J. Gill

1.4k total citations
46 papers, 801 citations indexed

About

J. Gill is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering. According to data from OpenAlex, J. Gill has authored 46 papers receiving a total of 801 indexed citations (citations by other indexed papers that have themselves been cited), including 40 papers in Electrical and Electronic Engineering, 23 papers in Electronic, Optical and Magnetic Materials and 13 papers in Automotive Engineering. Recurrent topics in J. Gill's work include Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (22 papers) and Electronic Packaging and Soldering Technologies (18 papers). J. Gill is often cited by papers focused on Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (22 papers) and Electronic Packaging and Soldering Technologies (18 papers). J. Gill collaborates with scholars based in United States, United Kingdom and Germany. J. Gill's co-authors include Jonathan Ε. H. Buston, Daniel Howard, Jennifer X. Wen, T. Sullivan, Ahmed Abaza, Brian Cooper, C. Christiansen, F. Chen, Haodong Chen and P. McLaughlin and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Journal of Power Sources.

In The Last Decade

J. Gill

42 papers receiving 768 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Gill United States 15 716 351 322 50 46 46 801
Ian Hunt United Kingdom 7 939 1.3× 813 2.3× 38 0.1× 27 0.5× 15 0.3× 9 1.0k
Jici Wen China 9 192 0.3× 148 0.4× 36 0.1× 12 0.2× 11 0.2× 24 330
Jieli Li China 6 765 1.1× 84 0.2× 200 0.6× 8 0.2× 4 0.1× 10 844
Cheryl Selvanayagam Singapore 14 733 1.0× 114 0.3× 49 0.2× 11 0.2× 13 0.3× 39 790
R.L. Spyker United States 11 323 0.5× 287 0.8× 224 0.7× 7 0.1× 5 0.1× 22 542
Stephanie Golmon United States 5 346 0.5× 275 0.8× 48 0.1× 5 0.1× 9 0.2× 6 406
Uwe Scheuermann Germany 18 1.6k 2.2× 78 0.2× 48 0.1× 21 0.4× 10 0.2× 29 1.6k
Olayiwola Alatise United Kingdom 24 2.2k 3.1× 89 0.3× 50 0.2× 22 0.4× 13 0.3× 151 2.3k

Countries citing papers authored by J. Gill

Since Specialization
Citations

This map shows the geographic impact of J. Gill's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Gill with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Gill more than expected).

Fields of papers citing papers by J. Gill

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Gill. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Gill. The network helps show where J. Gill may publish in the future.

Co-authorship network of co-authors of J. Gill

This figure shows the co-authorship network connecting the top 25 collaborators of J. Gill. A scholar is included among the top collaborators of J. Gill based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Gill. J. Gill is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Buston, Jonathan Ε. H., et al.. (2025). Failure gas analysis of lithium–nickel–cobalt–aluminium oxide cells from different manufacturers. RSC Advances. 15(7). 5084–5095. 2 indexed citations
2.
Buston, Jonathan Ε. H., et al.. (2023). Experimental study of three commercially available 18650 lithium ion batteries using multiple abuse methods. Journal of Energy Storage. 65. 107293–107293. 25 indexed citations
3.
Buston, Jonathan Ε. H., et al.. (2023). Experimental determination of metals generated during the thermal failure of lithium ion batteries. Energy Advances. 2(1). 170–179. 9 indexed citations
4.
Chen, Haodong, et al.. (2020). An experimental study on thermal runaway characteristics of lithium-ion batteries with high specific energy and prediction of heat release rate. Journal of Power Sources. 472. 228585–228585. 97 indexed citations
5.
Gill, J., et al.. (2019). Explosions in Electrical Control Boxes as a Potential “Nested Bang-Box” Mechanism for Severe Vapour Cloud Explosions. White Rose Research Online (University of Leeds, The University of Sheffield, University of York). 1 indexed citations
6.
Gill, J.. (2016). Clad In Steel: The Evolution of Plate Armor in Medieval Europe and its Relation to Contemporary Weapons Development. Sound Ideas (University of Puget Sound). 1 indexed citations
7.
Ahsan, Ishtiaq, Geng Han, J. G. Bolton, et al.. (2010). Use of print-simulations in accelerated yield learning for 22nm BEOL technology. 284–287.
8.
Lustig, N., J. Gill, R. G. Filippi, et al.. (2010). A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4). 1–3. 1 indexed citations
9.
Jiang, Lijun, Seshadri Kolluri, E. G. Colgan, et al.. (2008). Thermal modeling of on-chip interconnects and 3D packaging using EM tools. The HKU Scholars Hub (University of Hong Kong). 19. 279–282. 11 indexed citations
10.
Fischer, A., Oliver Aubel, J. Gill, et al.. (2007). Reliability Challenges in Copper Metallizations arising with the PVD Resputter Liner Engineering for 65nm and Beyond. 511–515. 11 indexed citations
11.
Gambino, Jeff, et al.. (2007). Reliability of Cu Interconnects with Ta Implant. 81. 22–24. 2 indexed citations
12.
13.
Christiansen, C., et al.. (2006). Via-Depletion Electromigration in Copper Interconnects. IEEE Transactions on Device and Materials Reliability. 6(2). 163–168. 20 indexed citations
14.
Iijima, Takashi, Qinghuang Lin, Catherine B. Labelle, et al.. (2006). BEOL Integration of Highly Damage -Resistant Porous Ultra Low-K Material Using Direct CMP and Via-first Process. 21–23. 4 indexed citations
15.
Gambino, J., et al.. (2006). Yield and Reliability of Cu Capped with CoWP using a Self-Activated Process. 163. 30–32. 3 indexed citations
16.
Li, Baozhen, et al.. (2006). Application of three-parameter lognormal distribution in EM data analysis. Microelectronics Reliability. 46(12). 2049–2055. 8 indexed citations
17.
Li, Baozhen, J. Gill, C. Christiansen, Timothy D. Sullivan, & P. McLaughlin. (2005). Impact of via-line contact on CU interconnect electromigration performance. 24–30. 19 indexed citations
18.
Edelstein, D., A. Cowley, J. Gill, et al.. (2005). Extendibility of PVD barrier/seed for BEOL Cu metallization. 135–137. 2 indexed citations
19.
Watson, K., Chen Fen, J. Gill, et al.. (2004). Characterization and reliability of TaN thin film resistors. 502–508. 21 indexed citations
20.
Gill, J., et al.. (2003). Predicting thermal behavior of interconnects. 54–60. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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