Cyprian Uzoh
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- Copper Interconnects and Reliability 12
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- Electronic Packaging and Soldering Technologies 22
- 3D IC and TSV technologies 18
- Electrodeposition and Electroless Coatings 5
- Semiconductor materials and devices 4
- Electrochemistry top 5%
- Materials Chemistry top 10%
- Corrosion Behavior and Inhibition 4
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- Advanced Surface Polishing Techniques 7
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- Additive Manufacturing and 3D Printing Technologies 5
- Co-authors
- John DukovicJean HorkansP. C. AndricacosHariklia DeligianniJ.P. HummelC.‐K. HuB. M. LutherD.J. Pearson
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringElectrochemistry
- Journals
- Journal of The Electrochemical Society (1 paper)Thin Solid Films (2 papers)MRS Bulletin (1 paper)
- Partner nations
- United States
In The Last Decade
Cyprian Uzoh
33 papers receiving 1.7k citations
Hit Papers
Peers
Comparison fields: 5 of 54
- Electronic, Optical and Magnetic Materials 842
- Electrical and Electronic Engineering 1.7k
- Electrochemistry 178
- Materials Chemistry 527
- Atomic and Molecular Physics, and Optics 254
Countries citing papers authored by Cyprian Uzoh
This map shows the geographic impact of Cyprian Uzoh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cyprian Uzoh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cyprian Uzoh more than expected).
Fields of papers citing papers by Cyprian Uzoh
This network shows the impact of papers produced by Cyprian Uzoh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cyprian Uzoh. The network helps show where Cyprian Uzoh may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Cyprian Uzoh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 27 | |
| 2 | 2021 | 13 | |
| 3 | 2020 | 33 | |
| 4 | 2020 | 13 | |
| 5 | 2019 | 23 | |
| 6 | 2018 | 30 | |
| 7 | 2018 | 2 | |
| 8 | 2018 | 27 | |
| 9 | 2017 | 9 | |
| 10 | 2017 | 0 | |
| 11 | 2014 | 4 | |
| 12 | 2012 | 2 | |
| 13 | 2006 | 5 | |
| 14 | 2004 | 9 | |
| 15 | 2002 | 34 | |
| 16 | 2002 | 196 | |
| 17 | 1998 | 4 | |
| 18 | 1996 | 4 | |
| 19 | 1995 | 189 | |
| 20 | 1988 | 8 |
About Cyprian Uzoh
Cyprian Uzoh is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Automotive Engineering, having authored 34 papers that have together received 1.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (18 papers), Copper Interconnects and Reliability (12 papers), Advanced Surface Polishing Techniques (7 papers), Electrodeposition and Electroless Coatings (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Corrosion Behavior and Inhibition (4 papers) and Semiconductor materials and devices (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (842 citations), Electrical and Electronic Engineering (1.7k citations) and Electrochemistry (178 citations). Cyprian Uzoh has collaborated with scholars based in United States. Frequent co-authors include John Dukovic, Jean Horkans, P. C. Andricacos, Hariklia Deligianni, J.P. Hummel, C.‐K. Hu, B. M. Luther, D.J. Pearson, F. B. Kaufman and Guilian Gao. Their work appears in journals such as Journal of The Electrochemical Society, Thin Solid Films and MRS Bulletin.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.