P. Flaitz
- Metals and Alloys top 10%
- Ceramics and Composites top 10%
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- Copper Interconnects and Reliability 13
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- Semiconductor materials and devices 12
- Electronic Packaging and Soldering Technologies 6
- Advancements in Photolithography Techniques 4
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- Semiconductor materials and interfaces 4
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- Metal and Thin Film Mechanics 4
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- Advanced Materials Characterization Techniques 4
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- Electron and X-Ray Spectroscopy Techniques 3
P. Flaitz
29 papers receiving 579 citations
Peers
Comparison fields: 5 of 44
- Metals and Alloys 39
- Ceramics and Composites 75
- Electronic, Optical and Magnetic Materials 163
- Structural Biology 9
- Materials Chemistry 273
Countries citing papers authored by P. Flaitz
This map shows the geographic impact of P. Flaitz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. Flaitz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. Flaitz more than expected).
Fields of papers citing papers by P. Flaitz
This network shows the impact of papers produced by P. Flaitz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. Flaitz. The network helps show where P. Flaitz may publish in the future.
Co-authorship network
The 25 scholars most cited alongside P. Flaitz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 1 | |
| 2 | 2014 | 2 | |
| 3 | 2013 | 1 | |
| 4 | 2013 | 1 | |
| 5 | 2013 | 2 | |
| 6 | 2011 | 2 | |
| 7 | 2010 | 1 | |
| 8 | 2010 | 30 | |
| 9 | 2009 | 39 | |
| 10 | 2009 | 22 | |
| 11 | 2008 | 28 | |
| 12 | 2008 | 23 | |
| 13 | 2008 | 1 | |
| 14 | 2008 | 43 | |
| 15 | 2007 | 1 | |
| 16 | 2007 | 49 | |
| 17 | 2007 | 2 | |
| 18 | 2005 | 2 | |
| 19 | 1987 | 86 | |
| 20 | SOME ASPECTS OF LIQUID PHASE SINTERING OF ALUMINA | 1982 | 5 |
About P. Flaitz
P. Flaitz is a scholar working on Electronic, Optical and Magnetic Materials, Surfaces, Coatings and Films and Electrical and Electronic Engineering, having authored 29 papers that have together received 605 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (12 papers), Electronic Packaging and Soldering Technologies (6 papers), Advancements in Photolithography Techniques (4 papers), Semiconductor materials and interfaces (4 papers), Metal and Thin Film Mechanics (4 papers), Advanced Materials Characterization Techniques (4 papers) and Electron and X-Ray Spectroscopy Techniques (3 papers). The work is most often cited by research in Metals and Alloys (39 citations), Ceramics and Composites (75 citations) and Electronic, Optical and Magnetic Materials (163 citations). P. Flaitz has collaborated with scholars based in United States, Switzerland and Japan. Frequent co-authors include Joseph A. Pask, Paul Ronsheim, Keith Thompson, Thomas F. Kelly, David J. Larson, E. Liniger, R. Yu, B. G. Baker, L. Gignac and C.-C. Yang. Their work appears in journals such as IEEE Electron Device Letters, Journal of Applied Physics, Microelectronic Engineering, Applied Surface Science and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.