Yann Mignot

1.4k total citations
25 papers, 184 citations indexed

About

Yann Mignot is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Yann Mignot has authored 25 papers receiving a total of 184 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 7 papers in Biomedical Engineering. Recurrent topics in Yann Mignot's work include Advancements in Photolithography Techniques (17 papers), Copper Interconnects and Reliability (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (10 papers). Yann Mignot is often cited by papers focused on Advancements in Photolithography Techniques (17 papers), Copper Interconnects and Reliability (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (10 papers). Yann Mignot collaborates with scholars based in United States, Japan and Germany. Yann Mignot's co-authors include Nelson Felix, Richard A. Farrell, Kafai Lai, Daniel Corliss, Cheng Chi, Jingyun Zhang, Chi‐Chun Liu, Hsinyu Tsai, Ruilong Xie and Chun Wing Yeung and has published in prestigious journals such as Nature Electronics, Microelectronic Engineering and Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena.

In The Last Decade

Yann Mignot

22 papers receiving 177 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yann Mignot United States 6 103 93 42 40 35 25 184
Jeffrey Lille United States 3 50 0.5× 100 1.1× 29 0.7× 36 0.9× 22 0.6× 5 141
Vikram Singh India 12 289 2.8× 72 0.8× 10 0.2× 92 2.3× 35 1.0× 31 326
Paulina Rincon Delgadillo Belgium 12 188 1.8× 270 2.9× 79 1.9× 109 2.7× 56 1.6× 24 335
Diangang Hu China 5 371 3.6× 111 1.2× 9 0.2× 76 1.9× 11 0.3× 9 403
Shih‐wei Chang United States 6 215 2.1× 233 2.5× 21 0.5× 268 6.7× 24 0.7× 9 344
Anatoly G. Kolosko Russia 11 139 1.3× 247 2.7× 13 0.3× 105 2.6× 14 0.4× 71 317
Hiroo Hongo Japan 10 117 1.1× 276 3.0× 32 0.8× 108 2.7× 4 0.1× 27 350
M. Koike Japan 13 369 3.6× 140 1.5× 9 0.2× 71 1.8× 11 0.3× 34 429
C. Faulkner United States 6 346 3.4× 120 1.3× 16 0.4× 68 1.7× 22 0.6× 8 415
Kate Reidy United States 10 90 0.9× 168 1.8× 3 0.1× 41 1.0× 11 0.3× 20 230

Countries citing papers authored by Yann Mignot

Since Specialization
Citations

This map shows the geographic impact of Yann Mignot's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yann Mignot with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yann Mignot more than expected).

Fields of papers citing papers by Yann Mignot

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yann Mignot. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yann Mignot. The network helps show where Yann Mignot may publish in the future.

Co-authorship network of co-authors of Yann Mignot

This figure shows the co-authorship network connecting the top 25 collaborators of Yann Mignot. A scholar is included among the top collaborators of Yann Mignot based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yann Mignot. Yann Mignot is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Edelstein, D., S. Nguyen, Huai Huang, et al.. (2024). The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology. 1–4.
3.
Sun, Xinghua, Yann Mignot, Christopher B. Cole, et al.. (2022). In-depth feasibility study of extreme ultraviolet damascene extension: Patterning, dielectric etch, and metallization. Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena. 40(2). 2 indexed citations
4.
Ghosh, Somnath, et al.. (2020). A Study of Metal on Metal Multiple Patterning Scheme. 52. 25–27. 2 indexed citations
5.
6.
Liu, Chi‐Chun, Richard A. Farrell, Kafai Lai, et al.. (2019). Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning. 10143. 20–20. 1 indexed citations
7.
Guo, Jing, Dustin W. Janes, Yann Mignot, et al.. (2019). LCDU improvement of EUV-patterned vias with DSA. 38. 22–22. 1 indexed citations
8.
Yao, Yiping, et al.. (2018). Inorganic Hardmask Development for EUV Patterning. VII. 27–27. 2 indexed citations
9.
Liu, Chi‐Chun, Yann Mignot, Ruilong Xie, et al.. (2018). Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond. Nature Electronics. 1(10). 562–569. 110 indexed citations
10.
Silva, Anuja De, Luciana Meli, Yiping Yao, et al.. (2018). Inorganic hardmask development for extreme ultraviolet patterning. Journal of Micro/Nanolithography MEMS and MOEMS. 18(1). 1–1. 5 indexed citations
11.
Guo, Jing, Anuja De Silva, Yann Mignot, et al.. (2018). Polymer brush as adhesion promoter for EUV patterning. 10143. 17–17. 1 indexed citations
12.
Chi, Cheng, Chi‐Chun Liu, Luciana Meli, et al.. (2017). Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 10146. 101460Q–101460Q. 2 indexed citations
13.
Silva, Anuja De, Yann Mignot, Luciana Meli, et al.. (2017). Development of amorphous silicon based EUV hardmasks through physical vapor deposition. 46–46. 2 indexed citations
14.
Xu, Yongan, Ramya Viswanathan, Sean Burns, et al.. (2016). Lithographic qualification of high-transmission mask blank for 10nm node and beyond. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9780. 978006–978006. 1 indexed citations
15.
Lee, Chang‐Woo, Peng Wang, Yann Mignot, et al.. (2015). Plasma etch challenges with new EUV lithography material introduction for patterning for MOL and BEOL. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9428. 94280A–94280A. 2 indexed citations
16.
Inoue, N., Fuminori Ito, H. Shobha, et al.. (2013). UV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules. 1–3. 3 indexed citations
17.
Kim, Taesoo, Neal Lafferty, Chiew-Seng Koay, et al.. (2013). 48nm Pitch cu dual-damascene interconnects using self aligned double patterning scheme. 1–3. 4 indexed citations
18.
Mignot, Yann, M. Sankarapandian, P. Flaitz, et al.. (2012). 56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme. Microelectronic Engineering. 107. 138–144. 9 indexed citations
19.
Labelle, Catherine B., R. P. Srivastava, John Arnold, et al.. (2011). Plasma Etch Challenges for Porous Low k Materials for 32nm and Beyond. ECS Transactions. 34(1). 329–334. 2 indexed citations
20.
Mignot, Yann, et al.. (2003). Surface treatment of wire bonding metal pads. Microelectronic Engineering. 70(2-4). 558–565. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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