thin Solid Films, Japanese Journal of Applied Physics, IEEE Electron Device Letters and Physica B Condensed Matter.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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