C.-C. Yang
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- Copper Interconnects and Reliability 32
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- Semiconductor materials and devices 28
- Electronic Packaging and Soldering Technologies 21
- 3D IC and TSV technologies 4
- Electrodeposition and Electroless Coatings 3
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- Metal and Thin Film Mechanics 5
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- Semiconductor materials and interfaces 5
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- Aluminum Alloy Microstructure Properties 1
- Co-authors
- D. EdelsteinC. ChristiansenT. NogamiBaozhen LiD. BadamiSidney CohenT. M. ShawR. Rosenberg
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringProcess Chemistry and Technology
- Journals
- IEEE Electron Device Letters (13 papers)Applied Physics Letters (3 papers)Macromolecules (1 paper)
- Partner nations
- United StatesSwitzerlandFrance
In The Last Decade
C.-C. Yang
36 papers receiving 498 citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 339
- Electrical and Electronic Engineering 435
- Process Chemistry and Technology 14
- Mechanics of Materials 70
- Atomic and Molecular Physics, and Optics 73
Countries citing papers authored by C.-C. Yang
This map shows the geographic impact of C.-C. Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.-C. Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.-C. Yang more than expected).
Fields of papers citing papers by C.-C. Yang
This network shows the impact of papers produced by C.-C. Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.-C. Yang. The network helps show where C.-C. Yang may publish in the future.
Co-authorship network
The 25 scholars most cited alongside C.-C. Yang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 17 | |
| 2 | 2017 | 5 | |
| 3 | 2016 | 4 | |
| 4 | 2015 | 2 | |
| 5 | 2014 | 60 | |
| 6 | 2014 | 11 | |
| 7 | 2013 | 9 | |
| 8 | 2013 | 31 | |
| 9 | 2012 | 8 | |
| 10 | 2012 | 3 | |
| 11 | 2012 | 12 | |
| 12 | 2011 | 8 | |
| 13 | 2010 | 69 | |
| 14 | 2010 | 5 | |
| 15 | 2010 | 13 | |
| 16 | 2010 | 3 | |
| 17 | 2009 | 12 | |
| 18 | 2008 | 1 | |
| 19 | 2007 | 39 | |
| 20 | 2006 | 2 |
About C.-C. Yang
C.-C. Yang is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Process Chemistry and Technology, having authored 36 papers that have together received 524 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (28 papers), Electronic Packaging and Soldering Technologies (21 papers), Semiconductor materials and interfaces (5 papers), Metal and Thin Film Mechanics (5 papers), 3D IC and TSV technologies (4 papers), Electrodeposition and Electroless Coatings (3 papers) and Aluminum Alloy Microstructure Properties (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (339 citations), Electrical and Electronic Engineering (435 citations) and Process Chemistry and Technology (14 citations). C.-C. Yang has collaborated with scholars based in United States, Switzerland and France. Frequent co-authors include D. Edelstein, C. Christiansen, T. Nogami, Baozhen Li, D. Badami, Sidney Cohen, T. M. Shaw, R. Rosenberg, Nicholas A. Lanzillo and Huai Huang. Their work appears in journals such as IEEE Electron Device Letters, Applied Physics Letters, Macromolecules, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films and Scripta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.