A. Simon

1.6k total citations
36 papers, 747 citations indexed

About

A. Simon is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, A. Simon has authored 36 papers receiving a total of 747 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 28 papers in Electronic, Optical and Magnetic Materials and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in A. Simon's work include Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (15 papers). A. Simon is often cited by papers focused on Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (15 papers). A. Simon collaborates with scholars based in United States, Switzerland and South Korea. A. Simon's co-authors include D. Edelstein, E. Liniger, C.‐K. Hu, Cyprian Uzoh, Ogooluwa Ojelabi, Julie K. De Zutter, Anthony Carruthers, H. Rathore, L. Gignac and Wei‐Tsu Tseng and has published in prestigious journals such as Journal of Biological Chemistry, Physical review. B, Condensed matter and Applied Physics Letters.

In The Last Decade

A. Simon

33 papers receiving 707 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
A. Simon United States 12 596 492 103 93 88 36 747
Xinbo Zou China 20 701 1.2× 442 0.9× 50 0.5× 245 2.6× 323 3.7× 87 1.2k
S. A. Cohen United States 16 612 1.0× 269 0.5× 163 1.6× 179 1.9× 148 1.7× 47 793
T. Okuyama Japan 11 408 0.7× 158 0.3× 9 0.1× 133 1.4× 55 0.6× 34 705
Jinlong Ma China 22 366 0.6× 150 0.3× 49 0.5× 152 1.6× 1.0k 11.8× 56 1.3k
Kota Tachibana Japan 13 173 0.3× 105 0.2× 128 1.2× 373 4.0× 197 2.2× 43 700
Akihiro Kawano Japan 16 311 0.5× 48 0.1× 45 0.4× 70 0.8× 231 2.6× 41 742
Jeong Hyun Moon South Korea 15 561 0.9× 142 0.3× 17 0.2× 93 1.0× 184 2.1× 64 760
Guanghao Li China 10 380 0.6× 356 0.7× 6 0.1× 49 0.5× 123 1.4× 23 869
L.Q. Zhu China 14 501 0.8× 131 0.3× 37 0.4× 50 0.5× 343 3.9× 23 636
M. S. Feng Taiwan 9 182 0.3× 40 0.1× 23 0.2× 111 1.2× 72 0.8× 15 312

Countries citing papers authored by A. Simon

Since Specialization
Citations

This map shows the geographic impact of A. Simon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Simon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Simon more than expected).

Fields of papers citing papers by A. Simon

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. Simon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Simon. The network helps show where A. Simon may publish in the future.

Co-authorship network of co-authors of A. Simon

This figure shows the co-authorship network connecting the top 25 collaborators of A. Simon. A scholar is included among the top collaborators of A. Simon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. Simon. A. Simon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Edelstein, D., S. Nguyen, Huai Huang, et al.. (2024). The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology. 1–4.
2.
Li, Ning, Charles Mackin, An Chen, et al.. (2023). Optimization of Projected Phase Change Memory for Analog In‐Memory Computing Inference. Advanced Electronic Materials. 9(6). 5 indexed citations
3.
Philip, Timothy M., Kevin Brew, Ning Li, et al.. (2022). Design of projected phase-change memory mushroom cells for low-resistance drift. MRS Bulletin. 48(3). 228–236. 3 indexed citations
4.
Ojelabi, Ogooluwa, et al.. (2016). WZB117 (2-Fluoro-6-(m-hydroxybenzoyloxy) Phenyl m-Hydroxybenzoate) Inhibits GLUT1-mediated Sugar Transport by Binding Reversibly at the Exofacial Sugar Binding Site. Journal of Biological Chemistry. 291(52). 26762–26772. 91 indexed citations
5.
Neubert, Thomas A., et al.. (2015). Deposition of Complex Optical Interference Filters on Polymer Substrates by Magnetron Sputtering and PECVD Processes. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 58. 275–280. 1 indexed citations
6.
Nag, Joyeeta, et al.. (2015). Non-Contact, Sub-Surface Detection of Alloy Segregation in Back-End of Line Copper Dual-Damascene Structures. IEEE Transactions on Semiconductor Manufacturing. 28(4). 469–473.
7.
Hu, Chao, Chris Breslin, E‐Wen Huang, et al.. (2014). Microstructure, impurity and metal cap effects on Cu electromigration. AIP conference proceedings. 67–78. 8 indexed citations
8.
9.
Priyadarshini, Deepika, S. Nguyen, H. Shobha, et al.. (2014). Advanced metal and dielectric barrier cap films for Cu low k interconnects. 185–188. 11 indexed citations
10.
11.
Hu, Chunhua, Lynne Gignac, Chris Breslin, et al.. (2012). Electromigration in Cu(Al) and Cu(Mn) damascene lines. Journal of Applied Physics. 111(9). 40 indexed citations
12.
Chen, F., M. Shinosky, J. Aitken, et al.. (2011). Invasion percolation model for abnormal TDDB characteristic of ULK dielectrics with Cu interconnect at advanced technology nodes. 2F.2.1–2F.2.8. 5 indexed citations
13.
Simon, A., F.H. Baumann, T. Bolom, et al.. (2010). Effect of TaN Stoichiometry on Barrier Oxidation and Defect Density in 32nm Cu/Ultra-Low K Interconnects. MRS Proceedings. 1249. 1 indexed citations
14.
Lustig, N., J. Gill, R. G. Filippi, et al.. (2010). A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4). 1–3. 1 indexed citations
15.
Ieong, M., C.Y. Sung, Sameer Deshpande, et al.. (2006). Lower Resistance Scaled Metal Contacts to Silicide for Advanced CMOS. S. Cohen–L. Deligianni. 2 indexed citations
16.
Edelstein, D., A. Cowley, J. Gill, et al.. (2005). Extendibility of PVD barrier/seed for BEOL Cu metallization. 135–137. 2 indexed citations
17.
Canaperi, D., L. Gignac, S. Kaldor, et al.. (2005). Electromigration Cu mass flow in Cu interconnections. Thin Solid Films. 504(1-2). 274–278. 27 indexed citations
18.
Hu, Chunhua, D. Canaperi, Lynne Gignac, et al.. (2004). Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects. 222–228. 37 indexed citations
19.
Gribelyuk, M., et al.. (2002). Microstructure evolution of electroplated Cu during room temperature transient. 188–190. 1 indexed citations
20.
Simon, A., et al.. (1992). Excitonic phase diagram in unstressed Ge. Physical review. B, Condensed matter. 46(16). 10098–10112. 12 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Xinbo Zou Breakdown of academic impact, for papers by S. A. Cohen Breakdown of academic impact, for papers by T. Okuyama Breakdown of academic impact, for papers by Jinlong Ma Breakdown of academic impact, for papers by Kota Tachibana Breakdown of academic impact, for papers by Akihiro Kawano Breakdown of academic impact, for papers by Jeong Hyun Moon Breakdown of academic impact, for papers by Guanghao Li Breakdown of academic impact, for papers by L.Q. Zhu Breakdown of academic impact, for papers by M. S. Feng
Rankless by CCL
2026