Samuel Suhard

583 total citations
48 papers, 355 citations indexed

About

Samuel Suhard is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Samuel Suhard has authored 48 papers receiving a total of 355 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 20 papers in Biomedical Engineering and 8 papers in Automotive Engineering. Recurrent topics in Samuel Suhard's work include 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers) and Nanofabrication and Lithography Techniques (10 papers). Samuel Suhard is often cited by papers focused on 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers) and Nanofabrication and Lithography Techniques (10 papers). Samuel Suhard collaborates with scholars based in Belgium, United States and France. Samuel Suhard's co-authors include Eric Beyne, Alain Phommahaxay, Gerald Beyer, Pieter Bex, Koen Kennes, Fumihiro Inoue, John Slabbekoorn, Andy Miller, Sylviane Sabo‐Etienne and M. Mauzac and has published in prestigious journals such as Journal of Applied Physics, Chemistry of Materials and Chemical Communications.

In The Last Decade

Samuel Suhard

44 papers receiving 338 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Samuel Suhard Belgium	12	268	95	55	46	43	48	355
M. J. Wolf Germany	13	540 2.0×	126 1.3×	82 1.5×	49 1.1×	20 0.5×	41	606
Nobutoshi Fujii Japan	13	425 1.6×	92 1.0×	37 0.7×	195 4.2×	60 1.4×	34	513
E.B. Liao Singapore	14	465 1.7×	157 1.7×	80 1.5×	38 0.8×	14 0.3×	35	530
Kai-Cheng Shie Taiwan	10	257 1.0×	39 0.4×	29 0.5×	109 2.4×	22 0.5×	25	301
Byoung-Chul Shin South Korea	12	173 0.6×	48 0.5×	26 0.5×	40 0.9×	43 1.0×	22	336
Akitsu Shigetou Japan	13	562 2.1×	172 1.8×	120 2.2×	141 3.1×	20 0.5×	54	638
Rozalia Beica United States	8	305 1.1×	60 0.6×	38 0.7×	47 1.0×	13 0.3×	25	321
Wei-Lan Chiu Taiwan	10	246 0.9×	46 0.5×	57 1.0×	74 1.6×	27 0.6×	43	290
Haksun Lee South Korea	7	349 1.3×	48 0.5×	34 0.6×	14 0.3×	15 0.3×	20	454
Ying Ying Lim Singapore	9	262 1.0×	69 0.7×	33 0.6×	24 0.5×	6 0.1×	39	305

Countries citing papers authored by Samuel Suhard

Since Specialization

Citations

This map shows the geographic impact of Samuel Suhard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Samuel Suhard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Samuel Suhard more than expected).

Fields of papers citing papers by Samuel Suhard

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Samuel Suhard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Samuel Suhard. The network helps show where Samuel Suhard may publish in the future.

Co-authorship network of co-authors of Samuel Suhard

This figure shows the co-authorship network connecting the top 25 collaborators of Samuel Suhard. A scholar is included among the top collaborators of Samuel Suhard based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Samuel Suhard. Samuel Suhard is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kennes, Koen, Dieter Cuypers, B. Ralph Chou, et al.. (2025). Evaluation of warpage tolerance of 100 μm dies to achieve void-free bond and 100% assembly yield. 1–3.

Bex, Pieter, Alain Phommahaxay, Koen Kennes, et al.. (2024). Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding. IMAPSource Proceedings. 2023(Symposium). 2 indexed citations

Kennes, Koen, Samuel Suhard, Jaber Derakhshandeh, et al.. (2023). Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers. 1584–1589. 2 indexed citations

Suhard, Samuel, Koen Kennes, Pieter Bex, et al.. (2021). Demonstration of a collective hybrid die-to-wafer integration using glass carrier. 2064–2070. 14 indexed citations

Suhard, Samuel, Alain Phommahaxay, Koen Kennes, et al.. (2020). Demonstration of a collective hybrid die-to-wafer integration. 1315–1321. 12 indexed citations

Kennes, Koen, Alain Phommahaxay, Samuel Suhard, et al.. (2020). Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer. 296–302. 18 indexed citations

Arimura, Hiroaki, Harold Dekkers, Lars‐Åke Ragnarsson, et al.. (2019). Record Gm_SAT/SS_SAT and PBTI Reliability in Si-Passivated Ge nFinFETs by Improved Gate-Stack Surface Preparation. IEEE Transactions on Electron Devices. 66(12). 5387–5392. 4 indexed citations

Phommahaxay, Alain, Samuel Suhard, Pieter Bex, et al.. (2019). Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems. 607–613. 34 indexed citations

Derakhshandeh, Jaber, Lin Hou, Eric Beyne, et al.. (2016). 3D stacking using bump-less process for sub 10 µm pitches. 128–133. 1 indexed citations

10.

Derakhshandeh, Jaber, Lin Hou, Samuel Suhard, et al.. (2016). Die to wafer 3D stacking for below 10um pitch microbumps. 1–4. 9 indexed citations

11.

Suhard, Samuel, et al.. (2016). Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring. 107–110. 1 indexed citations

12.

Derakhshandeh, Jaber, Lin Hou, N. Heylen, et al.. (2016). 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects. 128–133. 23 indexed citations

13.

Suhard, Samuel, et al.. (2014). Scaling the 3D Bumps Pitch from 20 to 10 μm, Focusing on the Wet Cu Seed Etch Process Development. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 219. 237–240. 1 indexed citations

14.

Suhard, Samuel, et al.. (2012). ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 187. 223–226. 1 indexed citations

15.

Suhard, Samuel, K. Vandersmissen, Patrick Jaenen, et al.. (2012). 3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers. 1–5. 1 indexed citations

16.

Suhard, Samuel, Ian H. Brown, Martine Claes, et al.. (2012). Development of Integrated Wet Cleans for 3D-SIC Technologies. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 195. 150–153. 2 indexed citations

17.

Suhard, Samuel, Pierre Fau, Bruno Chaudret, et al.. (2009). When Energetic Materials, PDMS-Based Elastomers, and Microelectronic Processes Work Together: Fabrication of a Disposable Microactuator. Chemistry of Materials. 21(6). 1069–1076. 7 indexed citations

18.

Suhard, Samuel, Carole Rossi, D. Estève, et al.. (2008). A microactuator based on the decomposition of an energetic material for disposable lab-on-chip applications: fabrication and test. Journal of Micromechanics and Microengineering. 19(1). 15006–15006. 38 indexed citations

19.

Suhard, Samuel, et al.. (2008). Heterometallic Werner complexes as energetic materials. Dalton Transactions. 2725–2725. 7 indexed citations

20.

Dyer, Philip W., et al.. (2005). Sterically-controlled regioselective para-substitutions of aniline. Chemical Communications. 3835–3835. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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