Cyprian Uzoh

2.4k total citations · 1 hit paper
34 papers, 1.9k citations indexed

About

Cyprian Uzoh is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Cyprian Uzoh has authored 34 papers receiving a total of 1.9k indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 9 papers in Biomedical Engineering. Recurrent topics in Cyprian Uzoh's work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (18 papers) and Copper Interconnects and Reliability (12 papers). Cyprian Uzoh is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (18 papers) and Copper Interconnects and Reliability (12 papers). Cyprian Uzoh collaborates with scholars based in United States. Cyprian Uzoh's co-authors include John Dukovic, Jean Horkans, P. C. Andricacos, Hariklia Deligianni, J.P. Hummel, C.‐K. Hu, B. M. Luther, D.J. Pearson, F. B. Kaufman and Guilian Gao and has published in prestigious journals such as Journal of The Electrochemical Society, Thin Solid Films and MRS Bulletin.

In The Last Decade

Cyprian Uzoh

33 papers receiving 1.7k citations

Hit Papers

Damascene copper electroplating for chip interconnections 1998 2026 2007 2016 1998 250 500 750 1000
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Damascene copper electroplating for chip interconnections
    1998 1.0k citations Cyprian Uzoh, John Dukovic et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Cyprian Uzoh United States 14 1.7k 842 527 293 254 34 1.9k
John Dukovic United States 14 1.6k 1.0× 621 0.7× 684 1.3× 261 0.9× 250 1.0× 22 1.9k
Valery M. Dubin United States 20 1.2k 0.7× 575 0.7× 696 1.3× 391 1.3× 350 1.4× 43 1.6k
P. C. Andricacos United States 17 2.2k 1.3× 919 1.1× 913 1.7× 260 0.9× 374 1.5× 43 2.5k
L. T. Romankiw United States 23 1.2k 0.7× 390 0.5× 553 1.0× 345 1.2× 515 2.0× 65 1.7k
Zsolt Tökei Belgium 26 2.3k 1.4× 1.4k 1.6× 652 1.2× 303 1.0× 510 2.0× 246 2.7k
Charles Thomas Harris United States 15 904 0.5× 320 0.4× 434 0.8× 227 0.8× 261 1.0× 60 1.4k
J.H. Klootwijk Netherlands 19 1.3k 0.8× 296 0.4× 564 1.1× 245 0.8× 186 0.7× 65 1.5k
Ying‐Chung Chen Taiwan 20 983 0.6× 178 0.2× 595 1.1× 705 2.4× 205 0.8× 140 1.6k
Bernd Löchel Germany 21 754 0.5× 128 0.2× 468 0.9× 520 1.8× 572 2.3× 56 1.3k
Mürsel Alper Türkiye 24 1.0k 0.6× 431 0.5× 676 1.3× 71 0.2× 764 3.0× 84 1.4k

Countries citing papers authored by Cyprian Uzoh

Since Specialization
Citations

This map shows the geographic impact of Cyprian Uzoh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cyprian Uzoh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cyprian Uzoh more than expected).

Fields of papers citing papers by Cyprian Uzoh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cyprian Uzoh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cyprian Uzoh. The network helps show where Cyprian Uzoh may publish in the future.

Co-authorship network of co-authors of Cyprian Uzoh

This figure shows the co-authorship network connecting the top 25 collaborators of Cyprian Uzoh. A scholar is included among the top collaborators of Cyprian Uzoh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cyprian Uzoh. Cyprian Uzoh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Mirkarimi, Laura, Cyprian Uzoh, Dominik Suwito, et al.. (2022). The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 162–167. 27 indexed citations
2.
Gao, Guilian, Laura Mirkarimi, G. G. Fountain, et al.. (2021). Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications. 383–389. 13 indexed citations
3.
Gao, Guilian, Cyprian Uzoh, Laura Mirkarimi, et al.. (2020). Die to Wafer Stacking with Low Temperature Hybrid Bonding. 589–594. 33 indexed citations
4.
Gao, Guilian, Jeremy Theil, G. G. Fountain, et al.. (2020). Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration. 1–8. 13 indexed citations
5.
Gao, Guilian, P. Mrozek, Laura Mirkarimi, et al.. (2019). Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study. 1–9. 23 indexed citations
6.
Gao, Guilian, Laura Mirkarimi, G. G. Fountain, et al.. (2018). Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding. 314–322. 30 indexed citations
7.
Lee, Bongsub, Guilian Gao, G. G. Fountain, et al.. (2018). Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications. 954–961. 2 indexed citations
8.
9.
Wang, Liang, G. G. Fountain, Bongsub Lee, et al.. (2017). Direct Bond Interconnect (DBI®) for Fine-Pitch Bonding in 3D and 2.5D Integrated Circuits. 22(1). 9 indexed citations
10.
Gao, Guilian, G. G. Fountain, Cyprian Uzoh, et al.. (2017). Development of Hybrid Bond Interconnect Technology for Die-to-Wafer and Die-to-Die Applications. 14(1).
11.
Sun, Zhuowen, Guilian Gao, Cyprian Uzoh, et al.. (2014). TSV module optimization for high performance silicon interposer. 862–867. 4 indexed citations
12.
Newman, Michael, et al.. (2012). DESIGN AND PROCESS OPTIMIZATION OF THROUGH SILICON VIA INTERPOSER FOR 3D-IC INTEGRATION. IMAPSource Proceedings. 2012(1). 268–275. 2 indexed citations
13.
Başol, Bülent M., et al.. (2006). PLANAR COPPER PLATING AND ELECTROPOLISHING TECHNIQUES. Chemical Engineering Communications. 193(7). 903–915. 5 indexed citations
14.
Wang, Tony, et al.. (2004). Characterization of copper layers grown by electrochemical mechanical deposition technique. Thin Solid Films. 478(1-2). 345–351. 9 indexed citations
15.
Burghartz, Joachim N., D. Edelstein, K.A. Jenkins, et al.. (2002). Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates. 99–102. 34 indexed citations
16.
Edelstein, D., J. Heidenreich, R. Goldblatt, et al.. (2002). Full copper wiring in a sub-0.25 μm CMOS ULSI technology. 773–776. 196 indexed citations
17.
Gignac, L., S. M. Rossnagel, Cyprian Uzoh, et al.. (1998). Extendibility of Cu Damascene to 0.1 μm Wide Interconnections. MRS Proceedings. 514. 4 indexed citations
18.
Hu, Chunhua, D. C. Edelstein, Cyprian Uzoh, & T. Sullivan. (1996). Comparison of electromigration in submicron Al(Cu) and Cu thin film lines. AIP conference proceedings. 373. 153–168. 4 indexed citations
19.
Hu, C.‐K., B. M. Luther, F. B. Kaufman, et al.. (1995). Copper interconnection integration and reliability. Thin Solid Films. 262(1-2). 84–92. 189 indexed citations
20.
Uzoh, Cyprian, et al.. (1988). Mechanical characterization of membranes for x-ray lithography masks. Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena. 6(6). 2178–2183. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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