T. Bolom
- Materials Chemistry top 10%
- Mechanics of Materials top 2%
- Mechanical Engineering top 10%
- Electrical and Electronic Engineering
- Ceramics and Composites top 10%
- Topics
- Semiconductor materials and devices (10 papers)Copper Interconnects and Reliability (8 papers)Metal and Thin Film Mechanics (7 papers)
- Partner nations
- United StatesGermanySwitzerland
In The Last Decade
T. Bolom
14 papers receiving 624 citations
Peers
Comparison fields: 5 of 39
- Materials Chemistry 521
- Mechanics of Materials 501
- Mechanical Engineering 173
- Electrical and Electronic Engineering 163
- Ceramics and Composites 72
Countries citing papers authored by T. Bolom
This map shows the geographic impact of T. Bolom's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Bolom with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Bolom more than expected).
Fields of papers citing papers by T. Bolom
This network shows the impact of papers produced by T. Bolom. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Bolom. The network helps show where T. Bolom may publish in the future.
Co-authorship network of co-authors of T. Bolom
This figure shows the co-authorship network connecting the top 25 collaborators of T. Bolom. A scholar is included among the top collaborators of T. Bolom based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Bolom. T. Bolom is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 11 | |
| 2 | 31 | |
| 3 | 3 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 11 | |
| 7 | 2 | |
| 8 | 11 | |
| 9 | 13 | |
| 10 | 4 | |
| 11 | 120 | |
| 12 | 41 | |
| 13 | 363 | |
| 14 | 25 | |
| 15 | 27 |
About T. Bolom
T. Bolom is a scholar working on Electronic, Optical and Magnetic Materials, Mechanics of Materials and Electrical and Electronic Engineering, having authored 15 papers that have together received 664 indexed citations. Recurring topics across this work include Semiconductor materials and devices (10 papers), Copper Interconnects and Reliability (8 papers) and Metal and Thin Film Mechanics (7 papers). The work is most often cited by research in Mechanics of Materials (501 citations), Ceramics and Composites (72 citations) and Materials Chemistry (521 citations). T. Bolom has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include K. Moto, Pavel Nesládek, S. Vepřek, H.-D. Männling, A. Bergmaier, G. Dollinger, D. S. Patil, C. Eggs, Heiko Hillebrandt and R. A. Deutschmann. Their work appears in journals such as Applied Physics Letters, Thin Solid Films and Japanese Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.