F. Chen

740 total citations
21 papers, 446 citations indexed

About

F. Chen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, F. Chen has authored 21 papers receiving a total of 446 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 1 paper in Mechanics of Materials. Recurrent topics in F. Chen's work include Semiconductor materials and devices (20 papers), Copper Interconnects and Reliability (17 papers) and Electronic Packaging and Soldering Technologies (9 papers). F. Chen is often cited by papers focused on Semiconductor materials and devices (20 papers), Copper Interconnects and Reliability (17 papers) and Electronic Packaging and Soldering Technologies (9 papers). F. Chen collaborates with scholars based in United States, Germany and South Korea. F. Chen's co-authors include J. Aitken, O. Martı́nez, P. McLaughlin, M. Shinosky, J. Gill, J. R. Lloyd, T. Sullivan, Kaushik Chanda, D. Harmon and C. Kothandaraman and has published in prestigious journals such as IEEE Electron Device Letters, Microelectronics Reliability and Microelectronic Engineering.

In The Last Decade

F. Chen

21 papers receiving 433 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
F. Chen United States	12	429	264	35	34	32	21	446
Geraldine Jamieson Belgium	11	319 0.7×	125 0.5×	81 2.3×	49 1.4×	51 1.6×	26	345
K. Vandersmissen Belgium	12	391 0.9×	159 0.6×	75 2.1×	78 2.3×	52 1.6×	27	417
D. Bouchu France	11	267 0.6×	105 0.4×	18 0.5×	39 1.1×	33 1.0×	33	294
Patrick Justison United States	13	439 1.0×	305 1.2×	24 0.7×	21 0.6×	27 0.8×	45	454
M. Assous France	14	401 0.9×	146 0.6×	21 0.6×	68 2.0×	31 1.0×	45	433
Oliver Aubel Germany	11	315 0.7×	270 1.0×	32 0.9×	22 0.6×	29 0.9×	45	357
L.L. Chapelon France	11	257 0.6×	128 0.5×	19 0.5×	41 1.2×	43 1.3×	25	291
B. Eyckens Belgium	6	346 0.8×	112 0.4×	22 0.6×	58 1.7×	39 1.2×	9	384
S. Luce United States	6	259 0.6×	146 0.6×	38 1.1×	53 1.6×	40 1.3×	11	300
D. Roy France	14	660 1.5×	94 0.4×	41 1.2×	13 0.4×	58 1.8×	83	678

Countries citing papers authored by F. Chen

Since Specialization

Citations

This map shows the geographic impact of F. Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. Chen more than expected).

Fields of papers citing papers by F. Chen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by F. Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. Chen. The network helps show where F. Chen may publish in the future.

Co-authorship network of co-authors of F. Chen

This figure shows the co-authorship network connecting the top 25 collaborators of F. Chen. A scholar is included among the top collaborators of F. Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with F. Chen. F. Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Rosa, Giuseppe La, F. Chen, C. Kothandaraman, et al.. (2015). Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability. 4C.1.1–4C.1.8. 3 indexed citations

Chen, F., et al.. (2015). Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges. Microelectronics Reliability. 55(12). 2727–2747. 18 indexed citations

Muralidhar, R., T. M. Shaw, F. Chen, et al.. (2014). TDDB at low voltages: An electrochemical perspective. 203. BD.3.1–BD.3.7. 3 indexed citations

Chen, F., et al.. (2013). A correlation study of MOL electrical test method with its physical analysis. 217–220. 6 indexed citations

Yang, C.-C., F. Chen, H. Shobha, et al.. (2012). In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects. 1–3. 3 indexed citations

Chen, F., M. Shinosky, J. Aitken, et al.. (2011). Invasion percolation model for abnormal TDDB characteristic of ULK dielectrics with Cu interconnect at advanced technology nodes. 2F.2.1–2F.2.8. 5 indexed citations

Landers, W., C. Kothandaraman, Paul Andry, et al.. (2011). 3D copper TSV integration, testing and reliability. 52. 7.1.1–7.1.4. 91 indexed citations

Yang, C.-C., et al.. (2011). Co capping layers for Cu/low-k interconnects. Microelectronic Engineering. 92. 79–82. 14 indexed citations

Yang, C.-C., et al.. (2010). Enhanced Via Integration Process for Copper/Ultralow- $k$ Interconnects. IEEE Electron Device Letters. 31(4). 347–349. 13 indexed citations

10.

Chen, F., M. Shinosky, J. Gambino, et al.. (2009). Critical ultra low-k TDDB reliability issues for advanced CMOS technologies. 464–475. 18 indexed citations

11.

He, Zhenyu, R. Bolam, F. Chen, et al.. (2008). High and low density complimentary MIM capacitors fabricated simultaneously in advanced RFCMOS and BiCMOS technologies. 212–215. 2 indexed citations

12.

Chen, F., O. Martı́nez, D. Harmon, M. Shinosky, & J. Aitken. (2008). Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies. Microelectronics Reliability. 48(8-9). 1375–1383. 37 indexed citations

13.

Chen, F., J. R. Lloyd, Kaushik Chanda, et al.. (2008). Line edge roughness and spacing effect on low-k TDDB characteristics. 132–137. 34 indexed citations

14.

Fischer, A., Oliver Aubel, J. Gill, et al.. (2007). Reliability Challenges in Copper Metallizations arising with the PVD Resputter Liner Engineering for 65nm and Beyond. 511–515. 11 indexed citations

15.

Chen, F., P. McLaughlin, J. Gambino, et al.. (2007). The Effect of Metal Area and Line Spacing on TDDB Characteristics of 45nm Low-k SiCOH Dielectrics. 47. 382–389. 26 indexed citations

16.

Chen, F., A. Fischer, J. Gill, et al.. (2006). Reliability Characterization of BEOL Vertical Natural Capacitor using Copper and Low-k SiCOH Dielectric for 65nm RF and Mixed-Signal Applications. 490–495. 13 indexed citations

17.

Chen, F., O. Martı́nez, Kaushik Chanda, et al.. (2006). A Comprehensive Study of Low-k SiCOH TDDB Phenomena and Its Reliability Lifetime Model Development. 46–53. 119 indexed citations

18.

Chen, F., J. Gill, D. Harmon, et al.. (2005). Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures. Microelectronics Reliability. 46(2-4). 232–243. 8 indexed citations

19.

Gambino, Jeff, et al.. (2005). Thermal Oxidation of Cu Interconnects Capped with CoWP. MRS Proceedings. 863. 2 indexed citations

20.

Chen, F., J. Gill, D. Harmon, et al.. (2004). Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics. 68–73. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact